| Patent application number | Description | Published |
|---|
| 20090273071 | IC CHIP MOUNTING PACKAGE AND PROCESS FOR MANUFACTURING THE SAME - In one embodiment of the present invention, an IC chip mounting package is arranged such that an IC chip and a film base member are connected via an interposer, and a section in which the IC chip, the film base member, and the interposer are connected is sealed with sealing resin. The sealing resin is provided by potting sealing resin around the interposer via a potting nozzle, or is provided by potting the sealing resin around the IC chip, that is, via a device hole. Moreover, the sealing resin has a coefficient of linear expansion of not more than 80 ppm/° C., a viscosity of not less than 0.05 Pa·s but not more than 0.25 Pa·s, and also includes filler having a particle size of not more than 1 μm. | 11-05-2009 |
| 20090302464 | SEMICONDUCTOR DEVICE - A semiconductor device allowing for chip size reduction and thereby cost reduction without being restricted by a layout of bumps comprises a film substrate, an interposer substrate ( | 12-10-2009 |
| 20100019394 | IC CHIP MOUNTING PACKAGE - In one embodiment of the present invention, an IC chip mounting package includes a film base member and an IC chip connected via an interposer. Connecting terminals on the film base member side of the interposer are provided so as to have a pitch larger than that of connecting terminals of the IC. A device hole is opened to the film base member, and the IC chip is provided in the device hole. A distance between an inner lead leading end and a periphery of the device hole is set as not less than 10 μm. | 01-28-2010 |
| 20100025681 | IC CHIP PACKAGE AND IMAGE DISPLAY DEVICE INCORPORATING SAME - A liquid crystal driver mounting package in accordance with an embodiment of the present invention contains a film base material and a liquid crystal driver connected to each other via an interposer. The liquid crystal driver includes first alignment marks on its face opposite the interposer. The interposer includes second alignment marks on its face opposite the liquid crystal driver. The first alignment marks and the second alignment marks are separated by about a distance which is in a tolerable range as a combining position where the liquid crystal driver and the interposer are attached when viewed from the normal of the face of the interposer opposite the liquid crystal driver. Thus, an IC chip (liquid crystal driver) package is provided which enables efficient positing of the IC chip and the interposer. | 02-04-2010 |
| 20100044871 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE - In order to attain, in a semiconductor device in which a semiconductor element is mounted, formation of a mark of a relatively large size which is easily recognizable by the naked eye or a machine, and which can apply a code system containing enough amount of information for tracing a manufacturing history, a semiconductor device according to the present invention includes an interposer electrically connected to a semiconductor element, which semiconductor device has a mark for displaying at least predetermined information relevant to the semiconductor element. | 02-25-2010 |
| 20100230793 | SEMICONDUCTOR APPARATUS PACKAGING STRUCTURE, SEMICONDUCTOR APPARATUS PACKAGING METHOD, AND EMBOSSED TAPE - A TAB tape ( | 09-16-2010 |
| 20100252671 | CONDUCTIVE REEL | 10-07-2010 |
| 20110147262 | METHOD FOR PACKING TAB TAPE, AND PACKING STRUCTURE FOR TAB TAPE - A method of at least one embodiment of the present invention for packing a TAB tape is a method in which the TAB tape is wound on a core reel so as to be packed, the TAB tape being a tape-shaped insulating film on which circuits are provided in a repeated manner, the circuits each of which is made up of metal wiring and a solder resist. In at least one embodiment, the method includes a first step of winding at least the TAB tape on an outer peripheral surface of a core reel having a cylindrical shape, the core reel having a shaft hole on its inner peripheral side. This makes it possible to provide (i) a method for packing a TAB tape which method makes it possible to reduce a packing size, and (ii) a smaller packing structure for a TAB tape. | 06-23-2011 |
