| Patent application number | Description | Published |
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| 20100170085 | METHOD FOR PRODUCING AN ELECTRONIC SUBASSEMBLY - In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer. | 07-08-2010 |
| 20100328913 | METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY - In a method for producing an electronic subassembly, at least one electronic component is mounted on an insulating layer of a conductive foil in a first step, the active side of the electronic component pointing in the direction of the conductive foil. In a second step, the conductive foil having the at least one electronic component mounted thereon is laminated to a circuit board substrate, the at least one electronic component pointing in the direction of the circuit board substrate. Finally, circuit tracks are developed by patterning the conductive foil, and the at least one electronic component is contacted. | 12-30-2010 |
| 20110060206 | Device for determining body functions - A device for determining one or multiple body functions of a person includes at least one body function sensor, an electronic unit, and a fixing arrangement for detachably fastening the device to the body of the person. The electronic unit includes a first film having a printed conductor structure, at least one electronic component situated on the first film and contacting the printed conductor structure, and a second film. To encapsulate the electronic component, the second film is laminated onto the side of the first film on which the electronic component is situated. | 03-10-2011 |
| 20110088936 | METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY - A method for manufacturing an electronic assembly ( | 04-21-2011 |
| 20110138620 | Method for manufacturing an electronic assembly - A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component. | 06-16-2011 |
| Patent application number | Description | Published |
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| 20080198352 | Optical Module for an Objective - There is provided an optical module for an objective. The optical module includes (a) a first holding device with an inner circumference, which extends in a first circumferential direction, (b) at least one first supporting device for supporting a first optical element and being fixed at said inner circumference of said first holding device, (c) an annular circumferential first assembly space being defined by displacing said first supporting device once in a revolving manner along said first circumferential direction, (d) at least one second supporting device being provided for supporting a second optical element and being fixed at said inner circumference of said first holding device, and (e) an annular circumferential second assembly space being defined by displacing said second supporting device once in a revolving manner along said first circumferential direction. The first assembly space intersects the second assembly space. | 08-21-2008 |
| 20080225247 | OPTICAL ELEMENT UNIT FOR EXPOSURE PROCESSES - An optical element unit including a first optical element module and a sealing arrangement is disclosed. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially prevents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space. | 09-18-2008 |
| 20080309894 | MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS AND MEASURING DEVICE FOR A PROJECTION LENS - A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid. | 12-18-2008 |
| 20090168207 | Replacement Apparatus for an Optical Element - A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same. | 07-02-2009 |
| 20090174874 | Optical Projection System - An optical projection unit comprising a first optical element module and at least one second optical element module is provided. The first optical element module comprises a first housing unit and at least a first optical element, the first optical element being received within the first housing unit and having an optically used first region defining a first optical axis. The at least one second optical element module is located adjacent to the first optical element module and comprises at least one second optical element, the second optical element defining a second optical axis of the optical projection unit. The first housing unit has a central first housing axis and an outer wall extending in a circumferential direction about the first housing axis. The first optical axis is at least one of laterally offset and inclined with respect to the first housing axis. Furthermore, the first housing axis is substantially collinear with the second optical axis. | 07-09-2009 |
