Patent application number | Description | Published |
20110140249 | TIE BAR AND MOLD CAVITY BAR ARRANGEMENTS FOR MULTIPLE LEADFRAME STACK PACKAGE - A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes. | 06-16-2011 |
20110140253 | DAP GROUND BOND ENHANCEMENT - A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 06-16-2011 |
20110140262 | MODULE PACKAGE WITH EMBEDDED SUBSTRATE AND LEADFRAME - An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described. | 06-16-2011 |
20130045572 | FLEXIBLE ROUTING FOR HIGH CURRENT MODULE APPLICATION - In one aspect of the invention, an integrated circuit package is described. The integrated circuit package includes a substrate formed from a dielectric material that includes multiple electrical contacts and conductive paths. An upper lead frame is attached with and underlies the substrate. The upper lead frame is electrically connected with at least one of the contacts on the substrate. The active surface of an integrated circuit die is electrically and physically coupled to the upper lead frame through multiple electrical connectors. A lower lead frame may be attached with the back surface of the integrated circuit die. A passive device is positioned on and electrically connected with one of the contacts on the substrate and/or the upper lead frame. | 02-21-2013 |
20130087901 | DESIGN FOR EXPOSED DIE PACKAGE - In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object. | 04-11-2013 |
20130127029 | TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE - A leadframe, device package, and mode of construction configured to attain a thin profile and improved thermal performance. Leadframes of this invention include a raised die attachment pad arrange above distal ends of leadframe leads. A package will further include a die electrically coupled with an underside surface of the raised die attachment pad, in one example, using ball bonds, the whole sealed in an encapsulant that exposed a bottom portion of the die and a portion of a lead. Two leadframe stacks of such packages are also disclosed as are methods of manufacture. | 05-23-2013 |
20140346656 | Multilevel Leadframe - A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad by a bond pad clearance distance. A second set of bond pads is arranged in second row adjacent the first row of bond pads. Each bond pad in the second row may be connected to one of the plurality of lead lines on the first level that is routed between adjacent bond pads in the first row. Since the bond pads in the first row are on a different level then the lead lines, the bond pads may be spaced close together. | 11-27-2014 |
20150228563 | LEAD FRAME WITH ABUTMENT SURFACE - A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface. | 08-13-2015 |
20150228581 | INTEGRATED CIRCUIT PACKAGE FABRICATION - A method of making an integrated circuit (“IC”) device includes forming a lead frame in a lead frame strip. Only portions of the lead frame are plated with a conductor. A die pad is attached to an unplated portion of said lead frame. | 08-13-2015 |