Patent application number | Description | Published |
20080211524 | Electrochemically Fabricated Microprobes - Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided. | 09-04-2008 |
20090256583 | Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes - Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both. | 10-15-2009 |
20100134131 | Electrochemically Fabricated Microprobes - Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided. | 06-03-2010 |
20100176834 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 07-15-2010 |
20110187397 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 08-04-2011 |
20140216941 | Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion - Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers. | 08-07-2014 |
20140231264 | Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 08-21-2014 |
Patent application number | Description | Published |
20100264033 | DIRECTIONAL CONDUCTIVITY NANODEPOSITS - A directional conductivity nanocomposite material, apparatuses and processes for making such material are generally described. A directional conductivity nanocomposite material may comprise a supporting material such as ceramic or polymer, with directionally conductive nanorod structures running through the supporting material. The material may be made by orienting nanorods in an electrophoretic gel using an electrical or magnetic field to align the nanorods, removing the gel, reinforcing the nanorods, and flowing in supporting material. | 10-21-2010 |
20110090219 | DIFFERENTIAL TRIALS IN AUGMENTED REALITY - Techniques for displaying virtual objects on devices in differential situations are provided. Augmented reality authoring ensures that users have a consistent experience with virtual objects, including augmented reality images, by delivering the same versions of the virtual objects to devices that are close in terms, for instance, of at least distance and/or time. Devices that are not sufficiently close may receive different versions of the virtual object, thus ensuring that the users of devices that are sufficiently near each other do not experience different versions of the virtual object. | 04-21-2011 |
20120189836 | DIRECTIONAL CONDUCTIVITY NANOCOMPOSITES - A directional conductivity nanocomposite material, apparatuses and processes for making such material are generally described. A directional conductivity nanocomposite material may comprise a supporting material such as ceramic or polymer, with directionally conductive nanorod structures running through the supporting material. The material may be made by orienting nanorods in an electrophoretic gel using an electrical or magnetic field to align the nanorods, removing the gel, reinforcing the nanorods, and flowing in supporting material. | 07-26-2012 |
Patent application number | Description | Published |
20090065142 | Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion - Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers. | 03-12-2009 |
20090066351 | ELECTROCHEMICALLY FABRICATED MICROPROBES - Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously. | 03-12-2009 |
20100155253 | Microprobe Tips and Methods for Making - Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like. | 06-24-2010 |
20110155580 | Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion - Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers. | 06-30-2011 |
20110187398 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 08-04-2011 |
20120062260 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 03-15-2012 |
20120064226 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 03-15-2012 |
20120064227 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 03-15-2012 |
Patent application number | Description | Published |
20110087815 | Interrupt Masking for Multi-Core Processors - Technologies are generally described herein for handling interrupts within a multi-core processor. A core specific interrupt mask (“CIM”) can be adapted to influence the assignment of interrupts to particular processor cores in the multi-core processor. Available processor cores can be identified by evaluating the CIM. An interrupt with an interrupt service routine (“ISR”) that is received by the multi-core processor can be assigned to one or more of the available processor cores identified by the CIM. | 04-14-2011 |
20110088021 | Parallel Dynamic Optimization - Technologies are generally described for parallel dynamic optimization using multicore processors. A runtime compiler may be adapted to generate multiple instances of executable code from a portable intermediate software module. The various instances of executable code may be generated with variations of optimization parameters such that the code instances each express different optimization attempts. A multicore processor may be leveraged to simultaneously execute some, or all, of the various code instances. Preferred optimization parameters may be determined from the executable code instances that may correctly complete in the least time, or may use the least amount of memory, or that may prove superior according to some other fitness metric. Preferred optimization parameters may be used to seed future optimization attempts. Output generated from the preferred instances may be used as soon as the first instance correctly completes block. | 04-14-2011 |
20110088022 | Dynamic Optimization Using A Resource Cost Registry - Technologies are generally described for runtime optimization adjusted dynamically according to changing costs of one or more system resources. Multicore systems may encounter dynamic variations in performance associated with the relative cost of related system resources. Furthermore, multicore systems can experience dramatic variations in resource availability and costs. A dynamic registry of system resource costs can be utilized to guide dynamic optimization. The relative scarcity of each resource can be updated dynamically within the registry of system resource costs. A runtime code generating loader and optimizer may be adapted to adjust optimization according to the resource cost registry. Information regarding system resource costs can support optimization tradeoffs based on resource cost functions. | 04-14-2011 |
20110088038 | Multicore Runtime Management Using Process Affinity Graphs - Technologies are generally described for runtime management of processes on multicore processing systems using process affinity graphs. Two or more processes may be determined to be related when the processes share interprocess messaging traffic. These related processes may be allocated to neighboring or nearby processor cores within a multicore processor using graph theory techniques as well as communication analysis techniques to evaluate interprocess communication needs. Process affinity graphs may be established to aid in determining grouping of processors and evaluating interprocess message traffic between groups of processes. The process affinity graphs may be based upon process affinity scores determined by monitoring and analyzing interprocess messaging traffic. Process affinity graphs may further inform splitting process affinity groups from one core onto two or more cores. | 04-14-2011 |
20110093733 | Power Channel Monitor For A Multicore Processor - Technologies are generally described for power channel monitoring in multicore processors. A power management system can be configured to monitor the power channels supplying individual cores within a multicore processor. A power channel monitor can provide a direct measurement of power consumption for each core. The power consumption of individual cores can indicate which cores are encountering higher or lower usage. The usage determination can be made without sending any data messages to, or from, the cores being measured. The determined usage load being serviced by each processor core may be used to adjust power and/or clock signals supplied to the cores. | 04-21-2011 |
20110136283 | Process for fabricating MEMS devices - A process for fabricating a MEMS device with movable comb teeth and stationary comb teeth. A single mask is used to define, during a series of processing steps, the location and width of both movable comb teeth and stationary comb teeth so as to assure self alignment of the comb teeth. MEMS devices are fabricated from a single multi-layer semi-conductor structure of semiconductor material and insulator material. In a preferred embodiment the process is employed to provide a MEMS mirror device having a movable structure, a movable frame, a first set of two torsional members, a first set of at least four comb drives, an outer fixed frame structure, a second set of two torsional members, and a second set of at least four comb drives. | 06-09-2011 |