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Lai, MY
Charlie Tan Tien Lai, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20080251859 | Semiconductor Module - A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions. | 10-16-2008 |
| 20080251903 | SEMICONDUCTOR MODULE - A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier. | 10-16-2008 |
Chwee Lan Lai, Johor MY
| Patent application number | Description | Published |
|---|---|---|
| 20090134512 | METHOD OF PRODUCING MULTIPLE SEMICONDUCTOR DEVICES - A method for producing multiple semiconductor devices. An electrically conductive layer is applied onto a semiconductor wafer. The semiconductor wafer is structured to produce multiple semiconductor chips. The electrically conductive layer is structured to produce multiple semiconductor devices. | 05-28-2009 |
Hee Meng Lai, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20100150977 | CAMOMILE TREATED GLOVE - The present invention is directed to a glove wherein the interior surfaces of the glove contain a film which includes water, glycerol and a botanical extract. | 06-17-2010 |
| 20100229282 | Powder-Free Anti-Blocking Coated Glove - Provided herein are powder-free elastomeric articles exhibiting therapeutic properties, and anti-blocking properties. Also provided herein are methods for the manufacture of such articles that are substantially free from interfering materials, as well as packaging means for maintaining therapeutic efficacy. | 09-16-2010 |
| 20100233223 | Powder-Free Antimicrobial Coated Glove - Provided herein are powder-free elastomeric articles exhibiting good antimicrobial and anti-blocking properties. Also provided herein are methods for the manufacture of such articles substantially free from antimicrobial interfering materials, as well as packaging means for maintaining antimicrobial efficacy. | 09-16-2010 |
Kong Yeow Lai, Penang MY
Nguk Chin Lai, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20080308947 | Die offset die to die bonding - A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate. | 12-18-2008 |
| 20090051043 | DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS - Systems, methods, and devices that facilitate stacking dies in a multi-die stack using die support mechanisms (DSMs) are presented. DSMs are employed to place a smaller die and attached wires underneath a larger die. DSMs can be placed on each side of the smaller die where the larger die overhangs when placed above the smaller die. The DSMs can be optimally sized to provide support to the larger die to reduce overhang and sagging, while providing a buffer region to protect the smaller die and associated wires. DSMs are employed to facilitate stacking dies that are the same or similar in size by placing a DSM between the dies. The DSM can be optimally sized to provide a buffer region to protect the wires bonded to the top side of the lower die from the upper die, while minimizing overhang to provide support to the upper die. | 02-26-2009 |
| 20090091043 | Die offset die to die bonding - A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate. | 04-09-2009 |
| 20090093084 | Die offset die to bonding - A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate. | 04-09-2009 |
Oi Ming Lai, Selangor MY
| Patent application number | Description | Published |
|---|---|---|
| 20080312342 | Process for the Production of Diacylglycerol - The present invention provides a process for producing a diacylglycerol, which comprises, reacting triacylglycerol with water and an enzyme preparation to obtain a mixture comprising of diacylglycerol, monoacylglycerol and free fatty acid; removing water content in the mixture by way of dehydration; and separating monoacylglycerol, free fatty acid and residual triacylglycerol by at least one separation method to obtain a high-purity diacylglycerol. An oil or fat composition comprising of diacylglycerol obtained from the said process and phytosteryl esters and/or ferulic acid esters in an amount of from 0.5% to 25% by weight of diacylglycerol is also provided. | 12-18-2008 |
Pin Yong Lai, Selangor MY
| Patent application number | Description | Published |
|---|---|---|
| 20110246366 | AUTHENTICATION USING TELECOMMUNICATIONS DEVICE - A method for authenticating a transaction being conducted remotely of a commerce server is disclosed. The method comprises selecting a telephone number from a pool of telephone numbers and making a telephone call to a registered telecommunications device, the telephone call being made with caller identification activated. A prompt is provided for the entry of at least a part of the telephone number as an authentication of the transaction. Upon the telephone number being entered within a set time the transaction is approved and effected. | 10-06-2011 |
Siaw Kang Lai, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20120059962 | PROVIDING A FINE-GRAINED ARBITRATION SYSTEM - In one embodiment, the present invention includes a method for selecting a requester to service during an arbitration round, and updating counters associated with the selected requester including a command unit counter and a data unit counter, determining if the counters are in compliance with corresponding threshold values, and if so granting a transaction for the selected requester, and otherwise denying the transaction. Other embodiments are described and claimed. | 03-08-2012 |
Siew Kong Lai, Skudai MY
| Patent application number | Description | Published |
|---|---|---|
| 20100145377 | Lancing Device For Minimizing Pain - The present invention provides a lancing device designed for minimizing pain to the user, comprising a probe with cam profile responsible for controlling the lancet speed such that the lancet enters the skin relatively fast, decelerates smoothly and gradually to zero velocity at maximum depth of penetration and retracts slowly and controllably. The housing of the lancet comprises of leaf springs and set of guides for minimizing or eliminating pitching or vibration of the lancet during lancing, hence reducing the pain experienced by the user. The lancing device is further equipped with a gear-damper system for minimizing or eliminating noise produced during lancing process. | 06-10-2010 |
Siew Kong Lai, Skudai Johor MY
| Patent application number | Description | Published |
|---|---|---|
| 20110295153 | LANCING DEVICE - A lancing device for use with a lancet for obtaining a blood sample is disclosed. The lancing device comprises a housing; a probe disposed in the housing; and a probe actuator for linearly displacing the probe. The probe is configured for releasably engaging a lancet and is provided with sliding surfaces for slidably engaging a pair of guides. Each sliding surface has a radius of curvature centered about a curvature defining axis, the curvature defining axis being coincident with a central longitudinal axis of the lancet when the lancet is engaged by the probe. The sliding surfaces are continually biased against the pair of guides such that when the lancet is engaged by the probe, the lancet is prevented from translating in any other direction than in a direction parallel to its central longitudinal axis during linear displacement of the probe. | 12-01-2011 |
Sim Poh Lai, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20110195231 | QUADRUPLE-WALL CORRUGATED PAPERBOARD AND METHOD OF MANUFACTURE - A corrugated paperboard for the packaging industry comprising of five liners ( | 08-11-2011 |