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Kuroiwa, Kanagawa

Hiroshi Kuroiwa, Kanagawa JP

Patent application numberDescriptionPublished
20110102931HARD DISC DEVICE CONTROL CIRCUIT AND HARD DISC DEVICE - A head of a hard disc device is retracted to a predetermined position by operating a VCM (Voice Coil Motor) driver. Trouble in a hard disc is detected and retraction is performed even if a short circuit occurs in either of the output line of a VCM driver in an input end of a high potential side or in an input end of a low potential side. A ground short circuit is detected in each side separately and different retracting methods are executed for each case.05-05-2011

Jun Kuroiwa, Kanagawa JP

Patent application numberDescriptionPublished
20090072275SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THEREOF AS WELL AS DRIVING METHOD OF SOLID-STATE IMAGING DEVICE - A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.03-19-2009
20090072336Solid-state imaging device and method for manufacturing thereof as well as driving method of solid-state imaging device - A solid-state imaging device having an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.03-19-2009
20090075418SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THEREOF AS WELL AS DRIVING METHOD OF SOLID-STATE IMAGING DEVICE - A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.03-19-2009
20090078976SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THEREOF AS WELL AS DRIVING METHOD OF SOLID-STATE IMAGING DEVICE - A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.03-26-2009
20090078977SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THEREOF AS WELL AS DRIVING METHOD OF SOLID-STATE IMAGING DEVICE - A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.03-26-2009
20110298024SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THEREOF AS WELL AS DRIVING METHOD OF SOLID-STATE IMAGING DEVICE - A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.12-08-2011

Patent applications by Jun Kuroiwa, Kanagawa JP

Natsuki Kuroiwa, Kanagawa JP

Patent application numberDescriptionPublished
20120012593STRUCTURE AND MANUFACTURING METHOD FOR PRESSURE VESSEL - A pressure vessel structure includes a vessel main body, and a grid layer provided on a periphery of the vessel main body and including a plurality of grid lines formed by intersecting strip-form raw materials so as to overlap alternately. Thus, a burst pressure of the pressure vessel is increased.01-19-2012

Tatsuo Kuroiwa, Kanagawa JP

Patent application numberDescriptionPublished
20100061125Flyback boost circuit and strobe device using the same - A flyback boost circuit includes an output voltage detection terminal provided to a secondary winding of a transformer of the flyback boost circuit, and configured to detect an output voltage. Prior to the start of a boost operation, current is supplied to a secondary side of the transformer via the output voltage detection terminal to detect a voltage generated at the output voltage detection terminal, to thereby detect an unwired state by determining whether or not there is floating of the output voltage detection terminal or a grounding terminal of the secondary winding of the transformer.03-11-2010

Toshimitsu Kuroiwa, Kanagawa JP

Patent application numberDescriptionPublished
20080213028Stick-Shaped Solid Cosmetics and Method for Producing the Same - Stick-shaped solid cosmetic 09-04-2008