| Patent application number | Description | Published |
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| 20090138256 | Character Processing Device, Character Distinction Method and Computer Program - Provided herein is a character processing device that converts an input character formed of an input alphanumeric or symbol to an extended Latin character similar to the input character including: a display unit displaying as an editing character the input character with a cursor attached thereto; a conversion target distinction unit discerning whether or not the editing character is convertible to the extended Latin character; and a notification unit indicating that the editing character is convertible to the extended Latin character when the editing character is regarded as convertible. | 05-28-2009 |
| 20090231607 | Cable Label Forming Apparatus, Tape Printing Apparatus, Method of Forming Cable Label for Cable Label Forming Apparatus and Program - Provided herein is a cable label forming apparatus having an edit screen display device, a selection candidate display instructing device, and a selection candidate display device. The selection candidate display device displays a last selected candidate among the plurality of selection candidates on a priority basis in a normal edit screen when displaying the plurality of selection candidates is instructed, and displays a specific candidate among the plurality of selection candidates on a priority basis in a cable label forming edit screen when displaying the plurality of selection candidates is instructed. | 09-17-2009 |
| 20120041754 | ELECTRONIC APPARATUS, METHOD OF CONTROLLING THE ELECTRONIC APPARATUS AND TAPE PRINT APPARATUS - There is provided an electronic apparatus including a display unit configured to display a system language switching screen for selecting and switching a system language from a plurality of options and a display control unit configured to carry out display control of the display unit, and a selection manipulation unit configured to select an arbitrary option from a plurality of options, wherein the display control unit performs control such that a switching message screen for notifying the fact that the system language is switched is displayed on the display unit after manipulation is made to select an arbitrary option using the selection manipulation unit, the switching message screen including a language name of the system language represented using the system language corresponding to a selected arbitrary option and a language name of the system language represented using a predetermined language. | 02-16-2012 |
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| 20090020434 | Substrate processing method and substrate processing apparatus - A substrate processing method makes it possible to fill interconnect recesses, such as trenches, with a defect-free interconnect material by carrying out electroplating directly on a surface of a ruthenium film as a barrier layer. The substrate processing method comprises: providing a substrate having interconnect recesses formed in a substrate surface and having a ruthenium film formed in the entire substrate surface including interior surfaces of the interconnect recesses; keeping the substrate surface in contact with a plating solution for a predetermined time to adsorb an additive in the plating solution onto the ruthenium film, and then carrying out electroplating to form a conductive film on a surface of the ruthenium film. | 01-22-2009 |
| 20100163408 | Plating apparatus and plating method - A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution. | 07-01-2010 |
| 20100219078 | PLATING APPARATUS AND PLATING METHOD - A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section. | 09-02-2010 |
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| 20090140146 | VACUUM PACKAGE AND MANUFACTURING PROCESS THEREOF - A vacuum package has a chamber in which pressure is reduced to less than the atmospheric pressure, a functional component sealed in the chamber, and a material forming at least a part of the chamber. The material has at least one through hole to evacuate the chamber. In a cross section perpendicular to the material taken along the through hole, an edge portion of the material forming the through hole has an obtuse angle. The through hole is sealed with a sealing material. | 06-04-2009 |
| 20090207879 | INFRARED SENSOR AND MANUFACTURING METHOD THEREOF - A first thermosensitive element including a temperature detecting unit that outputs a voltage corresponding to a temperature to which the unit rises from ambient temperature (temperature of surrounding environment) due to incident infrared, and a second thermosensitive element including a temperature detecting unit that outputs a voltage based on ambient temperature are formed above/on a silicon substrate. The temperature detecting unit of the first thermosensitive element is thermally insulated from the silicon substrate by a clearance (space). The temperature detecting unit of the second thermosensitive element is formed on a first sacrifice layer made of deposited diamond like carbon, and thermally connected to the silicon substrate by the first sacrifice layer. The infrared sensor detects an amount of incident infrared based on the difference between output voltages of the first and second thermosensitive elements. | 08-20-2009 |
| 20100276593 | INFRARED SENSOR MANUFACTURED BY METHOD SUITABLE FOR MASS PRODUCTION - An infrared sensor manufacturing method according to this invention includes a step of forming a bridge structure of an insulating material on an Si substrate, a step of forming a vanadium oxide thin film on the bridge structure by a dry film forming method, a step of irradiating laser light onto the vanadium oxide thin film to thereby change material properties thereof, a step of forming the vanadium oxide thin film with the changed material properties into a bolometer resistor having a predetermined pattern, and a step of forming a protective layer of an insulating material so as to cover the bolometer resistor having the predetermined pattern and the bridge structure. | 11-04-2010 |
| 20110114840 | ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE - The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole. | 05-19-2011 |
| 20110303847 | BOLOMETER TYPE TERAHERTZ WAVE DETECTOR - A bolometer type Terahertz wave detector comprises: a temperature detecting portion having a thin bolometer film formed on a substrate, a reflective film that reflects Terahertz waves formed on the substrate at a position facing the temperature detecting portion, and an absorption film formed on the top surface of part of an eave-like member that extends to the inside from the perimeter edge section of the temperature detecting portion and that absorbs Terahertz waves. The reflective film and the absorption film form an optical resonant structure. A thermal isolation structure is formed by a support portion that supports the temperature detecting portion such that it is separated from the substrate by a gap. The eave-like member is supported by the support portion so that it is separated from the substrate by a gap. | 12-15-2011 |
