| Patent application number | Description | Published |
|---|
| 20080255353 | METHOD FOR PREPARING MELAMINE SALT OF BIS(PENTAERYTHRITOL PHOSPHATE) PHOSPHORIC ACID - A method for producing a melamine salt of bis(pentaerythritol phosphate) phosphoric acid is proposed. The method includes the steps of reacting and mixing pentaerythritol and diphosphorous pentaoxide in an extruder to carry out esterification to produce bis(pentaerythritol phosphate) phosphoric acid; and mixing bis(pentaerythritol phosphate) phosphoric acid with melamine or a derivative thereof to carry out quaternization in the presence of a solvent, followed by removing water to obtain a melamine salt of bis(pentaerythritol phosphate) phosphoric acid. Diphosphorous pentaoxide is used in the method as a reactant, so that no hydrogen chloride is produced and it is not necessary to recollect trichlorophosphoric acid. Moreover, in the method of the present invention, such that esterification time can be shortened and a high pressure in a closed reaction system that causes explosion can be avoided. | 10-16-2008 |
| 20080262127 | FLAME RESISTANT RESIN COMPOSITION - A flame resistant resin composition is provided, which includes: (A) at least an epoxy resin having a biphenylic unit or a naphthalenic unit; (B) phenolic resins used as a curing agent, the phenolic resins include at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety, wherein the the at least a phenolic resin having a biphenylic moiety and a polyphenolic moiety is in an amount of 30 to 100 wt % of the total weight of the curing agents; (C) a curing-promoting agent; and (D) an inorganic filler material. The resin composition includes an epoxy resin having a biphenylic unit or a naphthalenic unit and the phenolic resin having a biphenylic moiety and a polyphenolic moiety as a curing agent, such that excellent flame resistance can be achieved without adding flame resistant agents. The resin composition also has a higher glass transition temperature to improve the water absorption issue after curing, and increases heat stability. Therefore, the resin composition is particularly useful in composite materials, forming materials or semiconductor packaging materials. | 10-23-2008 |
| 20100105939 | PHOSPHORUS-CONTAINING COMPOUND AND METHOD FOR PREPARING THE SAME - The present invention provides a phosphorus-containing compound of formula (I): | 04-29-2010 |
| 20100125154 | PHOSPHORUS COMPOUND AND METHOD FOR PREPARING THE SAME - The present invention provides a phosphorus compound of formula (I). | 05-20-2010 |
