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| 20090294956 | Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof - Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin. | 12-03-2009 |
| 20090301767 | Printed circuit board and method of manufacturing the same - Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density. | 12-10-2009 |
| 20090308650 | Printed circuit board and method of manufacturing the same - The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved. | 12-17-2009 |
| 20100230146 | CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties. | 09-16-2010 |
| 20110308069 | Method of manufacturing cooling fin and package substrate with cooling fin - A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object. | 12-22-2011 |
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| 20110151201 | TRANSPARENT ELECTRODE FILM AND METHOD OF MANUFACTURING THE SAME - Disclosed is a transparent electrode film for a touch screen, which includes a transparent substrate, an assistant adhesive layer formed on each of both surfaces of the transparent substrate, and a transparent conductive polymer layer formed on the assistant adhesive layer, thus obviating a need for an optically clear adhesive film and resulting in increased transmittance and superior price competitiveness. A method of manufacturing the transparent electrode film is also provided. | 06-23-2011 |
| 20110205166 | TOUCH PANEL - Disclosed is a touch panel, which includes a transparent conductive film, electrodes printed at both ends of the transparent conductive film, and a substrate having a wiring connected to the electrodes and formed in a multilayer therein, and surrounding the transparent conductive film at the inner peripheral surface thereof, so that the use of the substrate having the wiring in multilayer form enables a plurality of wirings necessary for multi touch to be formed even under conditions of a thin bezel size, thus satisfying the trend which is reducing the size of electronic products. | 08-25-2011 |
| 20110227860 | RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen, including: a large-area touch screen formed by connecting two or more single touch screens, each including a first substrate and a second substrate which are respectively coated with transparent electrodes on one side thereof and face each other, on the same level; a plurality of first dot spacers formed on first connection parts at which the first substrates are connected with each other and supporting second connection parts at which the second substrates are connected with each other; and a plurality of second dot spacers formed on respective one sides of the first substrates excluding the first connection parts and having a lower height than the plurality of first dot spacers. The resistive touch screen is advantageous in that a large-area touch panel can be realized by connecting single touch panels on the same level. | 09-22-2011 |
| 20110254803 | METHOD FOR RECOGNIZING MULTI-TOUCH OF RESISTIVE TOUCH SCREEN - Disclosed herein is a method for recognizing a resistive touch screen. The method for recognizing the resistive touch screen includes: sensing touch generated at the resistive touch screen; calculating a difference value, a searching value by detecting voltage at two electrode wirings connected with a transparent resistive layer of the resistive touch screen; and comparing the searching value with a reference value that is a difference value between voltages detected at the two electrode wirings when the resistive touch screen is single-touched, whereby the single touch and the multi-touch can be differentiated. | 10-20-2011 |
| 20110261003 | DISPLAY DEVICE HAVING CAPACITIVE TOUCH SCREEN - Disclosed herein is a display device having a capacitive touch screen, including: a display unit; and a capacitive touch screen that is coupled to the display unit by an adhesive layer and includes a base substrate, a plurality of first electrode patterns that are formed on an active region of the base substrate, ground patterns that are formed on the active region of the base substrate and are separated from the first electrode pattern, a transparent insulating layer that covers the first electrode patterns and the ground patterns and is formed on the base substrate, and a plurality of second electrode patterns that are formed on an active region of the transparent insulating layer. | 10-27-2011 |
| 20110262631 | Method For Manufacturing One-Layer Type Capacitive Touch Screen - Disclosed herein is a method for manufacturing a one-layer type capacitive touch screen. The method for manufacturing a one-layer type capacitive touch screen includes: forming a plurality of electrode wirings made of metal in an inactive region of a base substrate; forming a plurality of first electrode patterns made of a conductive polymer and including a first sensing unit and a first connection unit in an active region of the base substrate to connect the electrode wirings; forming an insulating pattern on the plurality of first connection units of the first electrode patterns; and forming a plurality of second electrode patterns including a second sensing unit and a second connection unit and made of the conductive polymer in the active region of the base substrate to connect the electrode wirings and position the second connection unit on the insulating pattern. | 10-27-2011 |
| 20110273382 | TOUCH SCREEN HAVING ANTENNA PATTERN - Disclosed herein is a touch screen having an antenna, including: a first substrate that includes a first electrode pattern formed in an active region and a first electrode wiring formed in an inactive region disposed outside the active region and connected to the first electrode pattern; a second substrate that includes a second electrode pattern opposite to the first electrode pattern and a second electrode wiring connected to the second electrode pattern; a spacer that is formed between the first substrate and the second substrate to space the first electrode pattern from the second electrode pattern; and an antenna pattern that is formed in the inactive region. | 11-10-2011 |
| 20110279401 | ONE-LAYER CAPACITIVE TOUCH SCREEN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a one-layer capacitive touch screen and a method of manufacturing the same. The one-layer capacitive touch screen includes: a base substrate; a first electrode pattern that is formed on an upper surface of the base substrate and includes a plurality of first sensing units and first connection units connecting the adjacent first sensing units; a second electrode pattern that is formed on the upper surface of the base substrate and includes a plurality of second sensing units and second connection units connecting the adjacent second sensing units, the second connection units being formed to intersect with each other on the upper side of the first connection unit, having an air gap therebetween; and an electrode wiring that is connected to the first electrode pattern and the second electrode. | 11-17-2011 |
| 20110279402 | TOUCH SCREEN - Disclosed herein is a touch screen. The touch screen includes a transparent electrode that is formed on one surface of a first transparent substrate to sense change in capacitance at the time of a touch input; an electrode that is formed on a second transparent substrate formed on the other surface of the first transparent substrate to apply voltage to the transparent electrode; and a via that penetrates through the first transparent substrate to electrically connect the transparent electrode to the electrode. The transparent electrode and the electrode are formed on the transparent substrates at different layers, thereby reducing an inactive region. | 11-17-2011 |
| 20110285642 | Touch Screen - Disclosed herein is a touch screen that includes: a first touch screen part that is positioned on an upper part of a display to detect external contact of an input device and compute absolute coordinate information of a contact point and includes two substrates having electrodes patterns that are spaced by a spacer and face each other; and a second touch screen part that is connected with the first touch screen part to measure the change in capacitance by the external contact of the input device and compute vector coordinate information of the input device. | 11-24-2011 |
| 20120001863 | TOUCH PANEL - Disclosed herein is a touch panel, including: a transparent substrate including an active region and a bezel region partitioned thereon; a plurality of first transparent electrodes formed in the active region in parallel to each other along a Y-axis direction and including a plurality of first sensing units and a plurality of first connecting units connected with the plurality of first sensing units in an X-axis direction; a plurality of second transparent electrodes alternately formed with the plurality of first sensing units in the active region in parallel to each other along the Y-axis direction and including a plurality of second sensing units and a plurality of second connecting units connected with the plurality of first sensing units in the X-axis direction; and electrode wirings formed in the bezel region and connected to terminals of the first transparent electrodes and terminals of the second transparent electrodes, respectively. | 01-05-2012 |
| 20120007813 | TOUCH SCREEN - Disclosed herein is a touch screen, including: a base member; a plurality of electrode patterns formed on one surface of the base member, having a first directionality; electrode wirings connected to both ends of the electrode patterns; and a controller that is connected to the electrode wirings, measures the change in resistance of the electrode pattern to update reference voltage variation value, and measures charging/discharging characteristics generated from the electrode pattern when an outside touch is generated to calculate coordinate information on a touched point. | 01-12-2012 |
| 20120026101 | ELECTRIC PAPER ASSOCIATED WITH TOUCH PANEL - Disclosed herein is an electronic paper associated with a touch panel. The electronic paper | 02-02-2012 |
| 20120061017 | METHOD OF MANUFACTURING CAPACITIVE TOUCH SCREEN - Disclosed herein is a method of manufacturing a capacitive touch screen, including: forming transparent electrodes on an upper surface of a lower transparent film; forming electrode wirings on a lower surface of an upper transparent film; and bonding the transparent electrodes to the electrodes wirings to be closely adhered to each other, whereby it prevents the transparent electrodes from being damaged or deformed due to heat, thereby making it possible to improve reliability and accuracy of the manufacturing process. | 03-15-2012 |
| 20120062506 | CAPACITIVE TOUCH SCREEN - Disclosed herein is a capacitive touch screen. The capacitive touch screen is formed with a first type of electrode patterns formed in plural so as to prevent electrode wirings from being formed in a region through which images pass and a second type of electrode patterns having unique coordinate information so as to improve touch sensitivity of an outside region. | 03-15-2012 |
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| 20110008712 | Fuel Cell Having Single Body Support - Disclosed is a fuel cell having a single body support, which includes a single body support including a plurality of unit supports and a connector for connecting the plurality of unit supports in parallel, an air electrode layer formed on an outer surface of the single body support, an electrolyte layer formed on an outer surface of the air electrode layer, and a fuel electrode layer formed on an outer surface of the electrolyte layer, so that the fuel cell is stably supported thus increasing durability and reliability. | 01-13-2011 |
| 20110008716 | FUEL CELL INCLUDING SUPPORT HAVING MESH STRUCTURE - Disclosed is a solid oxide fuel cell, which includes a support having a mesh structure, an anode layer formed on an outer surface of the support, an electrolyte layer formed on an outer surface of the anode layer, and a cathode layer formed on an outer surface of the electrolyte layer and also which is lightweight and enables current collection. | 01-13-2011 |
| 20110053032 | MANIFOLD FOR SERIES CONNECTION ON FUEL CELL - Disclosed is a manifold of a fuel cell, including a conductive support having an upper support member and a lower support member between which two or more anode-supported tubular unit fuel cells each comprising an anode layer, an electrolyte layer and a cathode layer formed in sequential order are disposed and which include an inner connector and an outer connector formed to be tightly fitted into an inner surface and around an outer surface of the unit fuel cells so as to electrically conduct the unit fuel cells, such that the unit fuel cells are alternately connected with the inner connector and the outer connector at an upper end and a lower end thereof thus forming an electrical series circuit. The manifold which is essentially manufactured to supply fuel to a solid oxide fuel cell is used to simply collect current from the fuel cell even without an additional current collector being used, and is configured such that unit fuel cells disposed in the manifold are connected in series. | 03-03-2011 |
| 20110053045 | SOLID OXIDE FUEL CELL AND METHOD OF MANUFACTURING THE SAME - Disclosed is a solid oxide fuel cell, including a polygonal tubular support an outer surface of which has a plurality of planes, a plurality of unit cells respectively formed on the plurality of planes of the tubular support, inner connectors for connecting the plurality of unit cells in series, and a pair of outer connectors for connecting the plurality of unit cells connected in series to a current collector, so that respective unit cells are connected in series on the planes of the tubular support, thus exhibiting excellent cell performance and high power density per unit volume, and maintaining high voltage upon collection of current to thereby reduce power loss due to electrical resistance. A method of manufacturing the solid oxide fuel cell is also provided. | 03-03-2011 |
| 20110059388 | SOLID OXIDE FUEL CELL AND SOLID OXIDE FUEL CELL BUNDLE - Disclosed is a solid oxide fuel cell bundle, including a plurality of fuel cells each having a polygonal tubular support an outer surface of which has a plurality of planes, an outer connector formed on one plane among the plurality of planes of the tubular support, a plurality of unit cells respectively formed on two or more remaining planes of the tubular support except for the one plane, and inner connectors for connecting the unit cells and the outer connector in series, wherein the fuel cells is connected in series in such a manner that the outer connector of a fuel cell is bonded to the unit cell of an additional fuel cell, and the unit cells are connected in series, thus exhibiting excellent cell performance and high power density per unit volume, and maintaining high voltage upon collection of current to thereby reduce power loss due to electrical resistance. | 03-10-2011 |
| 20110275007 | SOLID OXIDE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a solid oxide fuel cell and a method for manufacturing the same. The solid oxide fuel cell includes an anode layer; a cathode layer; an electrolyte layer interposed between the anode layer and the cathode layer; wherein the anode layer includes an Si-based compound selected from a group consisting of SiC, Si | 11-10-2011 |
| 20120021339 | SOLID OXIDE FUEL CELL AND MANUFACTURING METHOD THEREOF - Disclosed herein are a solid oxide fuel cell and a manufacturing method thereof. The solid oxide fuel cell includes: an anode layer, a cathode layer, and an electrolyte layer interposed between the anode layer and the cathode layer, wherein the anode layer includes: a conductive material; yttria stabilized zirconia (YSZ); and an oxide compound for forming a solid solution with the yttria stabilized zirconia. | 01-26-2012 |
| 20120058410 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell. The solid oxide fuel cell includes: a tubular first electrode support layer formed with a plurality of first passages; an inner electrolyte layer formed in the first electrode support layer; an inner second electrode layer formed on the inner surface of the first electrolyte layer and forming an inner second passage; an outer electrolyte layer formed on the outer surface of the first electrode support layer; and an outer second electrode layer formed on the outer surface of the second electrolyte layer and adjacent to the outer second passage. | 03-08-2012 |
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| 20100270064 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided. | 10-28-2010 |
| 20100270065 | Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same - Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided. | 10-28-2010 |
| 20110028584 | CURABLE CYCLIC PHOSPHAZENE COMPOUND AND METHOD OF PREPARING THE SAME - Disclosed herein is a curable cyclic phosphazene compound having a low dielectric constant, a low dielectric loss index and high thermal stability, and a method of preparing the same. The curable cyclic phosphozene polymer prepared using the compound has a low dielectric constant and excellent thermal properties, compared to conventional phosphozene polymers. | 02-03-2011 |
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| 20110140627 | APPARATUS FOR DRIVING LIGHT EMITTING DIVICE USING PULSE-WIDTH MODULATOIN - An apparatus for driving a light emitting device (LED) is provided. The apparatus for driving the LED includes a first driving control element, a first current detection unit, a first effective value detection unit, a first reference signal generation unit, and a first comparison unit. The first driving control element controls a current flowing through a first LED channel, in response to a first pulse-width modulated control signal. The first current detection unit detects the current flowing through the first LED channel. The first effective value detection unit detects an effective value of the current detected by the first current detection unit. The first reference signal generation unit generates a preset reference signal having a sawtooth waveform. The first comparison unit compares the reference signal from the first reference signal generation unit with the effective value from the first effective value detection unit. | 06-16-2011 |
| 20120044360 | DETERIORATION SENSING APPARATUS FOR DISPLAY DEVICE - Disclosed is a deterioration sensing apparatus for a display device, capable of rapidly sensing deterioration by pre-charging a sensing voltage in adjacent pixels while a deterioration of a single pixel is sensed in a display device having a plurality of pixels, in, particular, an organic light emitting diode panel. | 02-23-2012 |
| 20120056869 | ORGANIC LIGHT EMITTING DIODE DRIVER - There is provided an organic light emitting diode driver capable of compensating for pixel deterioration in real time during the driving of pixels by selectively compensating pixels, requiring compensation, for the deterioration thereof. The organic light emitting diode driver includes: a converter converting input data into compensation data used to selectively compensate for pixel deterioration according to whether or no the input data has been calibrated; a driver driving pixels of a pixel unit according to the compensation data from the converter; and a compensator providing the converter with a deterioration compensation signal according to deterioration information obtained from a pixel driven by the driver. | 03-08-2012 |
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| 20110133991 | DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE - Disclosed is a dielectric resonator antenna embedded in a multilayer substrate, which includes a multilayer substrate, a first conductor plate having an opening, a second conductor plate formed on the bottom of a lowermost insulating layer resulting from stacking at least two insulating layers downward from the first conductor plate, a plurality of metal via holes passing through around the opening at a predetermined interval, and a feeder for transmitting a frequency signal to the dielectric resonator embedded by the metal boundaries defined by the first conductor plate, the second conductor plate and the plurality of metal via holes, thus exhibiting low sensitivity to fabrication error and the external environment. | 06-09-2011 |
| 20110193415 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency. | 08-11-2011 |
| 20110248890 | DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE FOR ENHANCING BANDWIDTH - Disclosed herein is a dielectric resonator antenna embedded in a multilayer substrate for enhancing bandwidth. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator. Accordingly, the dielectric resonator antenna has low sensitivity to fabrication errors and an external environment, and can enhance the radiation characteristics of the antenna when multiple resonances occur. | 10-13-2011 |
| 20110248891 | DIELECTRIC RESONANT ANTENNA USING A MATCHING SUBSTRATE - Disclosed herein is a dielectric resonator antenna using a matching substrate in order to improve a bandwidth. The dielectric resonator antenna includes: a dielectric resonator body part that is embedded in a multi-layer substrate and has an opening part on the upper portion thereof; and at least one matching substrate that is stacked on the opening part and includes an an insulating layer having a dielectric constant smaller than that of the multi-layer substrate but larger than that of air, thereby making it possible to improve the bandwidth without adjusting the size of the dielectric resonator body part and to prevent loss and change in the radiation pattern due to the substrate mode. | 10-13-2011 |
| 20110267152 | WIDEBAND TRANSMISSION LINE - WAVEGUIDE TRANSITION APPARATUS - Disclosed herein is a wideband transmission line—waveguide transition apparatus. The wideband transmission line—waveguide transition apparatus includes: a waveguide constituted by a single dielectric substrate; a transmission line applying a signal to the waveguide; and a cavity matching unit in which a cavity of which an inner surface is formed by a metallic surface is formed at a portion of the waveguide to contact with the transmission line and impedance is adjusted through a change of the dielectric constant in the cavity caused by changing the size and shape of the cavity to perform impedance matching between the waveguide and the transmission line, and the position of the cavity is changed to perform phase matching between the waveguide and the transmission line. | 11-03-2011 |
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| 20110156539 | PIEZOELECTRIC ACTUATOR FOR ACTUATING HAPTIC DEVICE - Disclosed herein is a piezoelectric actuator for actuating a haptic device, which includes a piezoelectric element having a plurality of piezoelectric layers which are stacked and have the same polling direction, and an electrode pattern formed on the piezoelectric element, in which the length of each of the plurality of piezoelectric layers is greater than or equal to four times the width of each of the plurality of piezoelectric layers, and the width of each of the plurality of piezoelectric layers is greater than or equal to ten times the thickness of each of the plurality of piezoelectric layers, so that the piezoelectric actuator can greatly vibrate in the direction of length with reduced power consumption. | 06-30-2011 |
| 20110157035 | ACTUATOR MODULE - Disclosed herein is an actuator module that improves vibration of a touch screen pad. More specifically, the actuator module is configured to include a plate that is positioned at the lower part of a touch display module in which an image display unit is coupled to the lower part of a touch screen panel, a vibration generator that is positioned at the lower part of the plate and is mechanically deformed by compression or contraction when voltage is applied, and an adhesive layer that bonds the touch display module to the plate and the plate to the vibration generator and generates bending moment by the mechanical deformation of the vibration generator, thereby making it possible to transfer the vibration by the vibration generator directly to the touch screen panel and be designed in an ultra-thin type. | 06-30-2011 |
| 20110163634 | PIEZOELECTRIC ACTUATOR MODULE - Disclosed herein is a piezoelectric actuator module. The piezoelectric actuator module includes a flat plate, two or more elastic members, and a piezoelectric element. The elastic members are provided on each of opposite ends of the plate in a longitudinal direction thereof and protrude perpendicularly from the plate in such a way that a first end of each of the elastic members is coupled to an electronic device. The piezoelectric element is provided on a first surface of the plate and transmits vibrating force to the electronic device. The piezoelectric actuator module includes a plate having on opposite ends thereof two or more elastic members, thus being capable of controlling vibrating force by changing the length of the plate and the number of the elastic members, in addition to reliably supporting piezoelectric elements provided on the plate. | 07-07-2011 |
| 20110163635 | PIEZOELECTRIC ACTUATOR MODULE - Disclosed herein is a piezoelectric actuator module. The piezoelectric actuator module includes a flat plate. An elastic member is provided on each of opposite ends of the plate in a longitudinal direction thereof, and protrudes perpendicularly from the plate in such a way that a first end of the elastic member is coupled to an electronic device. A plate-shaped elastic body is provided on a first surface of the plate. A piezoelectric element is provided on a first surface of the elastic body. The plate-shaped elastic body is provided between the plate and the piezoelectric element, so that the overall spring constant of the piezoelectric actuator module is lowered and thus the vibrating force of the piezoelectric actuator module is increased. | 07-07-2011 |
| 20110273405 | TOUCH SCREEN DEVICE - Disclosed herein is a touch screen device, including: a case that partitions an internal space, a touch panel module that is received in the case to recognize external pressure, a first actuator that is mounted at the lower part of the touch panel module to generate vibration, a second actuator that is mounted at the case to generate vibration, and
| 11-10-2011 |
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| 20110193415 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency. | 08-11-2011 |
| 20110241609 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed herein is a wireless energy transmission structure, which includes a printed circuit board, a disk section, and a wire section. The printed circuit board is formed in a ring type, the disk section is constituted by a first conductive plate and a second conductive plate formed on portions of the printed circuit board corresponding to each other to be spaced by a predetermined gap and a dielectric material inserted between the first conductive plate and the second conductive plate, and the wire section is constituted by a plurality of meta cells having a meta material structure, which are repetitively formed to surround the exterior and interior of the printed circuit board and a transmission line connected to each of the first conductive plate and the second conductive plate and surround the plurality of meta cells. | 10-06-2011 |
| 20110266879 | APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING ZERO REFRACTIVE INDEX - Disclosed herein is an apparatus for transmitting and receiving wireless energy using meta-material structures having a zero refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. When external power is applied thereto, the wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially when the generated wireless energy is transmitted, using a magnetic resonance method while concentrating the wireless energy in one direction. | 11-03-2011 |
| 20110267247 | APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING NEGATIVE REFRACTIVE INDEX - Disclosed herein is there is provided an apparatus for transmitting and receiving wireless energy using meta-material structures having a negative refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. The wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially, using a magnetic resonance method while concentrating the wireless energy at a single point. The wireless energy reception unit wirelessly receives the wireless energy using the magnetic resonance method while concentrating the wireless energy at a single point. | 11-03-2011 |
| 20120038220 | WIRELESS POWER TRANSMISSION APPARATUS AND TRANSMISSION METHOD THEREOF - Disclosed herein are a wireless power transmission apparatus and a transmission method thereof. The wireless power transmission apparatus is configured to include a wireless power transmitter generating a wireless power signal to be wireless transmitted, wirelessly transmitting the generated wireless power signal by a magnetic resonance manner, receiving a reflection wireless power signal to determine whether or not a load apparatus is presented, and supplying power to the load apparatus; and a wireless power receiver connected to the load apparatus and receiving the transmitted wireless power signal by the magnetic resonance manner and supplying it to the connected load apparatus and reflecting the remaining wireless power signal to the wireless power transmitter, whereby a transmission apparatus can recognize a receiving environment and resonance characteristics are improved, without a separate communication device or a system. | 02-16-2012 |
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| 20100102661 | Rotating shaft for ultra slim spindle motor - Disclosed herein is a rotating shaft for an ultra slim spindle motor which reduces a frictional area between the rotating shaft and a bearing, thus being capable of reducing consumption current consumed during the rotation of the rotating shaft. The ultra slim spindle motor includes a rotating shaft for axially supporting a rotor casing and a bearing for rotatably supporting the rotating shaft. The rotating shaft includes a coupling part which is press-fitted into the rotor casing, upper and lower contact parts which are supported, respectively, by an upper portion and a lower portion of the bearing, and a non-contact part which is provided between the upper and lower contact parts in such a way that the non-contact part is not in contact with the bearing. | 04-29-2010 |
| 20100319012 | Spindle Motor Assembly With Encoder - The present invention provides a spindle motor assembly with an encoder. The spindle motor includes a circuit board, a spindle motor and an encoder. A connector is mounted on the upper surface of the circuit board. The spindle motor is provided on the circuit board. The spindle motor functions to rotate a disk placed thereon. The encoder is provided on the connector and senses a detection mark of the disk and thereby detects a rotating speed of the disk. As such, because the encoder is installed on the connector, the number of components is reduced, and the production cost can be thus reduced. | 12-16-2010 |
| 20110187303 | SENSOR-TYPE BRUSHLESS DC MOTOR - Disclosed herein is a sensorless-type brushless DC motor, including: a magnet provided in a rotor; and a stator formed by winding a coil on a core stacked with sheets while facing the magnet, wherein the position of the rotor is detected by detecting back electromotive force induced to the coil, the back electromotive force includes a harmonic component 5 times higher than a fundamental wave, and an amplitude ratio of the 5-times harmonic wave to the fundamental wave is set to be 1% or more. Further, the sensorless-type brushless DC motor can prevent a failure in detecting an initial position of the rotor by controlling a waveform of the back electromotive force and minimize an increase of a starting time. | 08-04-2011 |
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| 20100084726 | Wafer level packaging image sensor module having lens actuator and method of manfacturing the same - Disclosed herein is a wafer level packaging image sensor module, including a wafer including an image sensor, a circuit portion and a lower electrode on one side thereof, a lens actuator disposed on the lower electrode and made of electroactive polymer, an upper electrode disposed on the lens actuator, and a lens unit disposed on the upper electrode to allow light to be transmitted to the image sensor therethrough. The wafer level packaging image sensor module includes the lens actuator made of electroactive polymer, and thus it enables realization of the autofocusing of the wafer level packaging image sensor module. | 04-08-2010 |
| 20100187002 | METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE SUBSTRATE INCLUDING DIE ATTACHED THERETO USING SELF-ASSEMBLING MONOLAYER - Disclosed herein are a method of attaching a die using a self-assembling monolayer and a package substrate including a die attached thereto using a self-assembling monolayer. A first self-assembling monolayer formed on a die and a second self-assembling monolayer formed on a substrate are provided with the same hydrophilic or hydrophobic functional group, so that the die is attached to the substrate using an attractive force acting between the first and second self-assembling monolayers. An accuracy of alignment between the die and the substrate can be improved by the simple solution. | 07-29-2010 |
| 20110037145 | WAFER LEVEL PACKAGE HAVING CYLINDRICAL CAPACITOR AND METHOD OF FABRICATING THE SAME - Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode. A method of fabricating the wafer level package having a cylindrical capacitor is also provided. | 02-17-2011 |
| 20110109339 | APPARATUS AND METHOD FOR INSPECTING CIRCUIT OF SUBSTRATE - Disclosed herein is an apparatus and method for inspecting a circuit of a substrate. The apparatus includes a pin probe coming into contact with a first end of an electrode formed on a first side of a substrate, a voltage source for applying a voltage to the pin probe, a film disposed at a second end of the electrode formed on a second side of the substrate, a dielectric fluid sealed in the film, and an electronic ink dispersed in the dielectric fluid, and charged with electricity to flow when the electrode is electrified. The present invention is advantageous in that whether an electrode has been electrified is measured using charged electronic ink, so that the use of a pin probe is limited to one side of a substrate, thus reducing cost required for the entire inspection. | 05-12-2011 |
| 20110115516 | APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN OF SUBSTRATE - Disclosed herein is an apparatus and method for inspecting defects in the circuit pattern of a substrate. The apparatus for inspecting defects in a circuit pattern of a substrate includes a pin probe configured to input a voltage while coming into contact with an inspection target circuit pattern of a substrate. A capacitor sensor is provided with a membrane electrode which is opposite a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner, and is configured to detect both capacitance and capacitance variation, generated due to displacement of the membrane electrode attributable to electrostatic attractive force acting from the connection circuit pattern on the membrane electrode. A capacitance measurement unit is connected to the capacitor sensor and is configured to measure capacitance attributable to the displacement of the membrane electrode, which is input from the capacitor sensor. | 05-19-2011 |
| 20110116084 | METHOD OF INSPECTING DEFECTS IN CIRCUIT PATTERN OF SUBSTRATE - Disclosed herein is a method of inspecting defects in a circuit pattern of a substrate. At least one laser beam radiation unit for radiating a laser beam onto an inspection target circuit pattern of a substrate in a non-contact manner is prepared. A probe beam radiation unit for radiating a probe beam onto a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner is prepared. The laser beam is radiated onto the inspection target circuit pattern using the laser beam radiation unit. The probe beam is radiated onto the connection circuit pattern using the probe beam radiation unit, thus measuring information about whether the probe beam is diffracted, and a diffraction angle. Accordingly, the method can solve problems such as erroneous measurements caused by contact pressure and can reduce the time required for measurements. | 05-19-2011 |
| 20110128011 | APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN - Disclosed herein is an apparatus and method for inspecting defects in a circuit pattern. In the inspection apparatus and method, a laser beam is radiated by a laser unit onto a first end of a circuit pattern, and variation in impedance of a capacitor sensor disposed at a second end of the circuit pattern is measured, thus measuring the open/short circuits of the circuit pattern. | 06-02-2011 |
| Patent application number | Description | Published |
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| 20090255722 | Printed circuit board having landless via hole and method of manufacturing the same - This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern. | 10-15-2009 |
| 20090260868 | Printed circuit board and method of manufacturing the same - The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the variance in physical properties of material depending on changes in temperature. The via has no upper land, and thus a fine circuit pattern of the circuit layer can be formed on the via. | 10-22-2009 |
| 20090288872 | Printed circuit board including outmost fine circuit pattern and method of manufacturing the same - Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed. | 11-26-2009 |
| 20120011716 | Method of manufacturing printed circuit board including outmost fine circuit pattern - A method of manufacturing a printed circuit board including: preparing a first double-sided substrate including a first insulating layer, a first lower copper layer, a second circuit layer including a first lower land, and a first via; preparing a second double-sided substrate including a second insulating layer, a third lower copper layer, a fourth circuit layer including a second lower land, and a second via; disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump; and forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer. | 01-19-2012 |
| 20120060369 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING LANDLESS VIA HOLE - Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer. | 03-15-2012 |
