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Kuan-Chieh
Kuan-Chieh Chen, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090306912 | METHOD OF MEASURING LED JUNCTION TEMPERATURE - A method of measuring LED junction temperature includes the steps of: (a) obtaining a temperature curve of an LED; (b) inputting at least one rated AC voltage to the LED; (c) measuring a temperature at a specific point on an outer packaging structure of the LED, putting the temperature measured at the specific point into the temperature curve, and calculating a junction temperature of the LED by interpolation; and (d) substituting the result from the calculation in the step (c) into a numerical analysis model to obtain temperature oscillation of the LED. | 12-10-2009 |
Kuan-Chieh Huang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100270636 | ISOLATION STRUCTURE FOR BACKSIDE ILLUMINATED IMAGE SENSOR - A backside illuminated image sensor includes an isolation structure passing through a substrate, a sensor element formed overlying the front surface of the substrate, and a color filter formed overlying the back surface of the substrate. | 10-28-2010 |
| 20100279459 | METHOD FOR REDUCING CONTACT RESISTANCE OF CMOS IMAGE SENSOR - A method for performing a CMOS Image Sensor (CIS) silicide process is provided to reduce pixel contact resistance. In one embodiment, the method comprises forming a Resist Protect Oxide (RPO) layer on the CIS, forming a Contact Etch Stop Layer (CESL), forming an Inter-Layer Dielectric (ILD) layer, performing contact lithography/etching, performing Physical Vapor Deposition (PVD) at a pixel contact hole area, annealing for silicide formation at pixel contact hole area, performing contact filling, and defining the first metal layer. The Resist Protect Oxide (RPO) layer can be formed without using a photo mask of Cell Resist Protect Oxide (CIRPO) photolithography for pixel array and/or without silicide process at pixel array. The method can include implanting N+ or P+ for pixel contact plugs at the pixel contact hole area. The contact filling can comprise depositing contact glue plugs and performing Chemical Mechanical Polishing (CMP). | 11-04-2010 |
| 20110108940 | METHOD OF FABRICATING BACKSIDE-ILLUMINATED IMAGE SENSOR - Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor. | 05-12-2011 |
Kuan-Chieh Tseng, Pingtung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20110034717 | METHOD FOR SYNTHESIZING 9,10-DIHYDRO-9-OXA-10-PHOSPHAPHENANTHRENE-10-OXIDE AND DERIVATIVES THEREOF - A method for synthesizing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivatives has a step of introducing 6-chloro-6H-dibenz[c,e][1,2]oxaphosphorin or its derivative, an acid compound and water into a reacting chamber to form an organic layer having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative and an aqueous layer. Because the acid compound is from an external source and has a catalyzing effect, employing the method can prevent side reaction from occurring and increase yield of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative. Furthermore, the method is a one-pot operation of hydrolysis, dehydration and cyclization, so the method does not require purification of intermediates. Therefore, the method is time-and cost-saving and requires less organic solvent, resulting in less pollution to the environment. | 02-10-2011 |
Kuan-Chieh Wang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110126078 | DECODER AND DECODING METHOD FOR LOW-DENSITY PARITY CHECK CODES CONSTRUCTED BASED ON REED-SOLOMON CODES - Configurable permutators in an LDPC decoder are provided. A partially-parallel architecture combined with the proposed permutators is used to mitigate the increase in implementation complexity for the multi-mode function. To overcome the difficulty in efficient implementation of a high-throughput decoder, the variable nodes are partitioned into several groups, and each group is processed sequentially in order to shorten the critical-path delay and, hence, increase the maximum operating frequency. In addition, shuffled message-passing decoding can be adopted in decoders according to the invention to increase the convergence speed, which reduces the number of iterations required to achieve a given bit-error-rate performance. | 05-26-2011 |