| Patent application number | Description | Published |
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| 20090124192 | Hiding structure of a vent pipe for a mobile air conditioner - A hiding structure of a vent pipe for a mobile air conditioner is composed of a housing, a cold air outlet for blowing the cold air into a room, and a hot air outlet for expelling the hot air out of the room. The hot air outlet is disposed with an extractable vent pipe which is collected in the housing of the mobile air conditioner, the housing is disposed with a connector opening from which the vent pipe can be extended, and the connector opening is disposed with a vent pipe cap. As the extractable vent pipe is used by the present invention, a volume of the mobile air conditioner is decreased, and convenience in moving is increased. | 05-14-2009 |
| 20100230078 | EXHAUST PIPE OF AN AIR CONDITIONER - The present invention discloses an exhaust pipe of an air conditioner. The air conditioner includes a condenser, a first pipe, an air duct and a second pipe. The condenser is located in the air conditioner, an end of the first pipe is close to the condenser, the other end is penetrated out of a side of the condenser, and an interior of the first pipe is provided with the second pipe. An end of the second pipe is connected with the air duct (the air duct is located in the air conditioner), and the other end is penetrated out of the first pipe. Therefore, when the air conditioner is running, hot air is sucked into the condenser through the first pipe and then the circulated hot air is sent out of a room from the second pipe through the air duct, such that indoor temperature can be reduced effectively. | 09-16-2010 |
| 20110094260 | ROLLER EVAPORATOR FOR A SNOW MACHINE - A roller evaporator for a snow machine includes an inner layer and an outer layer. The inner layer is fixed on a high pressure tube and a low pressure tube, and the outer layer corresponds to and rotates relatively with respect to the inner layer. A roller of the roller evaporator is divided into two layers, with the inner layer being installed and sealed on the high pressure tube. Therefore, an extremely good sealing effect is provided and refrigerant does leak out easily while making ice. | 04-28-2011 |
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| 20080233486 | System and Method for Providing Phase Shift Mask Passivation Layer - System and method for providing a passivation layer for a phase shift mask (“PSM”) are described. In one embodiment, a PSM comprises a transparent substrate; a phase shift pattern disposed on the transparent substrate; and a passivation layer disposed to substantially cover exposed surfaces of at least a portion of the phase shift pattern. | 09-25-2008 |
| 20090206057 | Method To Improve Mask Critical Dimension Uniformity (CDU) - A method and system for fabricating a substrate is disclosed. First, a plurality of process chambers are provided, at least one of the plurality of process chambers adapted to receive at least one plasma filtering plate and at least one of the plurality of process chambers containing a plasma filtering plate library. A plasma filtering plate is selected and removed from the plasma filtering plate library. Then, the plasma filtering plate is inserted into at least one of the plurality of process chambers adapted to receive at least one plasma filtering plate. Subsequently, an etching process is performed in the substrate. | 08-20-2009 |
| 20090222785 | METHOD FOR SHAPE AND TIMING EQUIVALENT DIMENSION EXTRACTION - An integrated circuit (IC) design method includes providing an IC layout contour based on an IC design layout of an IC device and IC manufacturing data; generating an effective rectangle layout to represent the IC layout contour; and simulating the IC device using the effective rectangular layout. | 09-03-2009 |
| 20090258159 | NOVEL TREATMENT FOR MASK SURFACE CHEMICAL REDUCTION - A method includes forming an absorption material layer on a mask; applying a plasma treatment to the mask to reduce chemical contaminants after the forming of the absorption material layer; performing a chemical cleaning process of the mask; and performing a gas injection to the mask. | 10-15-2009 |
| 20100095253 | TABLE-BASED DFM FOR ACCURATE POST-LAYOUT ANALYSIS - Disclosed is a system and method for integrated circuit designs and post layout analysis. The integrated circuit design method includes providing a plurality of IC devices with various design dimensions; collecting electrical performance data of the IC devices; extracting equivalent dimensions of the IC devices; generating a shape related model to relate the equivalent dimensions to the electrical performance data of the IC devices; and creating a data refinement table using the equivalent dimensions and the electrical performance data. | 04-15-2010 |
| 20100293514 | DESIGN-DRIVEN METAL CRITICAL DIMENSION (CD) BIASING - A method of designing an integrated circuit (“IC”) is provided that includes placing an IC design, where the IC design includes a first element, a second element, and a path coupling the first and second elements, and routing the IC design. Further, the method includes obtaining at least one of resistivity data and capacitance data related to the path, and obtaining timing data related to the path. The method also includes using at least one of the resistivity data, the capacitance data, and the timing data to determine a critical dimension (“CD”) bias to be applied to the path, and modifying the IC design, where modifying includes applying the CD bias to the path. | 11-18-2010 |
| 20110217630 | INTENSITY SELECTIVE EXPOSURE PHOTOMASK - An intensity selective exposure photomask, also describes as a gradated photomask, is provided. The photomask includes a first region including a first array of sub-resolution features. The first region blocks a first percentage of the incident radiation. The photomask also includes a second region including a second array of sub-resolution features. The second region blocks a second percentage of the incident radiation different that the first percentage. Each of the features of the first and second array includes an opening disposed in an area of attenuating material. | 09-08-2011 |
| 20110289466 | Table-Based DFM for Accurate Post-Layout Analysis - Disclosed is a system and method for integrated circuit designs and post layout analysis. The integrated circuit design method includes providing a plurality of IC devices with various design dimensions; collecting electrical performance data of the IC devices; extracting equivalent dimensions of the IC devices; generating a shape related model to relate the equivalent dimensions to the electrical performance data of the IC devices; and creating a data refinement table using the equivalent dimensions and the electrical performance data. | 11-24-2011 |
| 20120040278 | INTENSITY SELECTIVE EXPOSURE PHOTOMASK - An intensity selective exposure photomask, also describes as a gradated photomask, is provided. The photomask includes a first region including a first array of sub-resolution features. The first region blocks a first percentage of the incident radiation. The photomask also includes a second region including a second array of sub-resolution features. The second region blocks a second percentage of the incident radiation different that the first percentage. | 02-16-2012 |
| Patent application number | Description | Published |
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| 20090030631 | METHOD FOR ENHANCING THE MEASUREMENT CAPABILITY OF MULTI-PARAMETER INSPECTION SYSTEMS - A method for improving the measurement capability of multi-parameter inspection systems includes performing a measuring procedure to acquire a measured signature of a sample, calculating weighting factors representing a correlation between structural parameters of the sample by using a weighting algorithm, transforming the weighting factors into a sampling function by using a transforming rule, updating the measured signature to form an updated measured signature and generating a plurality of updated nominal signatures according to the sampling function, and comparing the updated measured signature and the updated nominal signatures to determine the structural parameters of the sample. | 01-29-2009 |
| 20090079969 | Method and apparatus for scatterfield microscopical measurement - A method and an apparatus are disclosed for scatterfield microscopical measurement. The method integrates a scatterometer and a bright-field microscope for enabling the measurement precision to be better than the optical diffraction limit. With the aforesaid method and apparatus, a detection beam is generated by performing a process on a uniform light using an LCoS (liquid crystal on silicon) or a DMD (digital micro-mirror device) which is to directed to image on the back focal plane of an object to be measured, and then scattered beams resulting from the detection beam on the object's surface are focused on a plane to form an optical signal which is to be detected by an array-type detection device. The detection beam can be oriented by the modulation device to illuminate on the object at a number of different angles, by which zero order or higher order diffraction intensities at different positions of the plane at different incident angles can be collected. | 03-26-2009 |
| 20090116035 | Structure and method for overlay measurement - A structure for overlay measurement is provided in the present invention, using the diffraction characteristics on the boundary portion between two microstructures formed on each of two material layers. The optical intensity distribution on the boundary portion between microstructures formed on the two overlaid material layers respectively are measured by an optical microscope to obtain the overlay error between the two overlaid material layers. In addition, the present invention also provides a method for overlay measurement using the structure for overlay measurement, wherein a merit relation based on the optical intensity distribution on the boundary portion between different microstructures is determined. The merit relation can be used to analyze the overlay error to improve the efficiency and accuracy of on-line error measurement. | 05-07-2009 |
| 20090313589 | METHOD FOR DESIGNING OVERLAY TARGETS AND METHOD AND SYSTEM FOR MEASURING OVERLAY ERROR USING THE SAME - A method for designing an overlay target comprises selecting a plurality of overlay target pairs having different overlay errors or offsets, calculating a deviation of the simulated diffraction spectrum for each overlay target pair, selecting a plurality of sensitive overlay target pairs by taking the deviation of the simulated diffraction spectrum into consideration, selecting an objective overlay target pair from the sensitive overlay target pairs by taking the influence of the structural parameters to the simulated diffraction spectrum into consideration, and designing the overlay target pair based on the structural parameter of the objective overlay target pair. | 12-17-2009 |
| 20100007881 | SCATTERFIELD MICROSCOPICAL MEASURING METHOD AND APPARATUS - The present invention provides a scatterfield microscopical measuring method and apparatus, which combine scatterfield detecting technology into microscopical device so that the microscopical device is capable of measuring the sample whose dimension is under the limit of optical diffraction. The scatterfield microscopical measuring apparatus is capable of being controlled to focus uniform and collimated light beam on back focal plane of an objective lens disposed above the sample. By changing the position of the focus position on the back focal plane, it is capable of being adjusted to change the incident angle with respect to the sample. | 01-14-2010 |
| 20100053627 | REFLECTIVE SCATTEROMETER - A reflective scatterometer capable of measuring a sample is provided. The reflective scatterometer includes a paraboloid mirror, a light source, a first reflector, a second reflector and a detector. The paraboloid mirror has an optical axis and a parabolic surface, wherein the sample is disposed on the focal point of the parabolic surface and the normal direction of the sample is parallel with the optical axis. A collimated beam generated from the light source is reflected by the first reflector to the parabolic surface and then is reflected by the parabolic surface to the sample to form a first diffracted beam. The first diffracted beam is reflected by the parabolic surface to the second reflector and is then reflected by the second reflector to the detector. | 03-04-2010 |
| 20110131538 | METHOD FOR DESIGNING TWO-DIMENSIONAL ARRAY OVERLAY TARGETS AND METHOD AND SYSTEM FOR MEASURING OVERLAY ERRORS USING THE SAME - A method for designing a two-dimensional array overlay target comprises the steps of: selecting a plurality of two dimensional array overlay targets having different overlay errors; calculating a deviation of a simulated diffraction spectrum for each two-dimensional array overlay target; selecting an error-independent overlay target by taking the deviations of the simulated diffraction spectra into consideration; and designing a two dimensional array overlay target based on structural parameters of the error-independent overlay target. | 06-02-2011 |
| 20110154272 | METHOD FOR DESIGNING TWO-DIMENSIONAL ARRAY OVERLAY TARGET SETS AND METHOD AND SYSTEM FOR MEASURING OVERLAY ERRORS USING THE SAME - A method for designing a two-dimensional array overlay target set comprises the steps of: selecting a plurality of two-dimensional array overlay target sets having different overlay errors; calculating a deviation of a simulated diffraction spectra for each two-dimensional array overlay target set; selecting a sensitive overlay target set by taking the deviations of the simulated diffraction spectra into consideration; and designing a two-dimensional array overlay target set based on the structural parameters of the sensitive overlay target set. | 06-23-2011 |
| 20110172974 | SYSTEM AND METHOD FOR VIA STRUCTURE MEASUREMENT - A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums. | 07-14-2011 |
| 20110320986 | METHOD FOR DESIGNING OVERLAY TARGETS AND METHOD AND SYSTEM FOR MEASURING OVERLAY ERROR USING THE SAME - A method for designing an overlay target comprises selecting a plurality of overlay target pairs having different overlay errors or offsets, calculating a deviation of the simulated diffraction spectrum for each overlay target pair, selecting a plurality of sensitive overlay target pairs by taking the deviation of the simulated diffraction spectrum into consideration, selecting an objective overlay target pair from the sensitive overlay target pairs by taking the influence of the structural parameters to the simulated diffraction spectrum into consideration, and designing the overlay target pair based on the structural parameter of the objective overlay target pair. | 12-29-2011 |
