Laudick
David A. Laudick, Kokomo, IN US
Patent application number | Description | Published |
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20090085248 | Method of overmolding an electronic assembly having an insert-molded vertical mount connector header - An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant. | 04-02-2009 |
20100032183 | Compliant pin strip with integrated dam bar - An improved compliant pin strip and process for making an electrical package having a printed circuit board encased in a housing and pin connectors mechanically and electrically connected to the printed circuit board and extending outwardly away from an outer surface of the housing is provided. This involves the use of a compliant pin strip having a dam bar that defines surfaces for a molding tool to close on and seal a mold cavity. The pin strip with dam bar enables a simplified, cost effective, and more robust manufacturing process. | 02-11-2010 |
David A. Laudick, Kokomo IN
Patent application number | Description | Published |
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20090106974 | Method of producing an overmolded electronic module with a flexible circuit pigtail - A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound. | 04-30-2009 |
David A. Laudick, Spring City, TN US
Patent application number | Description | Published |
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20120078208 | Contained ostomy appliance - The present invention is an individual pressure barrier pouch that is used in conjunction with the assembly of either a one piece or a two piece ostomy appliance or as a pressure barrier pouch that can be preassembled and integrated into the assembly of a two piece ostomy appliance. In all three embodiments, body waste material/excretions from the patient's stoma/fistula pass through the pressure barrier pouch to enter the ostomy pouch. When pressure is applied to the ostomy pouch, the excretions no longer have access to escape through the path of least resistance between the stoma and the wafer stoma clearance hole as they do with a conventional ostomy pouch. The only access to the path of least resistance with the present invention would have body excretions backing up through the pressure barrier pouch. | 03-29-2012 |