| Patent application number | Description | Published |
|---|
| 20100067907 | METHOD AND SYSTEM FOR CONTROLLING DRIVING CURRENT OF WDM-PON OPTICAL TRANSMITTER - The present disclosure relates to a WDM-PON optical transmitter; and, more particularly, to a system for controlling a driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control system of an optical transmitter for use in WDM-PON including a plurality of optical transmitters, each transmitter generating and transmitting a transmittance optical signal based on a driving current and an optical multiplexer/demultiplexer for combining the optical signals received from the plurality of the optical transmitters to output a combined optical signal through a single common terminal, wherein the driving current is controlled based on the combined optical signal outputted from the common terminal. | 03-18-2010 |
| 20100067911 | INJECTION LIGHT GENERATOR FOR USE IN WAVELENGTH DIVISION MULTIPLEXED-PASSIVE OPTICAL NETWORK - The invention is related to an injection light generator for use in a wavelength division multiplexed-passive optical network, which generates A-band injection light having a spectrum range separated into N wavelength ranges (N is a natural number equal to or greater than 2) to be used for a transmission of a downstream optical signal and B-band injection light having a spectrum range separated into N wavelength ranges to be used for a transmission of an upstream optical signal. | 03-18-2010 |
| 20100067921 | METHOD AND SYSTEM FOR CONTROLLING DRIVING CURRENT OF WDM-PON OPTICAL TRANSMITTER - The present disclosure relates to a WDM-PON (wavelength division multiplexed-passive optical network) optical transmitter; and, more particularly, to a system for controlling driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control method of the optical transmitter for in use in the WDM-PON, including: setting an attenuation value of a variable optical attenuator to X; detecting an optical power Px received by a monitoring photo diode of the optical transmitter; setting an attenuation value of the variable optical attenuator to Y; detecting an optical power Py received by the monitoring photo diode of the optical transmitter; calculating an optical power Pout of an optical signal outputted from a common terminal of a 1×N optical multiplexer/demultiplexer based on the detected optical power Px and Py; and controlling a driving current based on the calculated optical power Pout. | 03-18-2010 |
| 20100133557 | METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer. | 06-03-2010 |
| 20100144099 | METHOD FOR MANUFACTURING PASSIVE DEVICE AND SEMICONDUCTOR PACKAGE USING THIN METAL PIECE - A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed. | 06-10-2010 |
| 20100326707 | METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF - A package substrate, a manufacturing method thereof, a base package module, and a multi-layered package module having package substrates laminated on upper and lower portions of a base package module are provided. The base package module includes a base metal substrate, a first metal oxide layer that is formed on the base metal substrate to have a cavity therein, a device that is mounted in the cavity on the base metal substrate and insulated by the first metal oxide layer formed on a sidewall in the cavity, and a conductor that is connected to the device and a wiring pad formed on the first metal oxide layer on the base metal substrate. The package substrate includes a wiring pad, a conductor line, a second metal oxide layer having an opening that exposes a device, and a via that is connected to the wiring pad through a connection pad in the second metal oxide layer. | 12-30-2010 |
| 20120103475 | METHOD OF MANUFACTURING METAL BASE PACKAGE WITH VIA - A method of manufacturing a metal base package having a via structure that can provide via forming technology for a cheap 3D package and form a via having a high aspect ratio of various sizes is provided. | 05-03-2012 |
