Patent application number | Description | Published |
20090250162 | High Resolution Inkjet Printer - A high-resolution printer includes a printhead having optimized features including 3 to 20 micron diameter orifices spaced apart from adjacent orifices by a distance of between about 15 and 75 microns. The orifice plate is electroformed and plated to a thickness ranging from about 6 to 19 microns. A barrier layer secures the orifice plate to a printhead substrate. | 10-08-2009 |
20110018930 | FEED SLOT PROTECTIVE COATING - An apparatus and method provide a protective coating ( | 01-27-2011 |
20120013685 | THERMAL INKJET PRINTHEAD WITH HEATING ELEMENT IN RECESSED SUBSTRATE CAVITY - An inkjet printhead includes a substrate having a recessed cavity formed therein. The cavity has a continuous sidewall around the perimeter of the cavity. The printhead includes a heating element formed onto the sidewall of the cavity. | 01-19-2012 |
20120293587 | THERMAL INK JET PRINTHEAD - A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer. | 11-22-2012 |
20120298622 | ASSEMBLY TO SELECTIVELY ETCH AT INKJET PRINTHEAD - An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via. | 11-29-2012 |
20120299186 | SEMICONDUCTOR DEVICE - A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge. | 11-29-2012 |
20130021411 | NONCIRCULAR INKJET NOZZLE - An inkjet nozzle includes an aperture with a noncircular opening substantially defined by a polynomial equation. A droplet generator is also described which includes a firing chamber fluidically coupled to a fluid reservoir, a heating resistor and a nozzle. The nozzle includes an aperture forming a passage from the firing chamber to the exterior of the droplet generator through a top hat layer. The nozzle is defined by a closed polynomial and has a mathematically smooth and mathematically continuous shape around aperture's perimeter wall, with two protrusions extending into the center of the aperture. | 01-24-2013 |
20130187984 | NONCIRCULAR INKJET NOZZLE - An inkjet nozzle includes an aperture with a noncircular opening having a first segment substantially defined by a first polynomial equation and a second segment substantially defined by a second equation. | 07-25-2013 |
20130286102 | Fluid Ejection Device Having Firing Chamber With Contoured Floor - A fluid ejection device includes a firing chamber having a chamber floor with an orifice opposite the chamber floor and a heating element partially covering the chamber floor, a region of the chamber floor being contoured to define a cavity extending into the chamber floor. | 10-31-2013 |
20130286104 | Thermal Fluid-Ejection Echanism Having Heating Resistor On Cavity Sidewalls - A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism. | 10-31-2013 |
20130293638 | Fluid Ejection Device Having Firing Chamber With Mesa - A fluid ejection device includes a firing chamber having an ejection orifice opposite a chamber floor, a heating element and a mesa projecting from the chamber floor, the mesa is spaced from the heating element to define a passive zone between the mesa and heating element. | 11-07-2013 |
20130321531 | RING-TYPE HEATING RESISTOR FOR THERMAL FLUID-EJECTION MECHANISM - A ring-type heating resistor for a thermal fluid-ejection mechanism includes resistive segments and conductive segments. The resistive segments are rectangular in shape. The resistive segments are separated from one another. The conductive segments are interleaved in relation to the resistive segments such that each conductive segment electrically connects two of the resistive segments. The resistive segments and the conductive segments together form a pseudo-ring that approximates a true ring. | 12-05-2013 |
20140104344 | HEATING RESISTOR - A heating element of a fluid ejection device, the heating element including a ring-type body, an inner edge of the body, and an outer edge of the body, wherein at least one of the inner edge and the outer edge defines an undulated surface contour. | 04-17-2014 |
20140375710 | NOZZLE LAYOUTS FOR PRINTHEADS - Nozzle layouts for printheads are described. In an example, a printhead includes a first set of drop ejectors having orifices with circular bores, and a second set of drop ejectors having orifices with non-circular bores. A processor receives printing data representing an image to be printed to media, and provides firing data to the printhead for activating the drop ejectors. The firing data selects the drop ejectors with the circular bores to print graphic elements of the image and selecting the drop ejectors with the non-circular bores to print textual elements or line elements of the image. | 12-25-2014 |
20150049142 | PROVIDE HEAT TO END REGIONS OF A PRINTHEAD DIE - A printhead die includes end regions, a nozzle surface region, fluid passages, ejection chambers, fluid ejectors, non-ejection chambers, and heating resistors. The nozzle surface region is disposed between the end regions. The fluid passages include corresponding ejection nozzles. The ejection nozzles are disposed on the nozzle surface region. The fluid ejectors correspond to the ejection chambers. Each one of the fluid ejectors selectively ejects printing fluid through a corresponding ejection nozzle. The plurality of heating resistors corresponds to the non-ejection chambers. The heating resistors selectively provide heat to the end regions while not ejecting printing fluid through the ejection nozzles. | 02-19-2015 |