| Patent application number | Description | Published |
|---|
| 20090321912 | Semiconductor device and method of manufacturing the same - A semiconductor device includes a substrate, a semiconductor chip, and first and second insulations. The substrate has at least a first region and a second region. The semiconductor chip structure covers the first region. The first insulation covers the second region. The first insulation has a first thermal expansion coefficient approximately equal to that of the semiconductor chip structure. The second insulation covers the semiconductor chip structure and the first insulation so that the semiconductor chip structure and the first insulation are sandwiched between the substrate and the second insulation. The second insulation has a second thermal expansion coefficient approximately equal to that of the substrate. | 12-31-2009 |
| 20100148172 | Semiconductor device - A semiconductor device includes: a semiconductor chip; a plurality of electrode pads on the semiconductor chip; a wiring board fixed to the semiconductor chip; a plurality of connection pads on the wiring board; a plurality of bonding pads aligned along two sides of the wiring board; and a plurality of leads on the wiring board. The plurality of electrode pads is in a center region of the semiconductor chip. The plurality of second connection pads faces the plurality of electrode pads. The plurality of leads connects the plurality of connection pads to the plurality of bonding pads. | 06-17-2010 |
| 20100252923 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - A semiconductor device of the present invention includes a semiconductor chip formed with an electrode pad on a front side thereof, a wiring board having a wiring pattern, the wiring board having a front side opposing the back side of the semiconductor chip, a wire for electrically connecting the electrode pad of the semiconductor chip with the wiring pattern of the wiring board, an external terminal arranged on the back side of the wiring board for electrical connection with the electrode pad through the wire and the wiring pattern, and a sealant for fixing the semiconductor chip on the front side of the wiring board so as to form a hollow which is continuous to a portion straddling the entirety of the back side of the semiconductor chip and the front side of the wiring board, and continuous to a portion adjacent to at least one outer peripheral surface of the semiconductor chip except for the back side of the same. The wiring board includes a throughhole in communication with the hollow. | 10-07-2010 |
| 20100258933 | Semiconductor device, method of forming the same, and electronic device - A semiconductor device includes a substrate, a stack of semiconductor chips, and a first sealing material. The substrate may include, but is not limited to, a chip mounting area and a higher-level portion. The higher level portion surrounds the chip mounting area. The higher-level portion is higher in level than the chip mounting area. The stack of semiconductor chips is disposed over the chip mounting area. A first sealing material seals the stack of semiconductor chips. The first sealing material is confined by the higher-level portion. | 10-14-2010 |
| 20100301468 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device may include, but is not limited to a wiring board, a first insulator, a semiconductor chip, and a second insulator. The first insulator penetrates the wiring board. A top end of the first insulator is higher in level than an upper surface of the wiring board. The semiconductor chip is disposed on the top end of the first insulator. The semiconductor chip is separated from the upper surface of the wiring board. The second insulator covers the semiconductor chip and the upper surface of the wiring board. | 12-02-2010 |
| 20110006418 | SEMICONDUCTOR DEVICE PROVIDED WITH WIRE THAT ELECTRICALLY CONNECTS PRINTED WIRING BOARD AND SEMICONDUCTOR CHIP EACH OTHER - In one embodiment, a semiconductor device includes a printed wiring board provided with a connection pad, a semiconductor chip provided with an electrode pad and a conductive wire. One end of the conductive wire is connected to the connection pad of the printed wiring board and the other end of the conductive wire is connected to the electrode pad of the semiconductor chip. The semiconductor chip is mounted on the printed wiring board so that the first surface of the semiconductor chip provided with the electrode pad is oriented opposite to the printed wiring board. A first insulating layer is formed on the first surface of the semiconductor chip oriented opposite to the printed wiring board. A thermoplastic second insulating layer is formed on the first insulating layer. Part of the conductive wire between one end and the other end is buried in the second insulating layer. | 01-13-2011 |
