Kutlu
Burak Kutlu, Seattle, WA US
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20100322850 | NEW PLASMA MEMBRANE BIOMARKERS PREFERENTIALLY EXPRESSED IN PANCREATIC BETA CELLS USEFUL IN IMAGING OR TARGETING BETA CELLS - The present invention is directed to the identification of a biomarker specifically located in the plasma membrane of pancreatic beta cells. It was selected by a Systems Biology approach on Massively Parallel Signal Sequencing datasets obtained in human islets and Affymetrix microarray datasets on human islets, purified rat primary beta and non beta cells and insulinoma cells. Based on a set of specific features the biomarker is a unique candidate for imaging and targeting strategies to study the pancreatic beta cell mass in health and disease (T1 D, T2D, pancreatic cancers, obesity, islet transplantation, beta cell regeneration). The five specific features of the selected biomarkers are: 1) Preferentially expressed in pancreatic islets as compared to surrounding tissues; 2) Higher expression in pancreatic beta cells than in pancreatic alpha cells or than in other islet non-beta cells; 3) Expression levels in pancreatic beta cells are higher or comparable to glucokinase which is an enzyme specifically expressed in the pancreatic beta cell; 4) Located in the membrane and as such targetable with antibodies, peptides or small molecules which allows imaging, targeting and immunohistochemistry; and 5) Expression is not induced during the process of inflammation of the beta cell mass and the protein is not enriched in T-cells and dendritic cells or in other cells participating in the inflammation process. | 12-23-2010 |
Gokhan Kutlu, Seattle, WA US
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20100153864 | ADAPTABLE TRANSFER AND PUBLICATION OF DIGITAL MEDIA - An adaptable method for facilitating user interaction with digital media objects. Representations of substantially-reduced data size of each of the digital media objects are transferred before the transfer of copies of the original data size of each of the digital media objects so as to enable earlier user interaction. The user interaction includes, for example, requesting modifications to the object. The method provides feedback of any requested action from the user interaction with the substantially-reduced data size representations and in response thereto, determines as a function of the requested action whether to reprioritize transfer of untransferred original data size copies of the corresponding digital media object. The method provides for modification of copies that are to be transferred according to modifications requested by the user with respect to the transferred substantially-reduced data size representations. The method can be used for audio, video, image, and other digital media objects. | 06-17-2010 |
20130024843 | METHODS AND APPARATUS FOR APPLICATION PERFORMANCE AND CAPACITY ANALYSIS - A computer-implemented method is provided for determining the performance of an application platform that includes one or more applications associated with a plurality of resources of a computer system. The method includes disposing a plurality of synthetic resource consumers within the application platform, each synthetic resource consumer configured to consume at least one of the plurality of resources. A workload profile is provided to the plurality of synthetic resource consumers. The workload profile includes parameters specifying resource consumption by the plurality of synthetic resource consumers. Performance data is acquired based on the impact of the workload profile on the plurality of resources and the plurality of applications. | 01-24-2013 |
Oktay Kutlu, Seyhan-Adana TR
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20100064622 | INSULATING LIGHT WALL BUILDING ELEMENTS - This light wall building construction element with insulation is to be used in the building of the internal and external walls of buildings and in the ceiling asmolen application. The objective is to provide heat, sound and water insulation with a single product without using additional insulation materials and to reduce the load of the building by a considerable degree. Polystyrene strapor or polyurethane materials used as insulation materials in the construction sector are used in the production of the external unit ( | 03-18-2010 |
Zafer Kutlu, Menlo Park, CA US
Patent application number | Description | Published |
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20080290502 | INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE - An integrated circuit die includes a circuit surface and a back surface opposite the circuit surface. An underbump metallurgy is formed on a back surface. A layer of solder is formed on the underbump metallurgy. | 11-27-2008 |
20090008767 | INTEGRATED CIRCUIT PACKAGE WITH SPUTTERED HEAT SINK FOR IMPROVED THERMAL PERFORMANCE - An integrated circuit package includes an integrated circuit die having a circuit surface and a back surface opposite the circuit surface. A layer of ductile material is deposited on the back surface of the integrated circuit die. | 01-08-2009 |
20120018901 | FLIP-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME USING ABLATION - A method of manufacturing a flip-chip package and a flip-chip package manufactured by such method. In one embodiment, the method includes: (1) mounting a die to a first die, (2) encapsulating the second die with a molding compound and (3) selectively ablating the molding compound based on an expected heat generation of portions of the second die to reduce a thickness of the molding compound proximate the portions. | 01-26-2012 |
Zafer S. Kutlu, Menlo Park, CA US
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20090218680 | PROCESS OF GROUNDING HEAT SPREADER/STIFFENER TO A FLIP CHIP PACKAGE USING SOLDER AND FILM ADHESIVE - A method of grounding a heat spreader/stiffener to a flip chip package comprising the steps of attaching an adhesive film to a substrate and attaching a stiffener to the adhesive film. The adhesive film may have a number of first holes corresponding with a number of grounding pads on the substrate. The grounding pads may be configured to provide electrical grounding. The stiffener may have a number of second holes corresponding with the number of first holes of the adhesive film and number the grounding pads of the substrate. The grounding pads are generally exposed through the first and the second holes. | 09-03-2009 |