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Kuan, US
Andrew Kuan, New York, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100091960 | INTERACTIVE VOICE RESPONSE SYSTEM AND METHOD WITH COMMON INTERFACE AND INTELLIGENT AGENT MONITORING - A modular interactive voice recognition (“IVR”) overlay system and a method of processing calls. The system provides an application server, a plurality of agent workstations and a graphical user interface (“GUI”) to allow a hybrid approach to processing calls using an automated IVR and live agents. The system and method allow a single agent to process multiple calls simultaneously and is compatible with existing IVR systems and can be implemented as an add-on to existing IVR systems. | 04-15-2010 |
Cara Kuan, Redmond, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20100094484 | INTEGRATING COMMUNICATION AND SURVEILLANCE - An aircraft control unit has modules for interfacing with various systems of an aircraft to integrate control of the systems. The modules include a communication module configured to be coupled to a communication system of the aircraft and a surveillance module configured to be coupled to a surveillance system of the aircraft. The aircraft control unit also includes a display screen for displaying information and a user interface usable to interact with the modules. Each of the modules is configured to display information on the display screen and to receive user input from the user interface. | 04-15-2010 |
Chia-Yi Kuan, Loveland, OH US
| Patent application number | Description | Published |
|---|---|---|
| 20100286053 | PLASMINOGEN ACTIVATOR INHIBITOR AMELIORATION OF NEWBORN HYPOXIC ISCHEMIC BRAIN INJURY - Plasminogen activators as potential therapeutic targets in neonatal hypoxia ischemia (HI) brain injury. Use of plasminogen activator inhibitor-1 (PAI-1) to ameliorate HI encephalopathy related disease. Use of PAI-1 as preventive treatment of cerebral palsy (CP). | 11-11-2010 |
Chien-Tsun Kuan, Cary, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20090252750 | ANTIBODIES AND IMMUNOTOXINS THAT TARGET HUMAN GLYCOPROTEIN NMB - The invention provides high affinity antibodies suitable for forming immunotoxins that inhibit the growth of cells expressing human glycoprotein NMB, including glioblastoma multiform cells, anaplastic astrocytoma cells, anaplastic oligodendroglioma cells, oligodendroglioma cells, and melanoma cells. | 10-08-2009 |
| 20090269343 | Dual Specific Immunotoxin for Brain Tumor Therapy - We tested the in vitro and in vivo efficacy of a recombinant bispecific immunotoxin that recognizes both EGFRwt and tumor-specific EGFRvIII receptors. A single chain antibody was cloned from a hybridoma and fused to toxin, carrying a C-terminal peptide which increases retention within cells. The binding affinity and specificity of the recombinant bispecific immunotoxin for the EGFRwt and the EGFRvIII proteins was measured. In vitro cytotoxicity was measured. In vivo activity of the recombinant bispecific immunotoxin was evaluated in subcutaneous models and compared to that of an established monospecific immunotoxin. In our preclinical studies, the bispecific recombinant immunotoxin, exhibited significant potential for treating brain tumors. | 10-29-2009 |
| 20100047164 | Anti-Tumor Antibodies - Chondroition sulfate proteoglycans represent excellent targets for anti-tumor immunotherapy. Antibodies which target such proteoglycans can be used alone, in combinations, armed with a cytotoxic payload or unarmed. Combinations of such antibodies can target different epitopes of the proteoglycans. Internalization of the antibodies can increase the toxicity of the payloads. Single chain variable regions are especially advantageous for such anti-tumor immunotherapy. | 02-25-2010 |
| 20100290984 | ANTI-MRP3 ANTIBODIES AND METHODS OF USE - An antibody having an antigen binding region capable of binding an epitope located in an extracellular portion of MRP3 and methods of utilizing same are provided. In particular, the invention provides antibodies targeted at a MRP3 antigen present on cells expressing MRP3 and methods useful in detecting or targeting cells expression the MRP3 antigen, as well as kits, nucleic acids, polypeptides, and cells for providing the antibodies. | 11-18-2010 |
George Kuan, Chicago, IL US
| Patent application number | Description | Published |
|---|---|---|
| 20100223604 | MODULE SYSTEM FOR POLYMORPHIC PI-CALCULUS - A method and apparatus is disclosed herein for using a module system for polymorphic π-calculus. In one embodiment, the method comprises receiving a formal specification of a software program; and performing automatic analysis on the formal specification using a module system fitted with processes of the polymorphic π-calculus processes. | 09-02-2010 |
Nelson Kuan, Reston, VA US
| Patent application number | Description | Published |
|---|---|---|
| 20100258348 | INTERCONNECT AND SYSTEM INCLUDING SAME - An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall. | 10-14-2010 |
Nelson Kuan, Brookline, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20080205025 | Package Having a Plurality of Mounting Orientations - A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus. | 08-28-2008 |
| 20090230521 | Stress Mitigation in Packaged Microchips - A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame. | 09-17-2009 |
| 20100013067 | Stress Mitigation in Packaged Microchips - A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus. | 01-21-2010 |