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Kwon-Seob

Kwon-Seob Lim, Gwangju-Si KR

Patent application number	Description	Published
20100047967	METHOD OF MANUFACTURING STACKED SEMICONDUCTOR PACKAGE USING IMPROVED TECHNIQUE OF FORMING THROUGH VIA - A method of manufacturing a stacked semiconductor package using an improved technique of forming a through via in order to enable 3-dimensional vertical interconnection of stacked packages is provided. The method includes forming a seed layer required for forming a via core on a bottom surface of a wafer, forming at least one via hole vertically through the wafer, forming a via core in the via hole, insulating the via hole from the via core, and removing the seed layer from the bottom surface of the wafer. The stacked semiconductor package is suitable for high-speed signal transmission.	02-25-2010
20110044696	OPTICAL COMMUNICATION MODULE - An optical communication module which uses a single optical fiber to enable bidirectional communication or multiplexing communication is provided. The optical communication module includes a platform configured to have a through-hole therein which vertically passes through the platform; an optical receiver configured to be provided on the platform and include a light-receiving element; an optical transmitter configured to be provided on the platform and include a light-emitting element; and an optical filter configured to be provided on one surface of the platform to correspond to the through-hole, transmit light from the light-emitting element to an optical line, and transmit light input through the optical line to the light-receiving element, where one of the light-receiving element and the light-emitting element is provided on one surface of the platform on an opposite side of the optical line with the optical filter interposed therebetween, and the other is provided on the other surface of the platform to correspond to the through-hole. Accordingly, it is possible to reduce the manufacturing cost, minimize the optical or electrical crosstalk, and maximize the optical coupling efficiency.	02-24-2011

Kwon-Seob Lim, Gwangiu-Si KR

Patent application number	Description	Published
20100021108	OPTICAL WAVEGUIDE DEVICE AND OPTICAL COMMUNICATION MODULE - An optical waveguide device and an optical communication module are provided. In the optical waveguide device which includes a core and a cladding layer formed around the core and has one end formed to be inclined so as to refract input and output signals, the core includes therein a diffraction portion for diffracting an optical signal incident through the cladding layer to propagate straight through the core. Thus, it is possible to prevent deterioration of an optical signal coupling ratio in implementing a technique of transmitting optical signals in opposite directions.	01-28-2010

Kwon-Seob Lim, Gwangjoo-City KR

Patent application number	Description	Published
20090148160	Optical diplexer module using mixed-signal multiplexer - An optical diplexer module includes: an optical diplexer module comprising: a multiplexing unit multiplexing RF signals and a wideband digital signal having a baseband bandwidth to output a single multiplexed signal; an E-O converter converting the multiplexed signal into an optical signal and externally outputting the optical signal; and an O-E converter converting an externally received optical signal into an electric signal and outputting the electric signal. Similarly to existing optical transceivers, the optical diplexer module can provide TPS and MPS services using only two optical wavelengths for upstream and downstream signals. Since no separate optical wavelength is additionally required, the optical diplexer module can allows the numbers of components and processes to be reduced. It may result in yield improvement and cost reduction. Also, since electric or optical crosstalk between modules can be reduced, its performance can be improved.	06-11-2009