Patent application number | Description | Published |
20120273935 | Semiconductor Device and Method of Making a Semiconductor Device - A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate. | 11-01-2012 |
20120289023 | Method for Producing a Semiconductor Device - A method for producing a semiconductor device having a sidewall insulation includes providing a semiconductor body having a first side and a second side lying opposite the first side. At least one first trench is at least partly filled with insulation material proceeding from the first side in the direction toward the second side into the semiconductor body. The at least one first trench is produced between a first semiconductor body region for a first semiconductor device and a second semiconductor body region for a second semiconductor device. An isolating trench extends from the first side of the semiconductor body in the direction toward the second side of the semiconductor body between the first and second semiconductor body regions in such a way that at least part of the insulation material of the first trench adjoins at least a sidewall of the isolating trench. The second side of the semiconductor body is partly removed as far as the isolating trench. | 11-15-2012 |
20120299170 | Module and Method of Manufacturing a Module - A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity. | 11-29-2012 |
20120309130 | Method of Manufacturing a Semiconductor Device - In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier. | 12-06-2012 |
20130015467 | System and Method for Wafer Level PackagingAANM Krumbein; UlrichAACI RosenheimAACO DEAAGP Krumbein; Ulrich Rosenheim DEAANM Lohninger; GerhardAACI MuenchenAACO DEAAGP Lohninger; Gerhard Muenchen DEAANM Dehe; AlfonsAACI ReutlingenAACO DEAAGP Dehe; Alfons Reutlingen DE - In an embodiment, a semiconductor device includes a semiconductor substrate. The semiconductor substrate has a first cavity disposed through it, and conductive material covers at least the bottom portion of the first cavity. An integrated circuit is disposed on the top surface of the conductive material. The device further includes a cap disposed on the top surface of the substrate, such that a cavity disposed on a surface of the cap overlies the first cavity in the substrate. | 01-17-2013 |
20130223023 | MEMS Structure with Adjustable Ventilation Openings - A MEMS structure includes a backplate, a membrane, and an adjustable ventilation opening configured to reduce a pressure difference between a first space contacting the membrane and a second space contacting an opposite side of the membrane. The adjustable ventilation opening is passively actuated as a function of the pressure difference between the first space and the second space. | 08-29-2013 |
20140231974 | Module and Method of Manufacturing a Module - A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity. | 08-21-2014 |