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Kyoung-Il
Kyoung-Il Lee, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20110097258 | METHOD FOR PREPARING GRAPHENE RIBBONS WHERE STRUCTURE IS CONTROLLED - Disclosed is a method for fabricating graphene ribbons which are high-functional carbon materials. Provided a method of fabricating graphene ribbons, including (a) preparing a carbon structure in which a graphene ribbon is spirally grown (a graphene helix), revealing a tube shape, and (b) applying energy to unroll the graphene helix into the graphene ribbons. | 04-28-2011 |
Kyoung-Il Park, Osan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090309122 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls. | 12-17-2009 |
| 20100001308 | SIDE VIEW LIGHT EMITTING DIODE PACKAGE - Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package. | 01-07-2010 |
Kyoung-Il Park, Busanjin-Gu KR
| Patent application number | Description | Published |
|---|---|---|
| 20090189171 | Light emitting diode package - An LED package includes a housing, a substrate, a pad frame and an LED chip. The housing includes a plastic material, and has a recess with an opening at a top of the housing. The substrate includes substantially the same material with the housing. The pad frame includes conductive material, and is inserted on the substrate, and is fixed between the housing and the substrate. The LED chip is mounted on the pad frame and is disposed at a center of the recess. The housing is protruded and extended to a lower portion of the LED chip. Thicknesses of the housing's sidewalls facing to each other through the recess are substantially the same with each other. | 07-30-2009 |
Kyoung-Il Seo, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20080274693 | Method for Selecting the Installation Position and Direction of Link Antenna in Inbuilding Radio Frequency Repeater and Cable Apparatus Used in the Same - The present invention relates to a method for selecting an installation position of a link antenna of an in-building RF repeater, a cable device thereof, and a terminal. The method selects the position for measuring the greatest Ec/lo by using directivity of the link antenna in an area for installing the link antenna. The link antenna is installed at the selected position. The direction with the greatest Ec/lo that is measured by using directivity of the link antenna is fixed to be a desired direction from among target directions to be directed by the link antenna. In this instance, measurement of Ec/lo by using directivity of the link antenna is performed by a mobile station connected to the link antenna through an access cable. Accordingly, the link antenna can be installed at the optimized position and in the optimized direction. Hence, the Ec/lo within the building is substantially reduced. | 11-06-2008 |