| Patent application number | Description | Published |
|---|
| 20090079956 | Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure - A 3-D LADAR imaging system incorporating stacked microelectronic layers is provided. A light source such as a laser is imaged upon a target through beam shaping optics. Photons reflected from the target are collected and imaged upon a detector array through collection optics. The detector array signals are fed into a multilayer processing module wherein each layer includes detector signal processing circuitry. The detector array signals are amplified, compared to a user-defined threshold, digitized and fed into a high speed FIFO shift register range bin. Dependant on the value of the digit contained in the bins in the register, and the digit's bin location, the time of a photon reflection from a target surface can be determined. A T | 03-26-2009 |
| 20100177277 | ELECTRO-ACTIVE SPECTACLES AND ASSOCIATED ELECTRONICS - Aspects of the present invention provide electronics for controlling and synchronizing operation of electro-active lenses regardless of frame type, size or style. The controlling electronics can be contained within one or more electronic modules positioned within the frame temples and can be removable and reprogrammable and can include inductive charge regions. Conductive links between electronic modules and/or between left and right sides of the electro-active spectacles can include left and right upper and lower rim portions of the frame, the bridge, conductive layers of the electro-active lenses, the upper and lower grooves of the electro-active lenses, and/or wires embedded within any portion of the frame. Aspects of the present invention also provide chargers for recharging electro-active spectacles of any size, shape or style using adjustable inductive charging cradles to inductively charge electro-active spectacles of the present invention. | 07-15-2010 |
| 20110096511 | Ultra-low profile multi-chip module - The disclosed invention comprises a substrate having one or more conductive metal traces comprising one or more electrical access leads terminating on a lateral surface of the substrate. | 04-28-2011 |
