| Patent application number | Description | Published |
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| 20100000932 | FILTER APPARATUS CAPABLE OF RELEASING AIR - [Problems] To provide a filter apparatus improved in operability and maintainability during an air releasing operation for a filter apparatus by promoting a reduction in the size of a filter apparatus capable releasing air for a chemical solution. | 01-07-2010 |
| 20100029947 | Pyridyltetrahydropyridines and Pyridylpiperidines, and Method of Manufacturing Them - The present invention provides pyridine derivatives useful as intermediates of drugs and agricultural chemicals, electrophotographic receptors, dyes and so on. More specifically, the invention relates to novel pyridyltetrahydropyridines and novel pyridylpiperidines, and further to a method of manufacturing pyridine derivatives through reaction between bipyridine derivatives and benzyl halide or benzyloxycarbonyl halide and subsequent reduction of the resultant reaction products with the aid of palladium catalysts, platinum catalysts, ruthenium catalysts or rhodium catalysts. | 02-04-2010 |
| 20100032655 | Field-effect transistor - Disclosed is a field-effect transistor characterized by using a compound represented by the formula (1) below as a semiconductor material. | 02-11-2010 |
| 20100137617 | METHOD FOR PRODUCING AROMATIC COMPOUND - Disclosed is a method for producing an aromatic compound represented by the general formula (2) below, which is characterized in that a compound represented by the general formula (1) below is reacted with a sulfur compound (at least one member selected from the group consisting of sulfur, hydrogen sulfide, metal hydrosulfides and metal sulfides) or a selenium compound. (In the formula (1), R | 06-03-2010 |
| 20110204295 | Novel Heterocyclic Compound And Use Thereof - Disclosed are a heterocyclic compound characterized by being represented by formula (1), and a composition of the compound. Also disclosed is an organic electronic device using the compound. (In formula (1), X | 08-25-2011 |
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| 20090243097 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CONSTANT FILM AND MANUFACTURING METHOD THEREOF - A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks. | 10-01-2009 |
| 20100019371 | SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING IN A WAFER STATE AND MANUFACTURING METHOD THEREOF - In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened. | 01-28-2010 |
| 20100144095 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM - First, a trench formed in parts of a semiconductor wafer, a sealing film and others corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entirety including the separated silicon substrates from being easily warped. | 06-10-2010 |
| 20100144096 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM - First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped. | 06-10-2010 |
| 20100144097 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM - First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped. | 06-10-2010 |
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| 20100265177 | ELECTRONIC APPARATUS, DISPLAY CONTROLLING METHOD AND PROGRAM - An electronic apparatus includes an image-capturing direction acquiring unit that acquires an image-capturing direction as a direction in which an object included in a captured image exists based on an image-capturing position during the image-capturing of the captured image, a converting unit that converts a map including the image-capturing position so that the acquired image-capturing direction on the map corresponds with a specific direction on a display plane where the map is displayed, and a display controlling unit that causes the display of the converted map in association with the captured image. | 10-21-2010 |
| 20100266269 | Imaging equipment, photographic setting determination method, and photographic setting determination program - Imaging equipment includes: a position acquisition unit that acquires a current position; a memory unit in which a plurality of pieces of setting information representing photographic settings suitable for photography at positions and being associated in advance with the positions is stored; a control unit that reads setting information, which represents a photographic setting suitable for photography at the current position acquired by the position acquisition unit, from the memory unit, and determines a photographic setting according to the setting information; and an imaging unit that images a subject according to the photographic setting determined by the control unit. | 10-21-2010 |
| 20100321472 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND PROGRAM - An image processing apparatus includes a receiving unit receiving communication data including L and R images, an attribute information acquisition unit acquiring, from the communication data, attribute information including a photographing time, and an output control unit analyzing the images and the attribute information and switching between three-dimensional image display and two-dimensional image display. If L and R images photographed at the same photographing time have been acquired, the control unit performs three-dimensional image display. If not, the control unit determines whether or not an object imaging position error occurring in three-dimensional image display using L and R images photographed at different photographing times does not exceed a preset permissible object imaging position error, performs three-dimensional image display using the L and R images photographed at different photographing times if the error does not exceed the permissible error, and performs two-dimensional image display if the error exceeds the permissible error. | 12-23-2010 |
| 20110007131 | Information processing apparatus and information processing method - An information processing apparatus includes a depth-information detecting section, a comparison/detection section, and a control unit. The depth-information detecting section is provided for detecting a peak position of an object in a depth direction, at which the object is displayed at the front in an additional information display area. The comparison/detection section is provided for making a comparison between depth information of the additional information and the peak value of the stereoscopic video data to detect a positional relationship between the stereoscopic data and the display position of the additional information in the depth direction. The control unit is provided for controlling the stereoscopic video data and the display position of the additional information in response to the positional relationship between the stereoscopic video data and the display position of the additional information. | 01-13-2011 |
