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Krueger, Muenchen
Christof Krueger, Muenchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20110037852 | DEVICE, METHOD, AND COMPUTER FOR IMAGE-BASED COUNTING OF OBJECTS PASSING THROUGH A COUNTING SECTION IN A SPECIFIED DIRECTION - For operators of public or commercial buildings, such as supermarkets, it is interesting to determine how many persons, in particular potential buyers, enter the building each day. In other areas, as well, entering and exiting moving objects are counted: it is typical, for example, that cars driving into and out of a parking garage are counted. The invention relates to a device | 02-17-2011 |
Hans Krueger, Muenchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20090071710 | Flip-Chip Component and Method for its Production - The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation. | 03-19-2009 |
| 20090104415 | Element with Optical Marking, Manufacturing Method, and Use - A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable. | 04-23-2009 |
| 20100127377 | Method for Producing a MEMS Package - A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate. | 05-27-2010 |
| 20100148285 | MEMS Component and Method for Production - A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip. | 06-17-2010 |
| 20100187949 | Component with Reduced Temperature Response, and Method for Production - A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography. | 07-29-2010 |
| 20110114355 | HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTURING METHOD | 05-19-2011 |
Jan M.w. Krueger, Muenchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100156720 | Method and Apparatus for Optimizing the Accuracy of Position Determination and Reducing the Integrity Risk of a Receiver in a Global Satellite Navigation System - In a method for optimizing the accuracy of position determination, and/or for reducing the integrity risk, of a receiver in a global satellite navigation system having a plurality of satellites, for at least one satellite that is visible to the receiver (E), a deviation error (AF) is determined which is a function of the geometric orientation of the satellite relative to the receiver, and of at least one system parameter. The deviation error is determined based on an additional deviation error generated by an error projection into a coordinate system of the receiver. A first or a second value, whichever is smaller of the two, is used as the deviation error. The first value for the at least one system parameter is determined using a respective specified parameter value. The second value is determined for the at least one system parameter, using a modified parameter value which is modified with respect to the specified parameter value in such a way that a lower error in the modified parameter value of the at least one system parameter is accepted as true. | 06-24-2010 |
Martin Krueger, Muenchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20080219287 | DEVICE FOR DETERMINING A NUMBER OF DATA PACKETS - The invention is directed to a device for determining a number of data packets which are to be converted into a coded sequence with a predetermined number K | 09-11-2008 |
| 20100045336 | Method and Device for Programmable Power Supply with Configurable Restrictions - The invention involves a programmable power supply device with configurable restrictions to the programmability of the power supply device, wherein the programmable power supply device comprises a number of freeze/programmability levels, each freeze/programmability defining a dedicated access restriction to the programmability of the power supply device. | 02-25-2010 |