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Kushima, JP
Hideaki Kushima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20120132325 | FERRITIC Cr-STEEL FOR HEAT-RESISTANT PRECISION COMPONENT AND METHOD FOR PRODUCING SAME, AND HEAT-RESISTANT PRECISION COMPONENT AND METHOD FOR PRODUCING SAME - A ferritic Cr-steel for a heat-resistant precision component contains Cr in an amount of from 13% by mass to 30% by mass, and has a thermal expansion coefficient of 15×10 | 05-31-2012 |
Hidekiyo Kushima, Kawasaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090017882 | RADIO COMMUNICATION TERMINAL, RADIO COMMUNICATION TERMINAL HOUSING CASE, RADIO COMMUNICATION TERMINAL SHEET AND RADIO COMMUNICATION TERMINAL DISPLAY DEVICE - A radio communication terminal of one example of the present invention is a radio communication terminal provided with an electronic device shielded to prevent electromagnetic interference, in a housing, and comprises an integrated circuit, a first resonant circuit for making non-contact communication with an external device, and a second resonant circuit resonating with the first resonant circuit. | 01-15-2009 |
Hiroaki Kushima, Kawasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090059431 | SUSPENSION, HEAD GIMBALS ASSEMBLY, METHOD FOR MANUFACTURING HEAD GIMBALS ASSEMBLY, STORAGE APPARATUS, AND APPARATUS FOR MANUFACTURING HEAD GIMBALS ASSEMBLY - This head gimbals assembly has a head slider, a flexure, and a load beam. The head slider has a head element and slider-side connection terminals. The flexure has a free end, a fixed end, a slider mounting portion and suspension-side connection terminals connected to the slider-side connection terminals. The load beam fixes a fixed end of the flexure on the side opposite to a flexure surface on which the head slider is mounted a connecting portion for interconnecting the suspension-side connection terminals and the slider mounting portion has higher resiliency than other portion of the connecting portion. According to a suspension in the present embodiment, a head gimbals assembly can be easily manufactured without wastefully discarding the suspension even when the desired evaluation result is not obtained because of problems in the head characteristics and the floating surface of the head slider. | 03-05-2009 |
| 20090280358 | PATTERNED MEDIUM AND METHOD OF PRODUCING PATTERNED MEDIUM - A patterned medium is produced by forming a cover layer on a provisional substrate which has a flat surface, forming a patterned recording layer on the cover layer, forming a reinforcing layer on the recording layer in order to form a recording part which is formed by the cover layer, the recording layer and the reinforcing layer, bonding one surface of a main substrate on the reinforcing layer of the recording part, and removing the provisional substrate after bonding the main substrate on the reinforcing layer. | 11-12-2009 |
Hiroaki Kushima, Ome-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110317311 | HEAD AND DISK DRIVE WITH THE SAME - According to one embodiment, a head includes a slider including a supporting surface opposed to a surface of a rotatable recording medium, and a head section on the slider, configured to record data on and reproduce data from the recording medium. The supporting surface includes a negative-pressure cavity in the supporting surface to produce a negative pressure, a leading step on an inflow side of the airflow in relation to the negative-pressure cavity, a trailing step on an outflow side of the airflow in relation to the negative-pressure cavity, and including the head section, and a pad provided outside the trailing step at an outflow end part of the negative-pressure cavity, and open in at least one of a central side of the slider and an outflow end side of the slider. | 12-29-2011 |
Mami Kushima, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090134201 | Work Clamp and Wire Bonding Apparatus - A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing a use amount of antioxidant gas are provided. The work clamp according to the present invention includes an interior hollow portion | 05-28-2009 |
Satoshi Kushima, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090015555 | INPUT DEVICE, STORAGE MEDIUM, INFORMATION INPUT METHOD, AND ELECTRONIC APPARATUS - An optical input device has a display screen, a portion of the display screen being shielded from light by an operating member to implement input processing based on a plurality of input modes. The input device includes an input detection unit including a display unit that displays predetermined input information, and a control unit. The input detection unit detects an area and/or brightness of a light-shielded portion formed on the display screen by the operating member by approaching the display unit. The control unit provides display control of the display unit and input control on the basis of the detected area and/or brightness. The control unit compares the detected area and/or brightness with a predetermined threshold value to select a desired input mode from among the plurality of input modes. | 01-15-2009 |
| 20090079698 | INPUT DEVICE AND ELECTRONIC APPARATUS - An input device inputs information by a slide operation depending on an operation body. The device contains a housing having an operation surface, a detection unit that is provided in the housing and includes an electrostatic capacitance sheet member which detects a slide position of the operation body to output a position detection signal, and an operation unit that covers an entire surface of the detection unit and is slide-operated along the operation surface of the housing. The operation unit has a convex shape which becomes thicker along a sliding direction from one direction of the operation surface of the housing and also which becomes thinner toward the other direction of the operation surface thereof. The electrostatic capacitance sheet member includes a switch portion that is switched by a press-in operation of the operation body to the operation unit. | 03-26-2009 |
| 20090103250 | INPUT DEVICE AND ELECTRONIC APPARATUS - An input device that inputs information by a slide operation depending on an operation body contains a housing including an operation surface, a detection unit that is provided in the housing and detects a slide position inputted by a slide operation depending on the operation body, and an operation unit that covers at least a portion of the detection unit and is slide-operated along the operation surface of the housing. The operation unit has a convex shape which becomes thicker along the sliding direction from one portion of the operation surface of the housing and also which becomes thinner toward the other portion of the operation surface thereof. | 04-23-2009 |
Takahito Kushima, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20110018614 | SEMICONDUCTOR SWITCH - A challenge in outputting a voltage near the midpoint potential in a semiconductor switch which operates based on a low voltage power supply is to avoid a decrease in operation speed and a deterioration in accuracy of the output voltage which would be caused due to an increase in ON-resistance or occurrence of current leakage. Thus, a structure including a gray level generation circuit, an analog switch circuit and a backgate voltage control circuit is provided wherein the backgate voltage of each of an N-channel MOS transistor and a P-channel MOS transistor of the analog switch circuit to which the voltage of the gray level generation circuit is input is supplied from the backgate voltage control circuit which has an equal structure as that of the gray level generation circuit. | 01-27-2011 |
Yoshimasa Kushima, Yamanashi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090243094 | Semiconductor device and manufacturing method thereof - The semiconductor device comprises a first area and a second area positioned adjacent to the outside of the first area, the semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first area and each of the side surfaces is positioned at a boundary between the first area and the second area, a plurality of pads formed over the main surface of the semiconductor substrate and a plurality of external connecting terminals formed thereon, which are respectively electrically connected to the pads, a first resin portion which is formed over the main surface of the semiconductor substrate so as to cover the pads and has a main surface and side surfaces, and which is formed in such a manner that the external connecting terminals are exposed from the main surface and each of the side surfaces is positioned at the boundary, and a second resin portion which is positioned in the second area and formed so as to cover the side surfaces of the semiconductor substrate and the side surfaces of the first resin portion and which is different in composition from the first resin portion. | 10-01-2009 |
| 20100151628 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - An improved manufacturing method for semiconductor devices is provided. This method can prevent chips and cracks from being generated when the rear face of the semiconductor substrate is polished. The manufacturing method includes preparing a semiconductor substrate having a front face and a rear face. The front face has an inner surface area and a peripheral surface area. Circuit elements are provided in the inner surface area of the semiconductor substrate. The manufacturing method also includes sealing the circuit elements with circuit sealing resin. The manufacturing method also includes providing cured resin in the peripheral surface area of the semiconductor substrate. The manufacturing method also includes polishing the rear face of the semiconductor substrate after the circuit sealing step. The manufacturing method also includes cutting the semiconductor substrate after the substrate polishing step so as to obtain semiconductor devices. | 06-17-2010 |
| 20120100693 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a semiconductor device formed by fractionization and division after a plurality of semiconductor elements are formed over a semiconductor substrate, includes forming a first resist portion over the semiconductor substrate prior to its fractionization. Trenches are formed in areas for dicing the semiconductor substrate. A second resin portion different in composition from the first resin portion is formed in each of the trenches. The semiconductor substrate is diced with respect to the second resin portion with widths each narrower than the trench thereby to bring the semiconductor device into fractionization and division. | 04-26-2012 |