| Patent application number | Description | Published |
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| 20100136229 | WARM SPRAY COATING METHOD AND PARTICLES USED THEREFOR - A coating method of the invention is characterized by using particles each being an aggregate comprising particles far smaller than that, and heating them at a temperature lower than the melting point and blowing and depositing the same to an object to be treated at a supersonic velocity. The warm spray of the invention is characterized in that standard particles and addition particles with a particle diameter larger than that are mixed so that the K-value determined by the following relation is 1 or more and 2 or less: K=A×(B/C)×D, A: mass % of the content of additive particles, B: center particle diameter of standard particle (μm), C: center particle diameter of additive particle (μm), D: (maximum particle diameter−minimum particle diameter) of additive particle/10 (μm). The invention intends to deposit micro oxide crystals without using an adhesive or the like, with no alteration to the function thereof, and also attain a dense layer with no substantial voids. | 06-03-2010 |
| 20100183842 | RESIN COATED MEMBER AND METHOD OF RESIN COATING - Provided is a resin coated member produced according to a coating method through HVOF spraying that comprises generating a combustion jet in a combustion chamber connected to one end of a barrel while controlling the temperature of the combustion jet by supply of an inert gas to the jet, feeding resin coating materials into the temperature-controlled combustion jet and leading them to pass through the barrel, and spouting the coating particles through a spout port along with the combustion jet therethrough to thereby coat the substrate surface; wherein the length of the barrel, the temperature of the combustion jet and the physical properties of the coating particles are defined so as to satisfy both the following formulae (1) and (2), and wherein the interface between the coating material and the substrate surface has a structure of such that the two break in each other with at least micron-pitch irregularities. | 07-22-2010 |
| 20100304036 | METALLIC FILM FORMING METHOD USING HVOF THERMAL SPRAYING GUN AND THERMAL SPRAYING APPARATUS - There are provided a thermal spraying method and a thermal spraying apparatus therefore, in which a gas shroud is disposed in an HVOF thermal spraying gun barrel, the velocity of metallic particles is energized and accelerated with respect to the metallic particle to be thermally sprayed from the gun, and inert gas is supplied into the space defined inside of the shroud through a circumferential slit formed in such a manner as to shield the metallic particles from the atmosphere so as to collide with the surface of a base member, thereby forming a thermally sprayed dense film having a small oxygen content without overheating the base plate by an HVOF method. | 12-02-2010 |
| 20110168056 | ALLOY PARTICLE AND WIRE USED IN AIR PLASMA SPRAY OR WIRE ARC SPRAY - The present invention relates to improvement in alloy powder particles or wires used as a source material in atmospheric plasma spray and wire arc spray to reduce the amount of oxides on the thermal-sprayed coating. | 07-14-2011 |
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| 20090067787 | Optical System and Method of Manufacturing the Same - An optical system comprising a substrate and an optical waveguide which is formed on the substrate and to which optical fibers are optically coupled. The optical waveguide has a plurality of straight core portions which obliquely intersect each other. The substrate has positioning sections for positioning a plurality of optical fibers optically coupled to two or more of the plurality of the core portions, the positioning sections having grooves on which the respective optical fibers are supported. When the plurality of optical fibers are supported on the respective grooves, offsets between centers of the plurality of the core portions and respective centers of the plurality of the optical fibers coupled to the core portions are equal to or less than 5 μm. | 03-12-2009 |
| 20100172608 | OPTICAL DEVICE, OPTICAL SYSTEM, AND METHOD OF MANUFACTURING OPTICAL DEVICE - An optical device to be connected to an optical fiber and an optical system in which the optical fiber is fixed to the optical device are provided, which optical device and optical system can restrict variations in a distance between inclined surfaces for supporting the optical fiber, and can enhance a productivity of the optical device and system. The optical system according to the present invention is, for example an optical multiplexer/demultiplexer having an optical device according to the present invention, which device has a substrate ( | 07-08-2010 |
| 20100310214 | OPTICAL CONNECTING STRUCTURE - An optical connecting structure has an optical fiber, a pressing member having a circular outer cross section, and an optical member, wherein the optical member has an optical element, an optical fiber stopper structure, and an optical fiber holding groove, wherein the optical fiber stopper structure is positioned between the optical element and the optical fiber holding groove, wherein the optical fiber is inserted along the optical fiber holding groove so as to contact with the optical fiber stopper structure, and wherein the pressing member is arranged on the optical fiber holding groove mutually perpendicular, the pressing member presses the upper surface of the optical fiber to a direction of a bottom of the optical fiber holding groove, and the optical fiber and the optical element are thereby optically connected. | 12-09-2010 |
| 20110013865 | METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING OPTOELECTRIC COMPOSITE MEMBER, AND METHOD OF MANUFACTURING OPTOELECTRIC COMPOSITE BOARD - A method for producing a circuit board, contains, in this order, a step A of forming a circuit on a first substrate; a step B of laminating a first support on a surface of the first substrate having the circuit formed, through a first releasing layer; and a step C of forming a second substrate or circuit on a surface of the first substrate opposite to the surface having the circuit formed, and a method for producing an optoelectronic composite member, contains, in this order, a step of laminating an electric circuit board on a second support; a step of laminating a first support; a step of releasing the second support; and a step of forming an optical waveguide on a surface where the second support is released. | 01-20-2011 |
| 20110013868 | OPTICAL WAVEGUIDE FOR VISIBLE LIGHT - The present invention relates to an optical waveguide for visible light guide containing an optical waveguide layer, at least one light entering part and at least one light exiting part, the light entering part and the light exiting part being disposed not adjacent to each other, that can be easily reduced in size and reduced in thickness, can be formed or the like on a substrate, and can be used for an illumination purpose, and also provides a flexible optical waveguide for visible light guide that emits light partly, is flexible to enable use in a bent state, and can be installed in a small gap in a small-sized electronic apparatus. | 01-20-2011 |
| 20110235964 | OPTICAL WAVEGUIDE, OPTO-ELECTRIC HYBRID BOARD, AND OPTICAL MODULE - The present invention relates to an optical waveguide comprising a lower cladding layer, a patternized core layer and an upper cladding layer, wherein a striking part for positioning is provided in one end part thereof, and an optical path turning mirror face is formed in a position different from a striking part-forming end part in the above core layer. | 09-29-2011 |
| 20110262091 | OPTICAL WAVEGUIDE - An optical waveguide contains a lower cladding layer, a patterned core layer, an upper cladding layer and an upper low elasticity layer, which are laminated in this order, in which a film formed by curing a resin composition for forming the upper low elasticity layer has a tensile elastic modulus of from 1 to 2,000 MPa at 25° C., and a cured film having a thickness of 110 μm formed by curing a resin composition for forming the upper cladding layer has a total light transmittance of 90% or more. | 10-27-2011 |
