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| 20090024888 | SEMICONDUCTOR DEVICE - An object of the present invention is to provide a semiconductor device capable of recognizing circuit malfunction in an actual operation and of specifying a point of the circuit malfunction, and the semiconductor device, which does not induce the malfunction in the circuit of a subsequent stage when restoring the malfunction. The present invention is the semiconductor device provided with a plurality of logic circuits and a plurality of judging circuits for judging malfunction based on data from the logic circuits, wherein each of the judging circuits is provided with a first register, delay unit, a second register, a comparator and scanning unit, which makes the second register a shift register to allow to transmit an error signal held in the second register to the subsequent stage, while allowing the comparator to hold a comparison result. | 01-22-2009 |
| 20110029829 | SEMICONDUCTOR DEVICE - An object of the present invention is to provide a semiconductor device capable of recognizing circuit malfunction in an actual operation and of specifying a point of the circuit malfunction, and the semiconductor device, which does not induce the malfunction in the circuit of a subsequent stage when restoring the malfunction. The present invention is the semiconductor device provided with a plurality of logic circuits and a plurality of judging circuits for judging malfunction based on data from the logic circuits, wherein each of the judging circuits is provided with a first register, delay unit, a second register, a comparator and scanning unit, which makes the second register a shift register to allow to transmit an error signal held in the second register to the subsequent stage, while allowing the comparator to hold a comparison result. | 02-03-2011 |
| 20110138217 | SEMICONDUCTOR DEVICE - An object of the present invention is to provide a semiconductor device capable of recognizing circuit malfunction in an actual operation and of specifying a point of the circuit malfunction, and the semiconductor device, which does not induce the malfunction in the circuit of a subsequent stage when restoring the malfunction. The present invention is the semiconductor device provided with a plurality of logic circuits and a plurality of judging circuits for judging malfunction based on data from the logic circuits, wherein each of the judging circuits is provided with a first register, delay unit, a second register, a comparator and scanning unit, which makes the second register a shift register to allow to transmit an error signal held in the second register to the subsequent stage, while allowing the comparator to hold a comparison result. | 06-09-2011 |
| 20110296260 | SEMICONDUCTOR DEVICE - An object of the present invention is to provide a semiconductor device capable of recognizing circuit malfunction in an actual operation and of specifying a point of the circuit malfunction, and the semiconductor device, which does not induce the malfunction in the circuit of a subsequent stage when restoring the malfunction. The present invention is the semiconductor device provided with a plurality of logic circuits and a plurality of judging circuits for judging malfunction based on data from the logic circuits, wherein each of the judging circuits is provided with a first register, delay unit, a second register, a comparator and scanning unit, which makes the second register a shift register to allow to transmit an error signal held in the second register to the subsequent stage, while allowing the comparator to hold a comparison result. | 12-01-2011 |
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| 20110121921 | TRANSMISSION SYSTEM - A transmission system transmits a signal from a transmission terminal to a reception terminal via a pair of transmission lines. The transmission terminal side of the transmission lines is connected to a first resistor having a predetermined resistance value depending on the characteristic impedance of the transmission lines. | 05-26-2011 |
| 20110175589 | TRANSMISSION INPUT CIRCUIT - This transmission input circuit is provided with an adjustment processing section which turns ON a switch at an empty timing where transmission current from a slave device is not flowing, to allow a reference current to flow from a constant current circuit to a current detection resistor, generates in the current detection resistor a target adjustment voltage, in which a threshold voltage corresponding to the reference current is added to a load current detection voltage corresponding to the load current, and adjusts a digital value so that a reference voltage output from a digital variable resistor matches with the target adjustment voltage. | 07-21-2011 |
| 20110187415 | TRANSMISSION INPUT CIRCUIT - A transmission input circuit of the present invention is provided with: a current detection resistor which receives an input of a line current flowing through a transmission line and generates a line current detection voltage; a constant current circuit which generates a predetermined reference current; a first switch which performs a switching operation at an empty timing where a transmission current is not flowing, to thereby allow the reference current to flow from the constant current circuit to the current detection resistor, and generate a reference voltage, in which a threshold voltage corresponding to the reference current is added to a load current detection voltage corresponding to the load current; a capacitor which is connected to the current detection resistor via the first switch; a second switch which performs a switching operation in synchronization with the first switch to thereby sample-hold the reference voltage generated by the current detection resistor in the capacitor; and a comparator which receives an input of the line current detection voltage generated by means of the current detection resistor, to one of input terminals, receives an input of the reference voltage held in the capacitor to an other input terminal, and outputs a voltage component of the line current detection voltage which exceeds the reference voltage, as a transmission current detection signal. | 08-04-2011 |
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| 20090053853 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions. | 02-26-2009 |
| 20090315659 | Coil component and method for producing the same - A coil component having an easily discernible orientation, and a method of producing such a coil component that facilitates the injection of resin. A coil component includes a core with a winding portion, first and second flanges disposed on either end of the winding portion, and a winding accommodating region defined by the winding portion and the first and second flanges, terminal electrodes disposed on the second flange and a winding wound about the winding portion and connected to the terminal electrodes. An insulating resin is formed over the winding at the winding accommodating region. A marker made from a material the same as the insulating resin is provided at outer peripheral surface of the flanges. | 12-24-2009 |
| 20100043221 | External electrode forming method - A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface. | 02-25-2010 |
| 20100071949 | ELECTRONIC COMPONENT - An electronic component has an element body, and a plurality of external electrodes formed on one principal face of the element body. Each external electrode has a first electrode layer joined to the one principal face of the element body, and a second electrode layer joined as laid on an inside region inside an edge of the first electrode layer. An apical surface of the second electrode layer is planar. A joint portion in the second electrode layer to the first electrode layer is rounded. | 03-25-2010 |
| 20100202098 | CERAMIC ELECTRONIC PART - A ceramic electronic part | 08-12-2010 |
| 20110051314 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode | 03-03-2011 |
