Lau, TW
Chee-Wai Lau, Hsinchu TW
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20090284483 | Display Device and Method Having Sensing Function - A display device and method having a sensing function is described. The device includes a liquid crystal display (LCD) panel and plural sense lines. The LCD panel includes a plurality of data lines and a plurality of gate lines. Each of the data lines is connected electrically to a plurality of left pixels and a plurality of right pixels. The sense line is disposed between each two adjacent data lines, and each of the sense lines is configured to be parallel to the data lines and perpendicular to the gate lines. The sense lines are used to transmit touch signals. | 11-19-2009 |
Chee-Wai Lau, Hsin-Chu TW
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20110292005 | DISPLAY APPARATUS AND METHOD FOR ELIMINATING GHOST THEREOF - A display apparatus includes a plurality of scan lines, a plurality of data lines, a plurality of pixel transistors, a plurality of pixel electrodes, a gate driver, a source driver and a discharge circuit. The data lines are intersected with the scan lines. Each of the pixel transistors is electrically coupled to a corresponding scan line and a corresponding data line, and each of the pixel electrodes is electrically coupled to a corresponding pixel transistor. The gate driver is electrically coupled to the scan lines, and the source driver is electrically coupled to the data lines. The discharge circuit is electrically coupled to the gate driver and the data lines. The discharge circuit starts when the display apparatus is turned off, to control the gate drive for turning on the pixel transistors simultaneously, and make the pixel electrodes be electrically communicated with a reference voltage. | 12-01-2011 |
20120146981 | DRIVING METHOD OF DISPLAY APPARATUS AND DISPLAY APPARATUS FOR DISPLAYING FRAME - A driving method for a display apparatus. The display apparatus includes a plurality of first pixel units, a plurality of second pixel units, a first group of transmission lines and a second group of transmission lines. The first group of transmission lines and the second group of transmission lines are electronically connected to the plurality of first pixel units and the plurality of second pixel units, respectively. The driving method includes: generating a first and a second input signals including a plurality of input signals each having an identical waveform; and transmitting the first and the second input signals into the first group and second group of transmission lines such that the first and second input signals are transmitted to the plurality of first pixel units and the plurality of second pixel units in a plurality of different transmission directions, respectively. | 06-14-2012 |
20140111406 | ELECTROLUMINESCENT DISPLAY PANEL AND DRIVING METHOD THEREOF - An electroluminescent display panel includes a plurality of sub-pixels; a plurality of scan lines, each of the scan lines being electrically connected to a first row of sub-pixels and a second row of sub-pixels of two adjacent rows; a plurality of first data lines electrically connected to the first rows of sub-pixels of corresponding columns respectively; a plurality of second data lines electrically connected to the second rows of sub-pixels of corresponding columns respectively; a scan driving unit for outputting a plurality of scanning signals; and a data driving unit for outputting a plurality of dada signals; wherein the scanning signals sequentially turn on two adjacent rows of sub-pixels via the scan lines, the data signals on the first data lines charge the first rows of sub-pixels of the corresponding columns, and the data signals on the second data lines charge the second rows of sub-pixels of the corresponding columns. | 04-24-2014 |
Chee-Wai Lau, Hsinchu County TW
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20130141877 | FAN-OUT CIRCUIT AND ELECTRONIC DEVICE HAVING THE SAME - A fan-out circuit electrically connected to a driver and a plurality of signal lines is provided. The fan-out circuit includes a first fan-out trace including a first and a second conductive line, and a second fan-out trace including a third and a fourth conductive line. The second conductive line is connected between the first conductive line and one of the signal lines. The length of the second and fourth conductive lines are L | 06-06-2013 |
Chi-Chung Lau, Taipei City TW
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20090161944 | TARGET DETECTING, EDITING AND REBUILDING METHOD AND SYSTEM BY 3D IMAGE - A method and system for target detecting, editing and rebuilding by 3D image is provided, which comprises an inputting and picking unit, a training and detecting unit, a displaying and editing unit and a rebuilding unit. The inputting and picking unit receives a digital image and a LiDAR data and picks up a first parameter to form a 3D image. The training and detecting unit selects a target, picks up a second parameter therefrom, calculates the second parameter to generate a threshold and detects the target areas in the 3D image according to the threshold. The displaying and editing unit sets a quick selecting tool according to the threshold and edits the detecting result. The rebuilding unit sets a buffer area surrounding the target, picks up a third parameter therefrom and calculates the original shape of the target by the Surface Fitting method according to the third parameter. | 06-25-2009 |
Chi-Kin Lau, Taipei TW
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20120023025 | SECURE DONATION SYSTEM AND ITS METHOD - A secure donation system is connectible to information processing device of donor, donee, and specific store via network. The system includes: a database for storing donation intention data of donor, requirement data of donee, and merchandise and/or service transaction data of specific store; a resource allocation module for generating donee data meeting donation intention data by analyzing and matching donation intention data with requirement data; a donation module for donor to choose donee from donee data meeting donation intention data generated by resource allocation module and for generating donation usage certificate after confirming donation data including donation intention data and donee data; and an authorization module for transmitting donation usage certificate to electronic device of chosen donee, so as for donee to perform verification and shopping in specific store via electronic device. Besides, a secure donation method having mechanisms of requirement matching and postpaid is also provided. | 01-26-2012 |
Chi-Sang Lau, Taipei TW
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20110017244 | DRY CLEANING AND SURFACE TREATMENT EQUIPMENT USED FOR BIOCHIP OR MEDICAL APPARATUS - A dry cleaning and surface treatment equipment used for a biochip or a medical tools includes a sealable chamber provided for putting a biochip, an ozone generator for supplying ozone to the sealable chamber, and a fluid transmission device filled with a chemical reactant. The sealable chamber includes a heater, a gas outlet, and a gas inlet interconnected with the ozone generator. The fluid transmission device is disposed outside the sealable chamber and includes a trace transmission pipe extended to the fluid transmission device. The sealable chamber further includes an evaporation container, and the trace transmission pipe of the fluid transmission device is extended to a corresponding position of the evaporation container for injecting the chemical reactant into the evaporation container. | 01-27-2011 |
Choon-Tyng Lau, Tu-Cheng TW
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20100315343 | KEYBOARD - A keyboard includes a base and a cover. The base receives a main circuit board therein, and the cover receives a flexible circuit board therein. The flexible circuit board is electrically coupled to the main circuit board and comprises of a plurality of touch areas located thereon. Each touch area is capable of generating electrical signals in the flexible circuit board when touched. The electrical signals are capable of being transmitted to the main circuit board. A plurality of key areas is integrated on the cover respectively corresponding to the touch areas. Each of the key areas is resiliently deformable and capable of touching the corresponding touch area. | 12-16-2010 |
20100322738 | FASTENING APPARATUS - A fastening apparatus is provided to secure a first component to a second component. The fastening apparatus includes a fastening anchor and a securing member. The fastening anchor includes two separated securing parts defining internal screw thread and external screw thread. The securing member defines external screw thread. The securing member is accommodated into the fastening anchor by the securing member external screw thread engaging the fastening anchor internal screw thread, and the two separated securing parts of the fastening anchor is urged to expand outward to engage with one of the first component and the second component. | 12-23-2010 |
20110028042 | POWER PLUG AND POWER PLUG ASSEMBLY - A power plug is configured for connecting a power adaptor to a power supply socket. The power plug includes a first portion and a second portion. At least two prongs are disposed on the first portion and are capable of being coupled to the power supply socket. The second portion is configured to be electrically coupled to the power adaptor. The second portion defines a receiving housing capable of accommodating the power adaptor. | 02-03-2011 |
20110069009 | ELECTRONIC DEVICE WITH CURSOR CONTROLLING APPARATUS - An apparatus includes an electronic device. The electronic device includes a cursor controlling apparatus which is detachably mounted to the electronic device. The cursor controlling apparatus includes a touchpad mounted on a top portion of the cursor controlling apparatus, a mouse module mounted in the cursor controlling apparatus, and a controller connected to the touchpad and the mouse module. The controller is capable of detecting whether the cursor controlling apparatus is mounted to the electronic device. The controller enables the touchpad and disables the mouse module when the controller detects the cursor controlling apparatus is mounted to the electronic device. The controller enables the mouse module and disables the touchpad when the controller detects the cursor controlling apparatus is not mounted to the electronic device. | 03-24-2011 |
20110085093 | COMPUTER SYSTEM WITH PROJECTOR - A computer system includes a host, a bracket and a projector. The host includes a holding portion, and the holding portion defines a first space. The bracket is secured to the host and defines a second space. The projector is electrically connected to the host, and rotatable relative to the first space and the second space. | 04-14-2011 |
20110089283 | ELECTRONIC DEVICE WITH EARPHONE CONTAINER - An electronic device includes a base, a restricting piece, a coiling piece, and a cable. The base defines a containing space. The restricting piece is secured in the containing space. The restricting piece includes a pivot and a cable outlet. The coiling piece includes a coiling post. A side of the coiling post defines a pivot hole which receives the pivot of the restricting piece inserted therein to pivotally mount the coiling piece in the containing space. The cable is wrapped on the coiling post, and a part of the cable is inserted through the cable cutout. | 04-21-2011 |
20110149496 | COMPUTER SYSTEM EMPLOYING LIGHT-GUIDING MEMBER - A computer system includes a chassis, a keyboard, a light-emitting member, a light-guiding member, and a control system. The keyboard is attached to the chassis. The light-emitting member is disposed in the chassis and capable of emitting light. The light-guiding member directs light of the light-emitting member to irradiate on the keyboard. The control system is electronically coupled to the light-emitting member to control light brightness of the light-emitting member. | 06-23-2011 |
John H. Lau, Taipei TW
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20150076682 | THINNED INTEGRATED CIRCUIT DEVICE AND MANUFACTURING PROCESS FOR THE SAME - A thinned integrated circuit device and manufacturing process for the same are disclosed. The manufacturing process includes forming a through-silicon via (TSV) on a substrate, a first terminal of the TSV is exposed on a first surface of the substrate, disposing a bump on the first surface of the substrate to make the bump electrically connected with the TSV, disposing an integrated circuit chip (IC) on the bump so that a first side of the IC is connected to the bump, disposing a thermal interface material (TIM) layer on a second side of the IC opposite to the first side of the IC, attaching a heat-spreader cap on the IC by the TIM layer, and backgrinding a second surface of the substrate to expose the TSV to the second surface of the substrate while carrying the heat-spreader cap. | 03-19-2015 |
John H. Lau, Taipei City TW
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20110309357 | MEASURING APPARATUS - A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface. | 12-22-2011 |
20120018723 | STRUCTURE AND METHOD FOR TESTING THROUGH-SILICON VIA (TSV) - A test structure including at least one ground pad, an input pad, at least one first through-silicon via (TSV), at least one second TSV and an output pad is disclosed. The ground pad receives a ground signal during a test mode. The input pad receives a test signal during the test mode. The first TSV is coupled to the input pad. The output pad is coupled to the second TSV. No connection line occurs between the first and the second TSVs. During the test mode, a test result is obtained according to the signal of at least one of the first and the second TSVs, and structural characteristics can be obtained according to the test result. | 01-26-2012 |
20120119375 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - In a manufacturing method of a semiconductor structure, a substrate having a front surface and a back surface is provided. The front surface has a device layer thereon and conductive plugs electrically connected to the device layer. A thinning process is performed on the back surface of the substrate, such that the back surface of the substrate and surfaces of the conductive plugs have a distance therebetween. Holes are formed in the substrate from the back surface to the conductive plugs, so as to form a porous film. An oxidization process is performed, such that the porous film correspondingly is reacted to form an oxide material layer. A polishing process is performed on the oxide material layer to expose the surfaces of the conductive plugs. | 05-17-2012 |
20120133046 | SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF - A semiconductor structure and a process thereof are provided. The semiconductor structure includes a semiconductor wafer having a first surface and a second surface opposite to the first surface, through silicon vias and a crack stopping slot. The through silicon vias are embedded in the semiconductor wafer and connected between the first surface and the second surface. The crack stopping slot is located in the periphery of the second surface of the semiconductor wafer. The depth of the crack stopping slot is less than or equal to the thickness of the semiconductor wafer. The process firstly provides a semiconductor wafer having through silicon vias. Then, the aforementioned crack stopping slot is formed at a back side of the semiconductor wafer opposite to the first surface. Next, the semiconductor wafer is thinned from the back side to expose a second end of each through silicon via. | 05-31-2012 |
20120135547 | FABRICATING METHOD AND TESTING METHOD OF SEMICONDUCTOR DEVICE AND MECHANICAL INTEGRITY TESTING APPARATUS - A fabricating method and a testing method of a semiconductor device and a mechanical integrity testing apparatus are provided. An object includes a wafer, an insulating layer, and a plurality of conductive posts is provided. A surface of the wafer has a plurality of first blind holes outside chip regions and a plurality of second blind holes inside the chip regions. The insulating layer is between the conductive posts and the walls of the first blind holes and between the conductive posts and the walls of the second blind holes. A mechanical integrity test is performed to test a binding strength between the insulating layer, the conductive posts, and the walls of the first blind holes. The conductive posts in the chip regions are electrically connected to an element after the conductive posts in the first blind holes are qualified in the mechanical integrity test. | 05-31-2012 |
20120153454 | SEMICONDUCTOR DEVICE - A semiconductor device including a silicon substrate, a plurality of silicon nanowire clusters, a first circuit layer and a second circuit layer. The silicon substrate has a first surface, a second surface opposite to the first surface and a plurality of through holes. The silicon nanowire clusters are disposed in the through holes of the silicon substrate, respectively. The first circuit layer is disposed on the first surface and connected to the silicon nanowire clusters. The second circuit layer is disposed on the second surface and connected to the silicon nanowire clusters. | 06-21-2012 |
20120249176 | TEST STRUCTURE AND MEASUREMENT METHOD THEREOF - A test structure including a substrate, at least one conductive plug, a first conductive trace and a second conductive trace is provided. The substrate has a first area and a second area. The at lest one conductive plug is disposed in the substrate in the first area, wherein the conductive plug does not penetrate through the substrate. | 10-04-2012 |
20120273939 | FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF - By adding particles of high thermal conductivity and low thermal expansion coefficient into the copper as a composite material and filling with the composite material into the through-via hole, the mismatch of the coefficient of thermal expansion and the stress of the through-silicon via are lowered and the thermal conductivity of the through-silicon via is increased. | 11-01-2012 |
20120280385 | ELECTRONIC DEVICE PACKAGING STRUCTURE - An electronic device packaging structure is provided. The semiconductor device includes a semiconductor base, an emitter, a collector, and a gate. The emitter and the gate are disposed on a first surface of the semiconductor base. The collector is disposed on a second surface of the semiconductor base. A first passivation layer is located on the first surface of the semiconductor base surrounding the gate. A first conductive pad is disposed on the first passivation layer. A second conductive pad is disposed on the collector on the second surface. At least one conductive through via structure penetrates the first passivation layer, the first and second surfaces of the semiconductor base, and the collector to electrically connect the first and second conductive pads. | 11-08-2012 |
20120322249 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE - In a manufacturing method of a semiconductor structure, a substrate having a front surface and a back surface is provided. The front surface has a device layer thereon and conductive plugs electrically connected to the device layer. A thinning process is performed on the back surface of the substrate, such that the back surface of the substrate and surfaces of the conductive plugs have a distance therebetween. Holes are formed in the substrate from the back surface to the conductive plugs, so as to form a porous film. An oxidization process is performed, such that the porous film correspondingly is reacted to form an oxide material layer. A polishing process is performed on the oxide material layer to expose the surfaces of the conductive plugs. | 12-20-2012 |
20130171747 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE - A fabricating method and a testing method of a semiconductor device and a mechanical integrity testing apparatus are provided. An object includes a wafer, an insulating layer, and a plurality of conductive posts is provided. A surface of the wafer has a plurality of first blind holes outside chip regions and a plurality of second blind holes inside the chip regions. The insulating layer is between the conductive posts and the walls of the first blind holes and between the conductive posts and the walls of the second blind holes. A mechanical integrity test is performed to test a binding strength between the insulating layer, the conductive posts, and the walls of the first blind holes. The conductive posts in the chip regions are electrically connected to an element after the conductive posts in the first blind holes are qualified in the mechanical integrity test. | 07-04-2013 |
John Hon-Shing Lau, Hsinchu TW
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20130032390 | PACKAGING SUBSTRATE HAVING EMBEDDED INTERPOSER AND FABRICATION METHOD THEREOF - A packaging substrate includes a carrier and an interposer. The carrier has opposite top and bottom surfaces. A recess is formed on the top surface and a plurality of first conductive terminals are formed on the recess. Further, a plurality of second conductive terminals are formed on the bottom surface of the carrier. The interposer is disposed in the recess and has opposite first and second surfaces and a plurality of conductive through vias penetrating the first and second surfaces. A first conductive pad is formed on an end of each of the conductive through vias exposed from the first surface, and a second conductive pad is formed on the other end of each of the conductive through vias exposed from the second surface and electrically connected to a corresponding one of the first conductive terminals. Compared with the prior art, the invention improves the product reliability. | 02-07-2013 |
Jonathan Lau, Taoyuan TW
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20090213038 | Head Mounted Display and Real-Time Video Device - A head mounted display is disclosed in this invention. The head mounted display includes a display module, a removable supporting frame, and a removable clamping device. The display module is connected to a multi-media player. The removable supporting frame is disposed on the display module. The removable clamping device is disposed on the display module so as to clip eyeglasses of a user. A real-time video device is also disclosed in this invention. The real-time video device includes an image capturing device, a receiving device, and a head mounted display. The image capturing device is able to capture a motion image of a user continuously and transfer a signal of the motion image. The receiving device is used to receive the signal of the motion image. The head mounted display is mounted on the head of the user; the motion image is displayed on a display element of the head mounted display instantaneously. | 08-27-2009 |
Kiang-Giap Lau, Hsinchu County TW
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20130159605 | DATA MERGING METHOD FOR NON-VOLATILE MEMORY MODULE, AND MEMORY CONTROLLER AND MEMORY STORAGE DEVICE USING THE SAME - A data merging method for merging valid data of one logical block in a rewritable non-volatile memory module is provided. The method includes assigning a plurality of log physical blocks for the logical block. The method also includes performing a data arrangement operation and a data move operation with a partial synchronization manner to copy the valid data of the logical block into the lower physical pages of the log physical blocks from a first data physical block and at least one spare physical block while programming the valid data of the logical block into a second data physical block from the lower physical pages of the log physical blocks in units of each physical page group. The method further includes remapping the logical block to the second physical block. Accordingly, the method can effectively shorten the time of merging valid data and improving the reliability of data writing. | 06-20-2013 |
Kiang-Leong Lau, Miaoli TW
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20140164680 | METHOD FOR SWITCHING OPERATION MODE, MEMORY CONTROLLER AND MEMORY STORAGE APPARATUS - An operation mode switching method for a memory storage apparatus, a memory controller and a memory storage apparatus using the method are provided. The operation mode switching method includes receiving at least one access command from a host system and determining whether the access command conforms to a predetermined pattern. If the access command conforms to the predetermined pattern, an operation mode of the memory storage apparatus is switched from a first mode to a second mode. The access command includes a first write command including a write string, and the memory storage apparatus executes an operation corresponding to the write string. Accordingly, the method switches the operation mode of the storage memory apparatus by determining the pattern of the access command, so as to simplify the procedure of switching the operation mode and effectively decrease the probability of switching the operation mode incorrectly. | 06-12-2014 |
Kyaw-Oo Lau, Tainan City TW
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20120194813 | SENSOR CHIP FOR BIOMEDICAL AND MICRO-NANO STRUCTURED SUBSTANCES AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a sensor chip for biomedical and micro-nano structured substances and a method for manufacturing the same. The sensor chip includes plural metal nanoparticles and a porous anodized aluminum oxide film. The plural metal nanoparticles are completely contained in holes of the porous anodized aluminum oxide film and located at the bottom of the holes, and an aluminum oxide layer covering the second end of the holes has a thickness of 1 nm to 300 nm. When analytes such as biomedical molecules are provided in contact with the sensor chip, a Raman signal can be detected based on the Raman spectroscopy. The structure of the sensor chip of the present invention is uncomplicated and the manufacturing steps thereof are simple, and therefore the sensor chip of the present invention is of great commercial value. Also, a method of manufacturing the above sensor chip is disclosed. | 08-02-2012 |
Seng-Yong Lau, Yonghe City TW
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20100303129 | FREQUENCY HOPPING METHOD FOR LOCALIZATION SYSTEM - A frequency hopping method for localization system is aimed to overcome the degradation of location accuracy due to radio interference if there are some other radio devices using the same radio frequency as a localization system. A Packet Reception Rate (PRR) thresholding or a learning-based approach for the diagnostic test is proposed. In that, a PRR thresholding or a set of parameters trained by Hidden Markov Model (HMM) is used as a criterion to decide whether or not to hop. The proposed hopping mechanism provides an accurate and stable localization with a minimum delay. | 12-02-2010 |
20110082664 | METHOD OF PREDICTING POSITION OF OBJECT - A method of predicting a position of an object includes the steps of ( | 04-07-2011 |
Seng-Yong Lau, Taipei County TW
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20100304662 | MULTI-PATH DATA DISSEMINATION METHOD FOR MAGNETIC DIFFUSION WIRELESS NETWORK AND SYSTEM THEREOF - A multi-path data dissemination method for a magnetic diffusion wireless network and a system thereof overcome environmental interferences in wireless data transmissions. Each node of the network is provided for figuring out its good neighbors by broadcasting a good-neighbor exploratory message in a bootstrap process. Each node keeps a good-neighbor table containing nodes with a RSSI higher than a threshold of the good-neighbor table. A magnetic field of a magnetic diffusion (MD) dissemination method capable of determining a data dissemination path is created according to the good-neighbor tables to ensure that the data can be forwarded to a data sink successfully. | 12-02-2010 |
Seng-Yong Lau, Taipei TW
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20120206400 | TOUCH PANEL OPERATION APPARATUS AND METHOD THEREOF - A touch panel operation apparatus and a method thereof is provided. The touch panel operation apparatus includes a controller and a touch panel module. The controller generates a simulated figure touch signal and adds spatial static points on a tangible object, and the touch panel module detects the simulated figure touch signal and spatial distribution of the static points to identify the tangible object. | 08-16-2012 |
Veng-Chong Lau, New Taipei City TW
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20140321471 | SWITCHING FABRIC OF NETWORK DEVICE THAT USES MULTIPLE STORE UNITS AND MULTIPLE FETCH UNITS OPERATED AT REDUCED CLOCK SPEEDS AND RELATED METHOD THEREOF - A switching fabric of a network device has a load dispatcher, a plurality of store units, a storage device, a plurality of fetch units, and a load assembler. Each of the store units is used to perform a write operation upon the storage device. Each of the fetch units is used to perform a read operation upon the storage device. The load dispatcher is used to dispatch ingress traffic to the store units, wherein a data rate between the load dispatcher and each of the store units is lower than a data rate of the ingress traffic. The load assembler is used to collect outputs of the fetch units to generate egress traffic, wherein a data rate between the load assembler and each of the fetch units is lower than a data rate of the egress traffic. | 10-30-2014 |
Yi Ming Lau, Jhudong Township TW
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20090237102 | HEATING APPARATUS FOR SEMICONDUCTOR DEVICES - A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven. | 09-24-2009 |
Yi Ming Lau, Hsinchu City TW
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20110062317 | Testing Apparatus for Light-Emitting Devices - A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture. | 03-17-2011 |
20110063608 | Sensing Module for Light-Emitting Devices and Testing Apparatus Using the Same - A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device. | 03-17-2011 |