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Kuei-Hua
Kuei-Hua Chen, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090194490 | PLATE AND SLIDING CONNECTION APPARATUS - A plate includes a first sliding connection element, a second sliding connection element and a spacing element. The first sliding connection element includes a first and a second sliding connection portions respectively disposed on different surfaces opposite to each other of the first sliding connection element. The second sliding connection element includes a third and a fourth sliding connection portions disposed on different surfaces opposite to each other of the second sliding connection element. The spacing element connects the first and second sliding connection elements. The plate can be processed into different slide connection apparatuses for slidably engaging data storage devices of different size. | 08-06-2009 |
Kuei-Hua Chen, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090122485 | FIXING FRAME - A fixing frame is used to fix at least one heat sink fan on a case of an electronic device. The fixing frame includes a cradle and at least one fastener. The cradle has two oppositely disposed plates, and the two plates respectively have a combining portion and a latching portion, such that at least one accommodation region is partitioned from the cradle for accommodating the fan, and the latching portion and the combining portion are combined with each other to form a clamping region. The fastener is disposed on the case and clamped in the clamping region, such that the cradle is fixed on the case. | 05-14-2009 |
Kuei-Hua Liu, Chu-Nan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100149758 | Package module for a memory IC chip - The present invention relates to a package module for a memory IC chip, in which first solder pads provided on an upper surface of the memory IC chip is electrically connected to lower contact pads provided on the periphery of the ground pad, lower contact pads is soldered upward with lead frames and upper contact pads, and lastly a molding layer is used for packaging and enclosing the above elements, while only exposing the lower contact pads and the upper contact pads. Therefore, it will facilitate that each of upper contact pads of a lower layer is correspondingly soldered to one of lower contact pads of an upper layer as the upper layer and the lower layer are stacked together. Thus, it is capable of obtain high acceptable production yield, while accomplishing the object of expanding the memory capacity in total when stacking the layers of the package structure. | 06-17-2010 |