Patent application number | Description | Published |
20120104491 | Memory Cells, Arrays Of Memory Cells, And Methods Of Forming Memory Cells - A memory cell includes a vertically oriented transistor having an elevationally outer source/drain region, an elevationally inner source/drain region, and a channel region elevationally between the inner and outer source/drain regions. The inner source/drain region has opposing laterally outer sides. One of a pair of data/sense lines is electrically coupled to and against one of the outer sides of the inner source/drain region. The other of the pair of data/sense lines is electrically coupled to and against the other of the outer sides of the inner source/drain region. An access gate line is elevationally outward of the pair of electrically coupled data/sense lines and is operatively adjacent the channel region. A charge storage device is electrically coupled to the outer source/drain region. Other embodiments and additional aspects, including methods, are disclosed. | 05-03-2012 |
20120292716 | DRAM STRUCTURE WITH BURIED WORD LINES AND FABRICATION THEREOF, AND IC STRUCTURE AND FABRICATION THEREOF - A DRAM structure with buried word lines is described, including a semiconductor substrate, cell word lines buried in the substrate and separated from the same by a first gate dielectric layer, and isolation word lines buried in the substrate and separated from the same by a second gate dielectric layer. The top surfaces of the cell word lines and those of the isolation word lines are lower than the top surface of the substrate. The bottom surfaces of the isolation word lines are lower than those of the cell word lines. | 11-22-2012 |
20120329274 | METHOD OF FABRICATING A CELL CONTACT AND A DIGIT LINE FOR A SEMICONDUCTOR DEVICE - The present invention proposes the use of a silicon nitride layer on top of a second conductive layer. After a step of etching a second conductive layer, an oxide spacer is formed to define a gap. Then, another silicon nitride layer fills up the gap. After that, the oxide spacer is removed. Later, a first conductive layer is etched to separate the digit line to cell contact line. | 12-27-2012 |
20130001666 | Memory Cells, Arrays Of Memory Cells, And Methods Of Forming Memory Cells - A memory cell includes a vertically oriented transistor having an elevationally outer source/drain region, an elevationally inner source/drain region, and a channel region elevationally between the inner and outer source/drain regions. The inner source/drain region has opposing laterally outer sides. One of a pair of data/sense lines is electrically coupled to and against one of the outer sides of the inner source/drain region. The other of the pair of data/sense lines is electrically coupled to and against the other of the outer sides of the inner source/drain region. An access gate line is elevationally outward of the pair of electrically coupled data/sense lines and is operatively adjacent the channel region. A charge storage device is electrically coupled to the outer source/drain region. Other embodiments and additional aspects, including methods, are disclosed. | 01-03-2013 |
20140042548 | DRAM STRUCTURE WITH BURIED WORD LINES AND FABRICATION THEREOF, AND IC STRUCTURE AND FABRICATION THEREOF - A DRAM structure with buried word lines is described, including a semiconductor substrate, cell word lines buried in the substrate and separated from the same by a first gate dielectric layer, and isolation word lines buried in the substrate and separated from the same by a second gate dielectric layer. The top surfaces of the cell word lines and those of the isolation word lines are lower than the top surface of the substrate. The bottom surfaces of the isolation word lines are lower than those of the cell word lines. | 02-13-2014 |
20140159140 | BURIED WORD LINE STRUCTURE AND METHOD OF FORMING THE SAME - A method of forming a buried word line structure is provided. A first mask layer, an interlayer and a second mask layer are sequentially formed on a substrate, wherein the second mask layer has a plurality of mask patterns and a plurality of gaps arranged alternately, and the gaps includes first gaps and second gaps arranged alternately. A dielectric pattern is formed in each first gap and spacers are simultaneously formed on sidewalls of each second gap, wherein a first trench is formed between the adjacent spacers and exposes a portion of the first mask layer. The mask patterns are removed to form second trenches. An etching process is performed by using the dielectric patterns and the spacers as a mask, so that the first trenches are deepened to the substrate and the second trenches are deepened to the first mask layer. | 06-12-2014 |
20140213035 | METHOD OF FORMING BURIED WORD LINE STRUCTURE - A method of forming a buried word line structure is provided. A first mask layer, an interlayer and a second mask layer are sequentially formed on a substrate, wherein the second mask layer has a plurality of mask patterns and a plurality of gaps arranged alternately, and the gaps includes first gaps and second gaps arranged alternately. A dielectric pattern is formed in each first gap and spacers are simultaneously formed on sidewalls of each second gap, wherein a first trench is formed between the adjacent spacers and exposes a portion of the first mask layer. The mask patterns are removed to form second trenches. An etching process is performed by using the dielectric patterns and the spacers as a mask, so that the first trenches are deepened to the substrate and the second trenches are deepened to the first mask layer. | 07-31-2014 |
20140346652 | BURIED DIGITLINE (BDL) ACCESS DEVICE AND MEMORY ARRAY - A memory array includes a plurality of digitline (DL) trenches extending along a first direction; a buried digitline between the DL trenches; a trench fill material layer sealing an air gap in each of the DL trenches; a plurality of wordline (WL) trenches extending along a second direction; an active chop (AC) trench disposed at one end of the buried digitline; a shield layer in the air gap; and a sidewall conductor around the sidewall of the AC trench. | 11-27-2014 |
20150056810 | METHOD FOR SEMICONDUCTOR CROSS PITCH DOUBLED PATTERNING PROCESS - The present invention provides a method of cross double pitch patterning for forming a contact printing mask. First, a first, a second and a third layer a successively deposited; a photoresist is deposited on the third layer, and then trimmed into a first pre-pattern, on which an oxide layer is deposited. The oxide layer is etched into spacers forming a first pattern that is then etched into the third layer. A second cross pattern is formed the same way on the third layer. Finally the first and second layers are etched with selectivity both patterns. | 02-26-2015 |