Ledesma

Francisco Ledesma, Dallas, TX US

Patent application number	Description	Published
20080204601	AC Coupling Techniques For Video Drivers - A low bandwidth signal path is added to copy internal node DC signal to output node. Therefore, for a DC or low frequency signal, the output signal is controlled by this loop. On the other hand, a high frequency signal is not affected because of the low-bandwidth of added loop. Thus, both DC and AC coupling modes are realized for components such as low-voltage video drivers.	08-28-2008
20110092246	Asymmetric ESD Protection for FM Transmitter - Various apparatuses and methods for protecting a transmitter from electrostatic discharge are disclosed herein. For example, some embodiments provide an apparatus including a first ESD clamp connected to an antenna input, a first reactive component connected to the first ESD clamp, a second ESD clamp connected to the first reactive component, and a second reactive component connected between the second ESD clamp and the transmitter.	04-21-2011

Patent application number	Description	Published
20110072137	INTEGRATED APPLICATION ACCESS - An integration portal provides a user with access to application entities of a plurality of remote applications. An authorization layer included in the integration portal includes a permission map indicating an association between the user and at least one of the application entities of the plurality of remote applications that the user is permitted to access. The authorization layer in the integration portal is synchronized with an authorization layer included in an application portal that provides the user with access to a subset of the remote applications, whereby the permission map is updated with information about at least one of the application entities that the user is permitted to access through the integration portal. Corresponding systems and methods are also disclosed.	03-24-2011

Patent application number	Description	Published
20090127122	MULTI-CHAMBERED METAL ELECTRODEPOSITION SYSTEM FOR SEMICONDUCTOR SUBSTRATES - A multi-chambered system for electroplating metal layers on a semiconductor substrate. The system comprises a fluid reservoir having at least a first chamber and a second chamber. A cathode is located in the first chamber, an anode is located in the second chamber, and a shield is located between the cathode and anode. The cathode is configured to be electrically coupled to a semiconductor substrate locatable in the first chamber. The anode is configured to oppose a first major surface of the semiconductor substrate. The shield is configured to deter electrolytic fluid communication between the first and second chamber, other than though predefined openings in the shield.	05-21-2009