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Kueper
Timothy Kueper, Cupertino, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100282276 | REMOVING DEFECTS FROM PHOTOVOLTAIC CELL METALLIC SUBSTRATES WITH FIXED-ABRASIVE FILAMENT ROLLER BRUSHES - Provided are methods and apparatuses for processing photovoltaic cell metallic substrates to remove various surface defects. In certain embodiments, a thin stainless steel foil is polished using a proposed method leading to a substantial, e.g., twice or more, increase in its surface gloss. In certain embodiments, a method in accordance with the present invention involves contacting a substrate surface with a fixed-abrasive filament roller brush. The brush may be a close-wound coil brush. The brush includes filaments carrying 5-20 micrometer abrasive particles that are permanently fixed in the brush filaments, for example a polymer base material, such as nylon. The particles may be made of silicon carbide and/or other abrasive materials. In certain embodiments, a substrate surface is polished using a series of roller brushes, at least two of which rotate in different directions with respect to that surface. | 11-11-2010 |
Timothy Kueper, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100258173 | POLISHING A THIN METALLIC SUBSTRATE FOR A SOLAR CELL - A method for fabricating a solar cell. The method includes providing a thin metallic substrate in roll form. The method also includes applying an abrasive grit to a surface of the thin metallic substrate. The method includes mechanical-polishing the surface with the abrasive grit such that the surface is polished to remove at least one defect from the surface. Mechanical-polishing the surface of the thin metallic substrate is by a roll-to-roll polishing process of the surface of the thin metallic substrate. Moreover, the method includes depositing an absorber layer of the solar cell on the thin metallic substrate. | 10-14-2010 |
| 20110139222 | Semiconductor device and method of making thereof - A method of making a semiconductor device includes providing a web substrate, forming a first semiconductor layer of a first conductivity type over the web substrate, forming a second semiconductor layer of a second conductivity type over a first side of the first semiconductor layer, forming a first electrode layer over the second semiconductor layer, forming a handle web substrate over the first electrode layer, delaminating the web substrate from the first semiconductor layer after the step of forming the handle web substrate, where at least one opening extends through the first and the second semiconductor layers, and forming a second electrode layer over a second side of the first semiconductor layer such that the first and second electrode layers are in electrical contact with each other. | 06-16-2011 |
Timothy W. Kueper, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100008016 | ELECTROSTATIC CHUCK ASSEMBLY WITH CAPACITIVE SENSE FEATURE, AND RELATED OPERATING METHOD - A semiconductor workpiece processing system for treating a workpiece, such as a semiconductor wafer, is provided. A related operating control method is also provided. The system includes an electrostatic chuck configured to receive a workpiece, and a clamping voltage power supply coupled to the electrostatic chuck. The electrostatic chuck has a clamping electrode assembly, and the clamping voltage power supply is coupled to the clamping electrode assembly. The clamping voltage power supply includes a direct current (DC) voltage generator configured to generate a DC clamping voltage for the clamping electrode assembly, an alternating current (AC) voltage generator configured to generate an AC excitation signal for the clamping electrode assembly, and a processing architecture coupled to the clamping electrode assembly. The processing architecture is configured to analyze attributes of a workpiece presence signal obtained in response to the AC excitation signal, and, based on the attributes, verify proper/improper positioning of the workpiece relative to the electrostatic chuck. | 01-14-2010 |