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Kweon
Chol-Bum Kweon, Bel Air, MD US
| Patent application number | Description | Published |
|---|---|---|
| 20110320104 | ENGINE COMBUSTION CONTROL USING IGNITION DWELL - An engine control system, a controller for the engine control system, and a method of controlling a combustion process in an internal combustion engine operating at an engine operating condition. The engine control is based on closed-loop control of ignition dwell. Ignition dwell is defined as time or crank angle difference between an end of fuel injection (EOI), or some other aspect of an injection control signal, and a start of combustion (SOC), or some other aspect of an internal combustion event. One or more engine control devices, such as a fuel injector or an exhaust gas recirculation valve may be varied to control ignition dwell. By providing such a closed-loop engine control based on ignition dwell, the air/fuel charge mixture, and/or stratification present in the combustion chamber at the moment combustion starts may be controlled. Advanced combustion systems utilizing premixed compression ignition (PCI) offer the benefit of low temperature combustion for simultaneous low NOx and particulate emissions with high fuel economy. Combustion control based on ignition dwell can be used to optimize engine emissions and fuel consumption for PCI over the operating range. | 12-29-2011 |
Chol-Bum M. Kweon, Bel Air, MD US
| Patent application number | Description | Published |
|---|---|---|
| 20110276255 | METHOD OF MULTIPLE INJECTION TIMING CONTROL - A method for adjusting fuel injection timing in an internal combustion engine including a cylinder and configured to operate multiple fuel injections in the cylinder per combustion cycle includes monitoring in-cylinder pressure through a first combustion cycle, determining actual combustion phasing metrics based upon the in-cylinder pressure, monitoring a baseline fuel injection timing comprising a first injection timing and a second injection timing, providing expected combustion phasing metrics based upon the baseline fuel injection timing, comparing the actual combustion phasing metrics to the expected combustion phasing metrics, and adjusting the baseline fuel injection timing in a second combustion cycle based upon the comparing. | 11-10-2011 |
Chol-Bum M. Kweon, Belair, MD US
| Patent application number | Description | Published |
|---|---|---|
| 20100280701 | FUEL SYSTEM DIAGNOSTICS BY ANALYZING CYLINDER PRESSURE SIGNAL - A method for diagnosing combustion within a direct-injection, internal combustion engine including a plurality of combustion chambers and operative lean of stoichiometry includes monitoring pressure readings in the plurality of combustion chambers across engine crank angles, estimating a mass fraction burn percentage for each pressure reading, determining respective crank angles corresponding to a predetermined mass burn percentage for each combustion chamber, comparing said determined crank angles for sequential ones of the plurality of combustion chambers, and indicating an abnormal combustion event if compared crank angles differ by a predetermined angle. | 11-04-2010 |
Giyoung Kweon, Salina, KS US
| Patent application number | Description | Published |
|---|---|---|
| 20110106451 | MULTIPLE SENSOR SYSTEM AND METHOD FOR MAPPING SOIL IN THREE DIMENSIONS - A multi-sensor system rapidly measures diffuse reflectance of soil, soil conductivity, and other soil properties in situ, in three dimensions. The system includes a tractor-drawn implement containing a sensor shank used for X-Y axis measurements, a hydraulic probe implement containing a sensor probe for −Z axis measurements, and a set of visible and near-infrared spectrometers, controls, and firmware that are shared by each implement. Both implements include optical sensors and soil electrical conductivity sensors. The probe implement incorporates a sensor that measures insertion force, and the shank implement includes a soil temperature sensor. These combinations of sensors are used to calibrate the system and to characterize the soil properties within a field or area. Geo-referenced soil measurements are collected with the shank implement to identify optimal locations for conducting sensor probe insertions. The probe implement is then used for sensor probing and for collecting soil core samples for lab analysis. | 05-05-2011 |
Insoo Kweon, Ishikawa-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090274377 | Clustering System and Image Processing System Having the Same - [Subject] It is to provide a clustering system, the processing speed of which is high and which can perform clustering with high accuracy and to provide an image processing system having the clustering system. | 11-05-2009 |
Meera Kweon, Morris Plains, NJ US
| Patent application number | Description | Published |
|---|---|---|
| 20100080883 | PRODUCTION OF LOW CALORIE, EXTRUDED, EXPANDED FOODS HAVING A HIGH FIBER CONTENT - An extruded, directly expanded, high fiber reduced calorie food product, such as a ready-to-eat (RTE) cereal or sweet or savory snack, is produced at high production rates without substantial loss of extrusion functionality and extrudability by replacing a substantial portion of at least one flour with a gelatinized, enzyme-resistant starch type III ingredient or bulking agent as a reduced-calorie, high fiber flour replacer. The resistant starch type III ingredient or bulking agent contains an enzyme-resistant starch type III having a melting point with an endothermic peak temperature of at least about 140° C., and may have a water-holding capacity of less than 3 grams water per gram of the starch-based bulking agent. The total dietary fiber retention of the gelatinized, starch-based bulking agent may be at least about 90% by weight after the extrusion using a die temperature of least about 100° C., and a die pressure of at least about 150 psig. | 04-01-2010 |
Mee-Ra Kweon, Randolph, NJ US
| Patent application number | Description | Published |
|---|---|---|
| 20090211570 | PROCESS FOR MAKING ENZYME-RESISTANT STARCH FOR REDUCED-CALORIE FLOUR REPLACER - An enzyme resistant starch type III having a melting point or endothermic peak of at least about 140° C. as determined by differential scanning calorimetry (DSC) is produced in yields of at least about 25% by weight, based upon the weight of the original starch ingredient. A gelatinization stage, nucleation/propagation stage, and preferably a heat-treatment stage are used to produce reduced calorie starch-based compositions which contain the enzyme resistant starch type III. The high melting point of the enzyme resistant starch permits its use in baked good formulations without substantial loss of enzyme resistance upon baking. A gelatinized, starch-based bulking agent having at least 30% by weight of the enzyme-resistant starch may be used in bar-type, extruded, sheeted, or rotary molded food products. The melting enthalpy of the bulking agent may be from about 0.5 to about 4 Joules/g and its water-holding capacity may be less than 3 grams. | 08-27-2009 |
| 20110293788 | Process for Making Enzyme-Resistant Starch for Reduced-Calorie Flour Replacer - An enzyme resistant starch type III having a melting point or endothermic peak of at least about 140° C. as determined by differential scanning calorimetry (DSC) is produced in yields of at least about 25% by weight, based upon the weight of the original starch ingredient. A gelatinization stage, nucleation/propagation stage, and preferably a heat-treatment stage are used to produce reduced calorie starch-based compositions which contain the enzyme resistant starch type III. The high melting point of the enzyme resistant starch permits its use in baked good formulations without substantial loss of enzyme resistance upon baking. A gelatinized, starch-based bulking agent having at least 30% by weight of the enzyme-resistant starch may be used in bar-type, extruded, sheeted, or rotary molded food products. The melting enthalpy of the bulking agent may be from about 0.5 to about 4 Joules/g and its water-holding capacity may be less than 3 grams. | 12-01-2011 |
Young Do Kweon US
| Patent application number | Description | Published |
|---|---|---|
| 20110129960 | Method of manufacturing stacked wafer level package - A method of manufacturing a stacked wafer level package includes: preparing a substrate; forming a conductive layer on the substrate; forming chip connection pads and internal connection pads on the conductive layer; forming solder balls connected to the internal connection pads; mounting a semiconductor chip on the conductive layer to be connected to the chip connection pads; forming a sealing member to seal the solder balls and the semiconductor chip; separating the substrate from the conductive layer; forming a rearrangement wiring layer by etching the conductive layer; forming an external connection on the rearrangement wiring layer; forming contact holes in the sealing member to expose the solder balls; and stacking an electronic component to be electrically connected to the solder balls exposed through the contact holes. | 06-02-2011 |
Young Do Kweon, Boise, ID US
| Patent application number | Description | Published |
|---|---|---|
| 20100237494 | PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES - Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed. | 09-23-2010 |
| 20110169154 | MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES - Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies. | 07-14-2011 |