| Patent application number | Description | Published |
|---|
| 20100033507 | Driving Method and Driving Apparatus for Displaying Apparatus - A driving method for driving a display apparatus is provided. The driving method includes: configuring a plurality of driving voltages corresponding to a plurality of gray scales, where the gray scales include a first gray scale and a second gray scale smaller than the first gray scale, and a first driving voltage corresponding to the first gray scale is lower than a second driving voltage corresponding to the second gray scale; and controlling the display apparatus to display a gray scale merely up to the second gray scale. In this way, the driving method hence reduces the response time of the display apparatus, which may be an LCD display panel. | 02-11-2010 |
| 20100097555 | PIXEL ARRAY STRUCTURE - A pixel array structure includes scan lines, data lines, first pixels, and second pixels. The scan lines and the data lines are intersected. The first and the second pixels are staggered. Each first pixel includes a first switching element, a first pixel electrode and a second pixel electrode electrically connected to the first switching element. Each second pixel includes a second switching element, a third pixel electrode and a fourth pixel electrode electrically connected to the second switching element. The first and the second switching elements electrically connect corresponding scan lines and data lines. A pattern of the first pixel electrode is symmetrical to a pattern of the fourth pixel electrode with respect to an extending direction of the scan lines. A pattern of the second pixel electrode is symmetrical to a pattern of the third pixel electrode with respect to the extending direction of the scan lines. | 04-22-2010 |
| 20100103119 | TOUCH DISPLAY PANEL - A touch display panel includes a first substrate, a second substrate, a third substrate, a liquid crystal layer disposed between the second and the third substrates, a pixel array disposed between the liquid crystal layer and the third substrate, an opposite electrode, color filter patterns, a first sensing electrode, and a second sensing electrode. The first, the second, and the third substrates are disposed in parallel. The color filter patterns and the opposite electrode that are disposed between the liquid crystal layer and the second substrate are respectively disposed on opposite sides of the second substrate. Some color filter patterns are piled to form touch points. The first sensing electrode on the first substrate faces the second substrate. The second sensing electrode covers the touch points and some color filter patterns. A height of the touch points is less than a gap between the first and the second substrates. | 04-29-2010 |
| 20100171893 | Liquid crystal display panel with eliminating image sticking abilities and method of the same - The present invention provides a liquid crystal display panel with eliminating image sticking abilities. The liquid crystal display panel includes a main thin film transistor disposed on a substrate which includes a first gate coupled to a corresponding scanning line, a first source coupled to a corresponding data line. A sub thin film transistor disposed on the substrate includes a second gate coupled to pro-scanning line of the corresponding scanning line, a second source coupled to the adjacent data line of the corresponding data line. The main thin film transistor and the sub thin film transistor are disposed on a pixel. | 07-08-2010 |
| 20100231494 | LIQUID CRYSTAL DISPLAY DEVICE - A multi-domain vertical alignment liquid crystal display device includes a data line, a first gate line, a second gate line, a first sub-pixel unit, and a second sub-pixel unit. The first sub-pixel unit includes a first switch, a first liquid-crystal capacitor and a first storage capacitor. The first switch functions to control writing the data signal of the data line into the first liquid-crystal and storage capacitors based on the first gate signal of the first gate line. The second sub-pixel unit includes a second switch, a second liquid-crystal capacitor, an auxiliary switch, a second storage capacitor and a third storage capacitor. The second and auxiliary switches are employed to control writing the data signal into the second liquid-crystal capacitor, the second storage capacitor and the third storage capacitor based on the first gate signal and the second gate signal of the second gate line respectively. | 09-16-2010 |
| 20100238101 | IMAGE PROCESSING METHOD CAPABLE OF REDUCING COLOR SHIFT - An image-processing method adjusts the gamma characteristic of an LCD device based on the difference between color coordinates of an image when viewed directly in front of the LCD device and at an angle. Therefore, color characteristics of the image are substantially the same when viewed directly in front of the LCD device and at an angle. | 09-23-2010 |
| Patent application number | Description | Published |
|---|
| 20120018494 | Thermal Compress Bonding - A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together. | 01-26-2012 |
| 20120021183 | Forming Low Stress Joints Using Thermal Compress Bonding - A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer. | 01-26-2012 |
| 20120267423 | Methods and Apparatus for Thin Die Processing - A vacuum tip and methods for processing thin integrated circuit dies. A vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed. | 10-25-2012 |
| 20120299181 | Package-on-Package Process for Applying Molding Compound - A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film. | 11-29-2012 |
| 20130048027 | Package Assembly Cleaning Process Using Vaporized Solvent - A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly. | 02-28-2013 |
| 20130062761 | Packaging Methods and Structures for Semiconductor Devices - Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. | 03-14-2013 |
| 20130089952 | Packaging Process Tools and Packaging Methods for Semiconductor Devices - Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region. | 04-11-2013 |
| 20130093078 | Process for Forming Package-on-Package Structures - A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material. | 04-18-2013 |
| 20130095608 | Methods for Forming 3DIC Package - A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening. | 04-18-2013 |
| 20130095611 | Packaging Methods for Semiconductor Devices - Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates. | 04-18-2013 |
| 20130102112 | Process for Forming Packages - A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat. | 04-25-2013 |
