| Patent application number | Description | Published |
|---|
| 20090017248 | LAYERED BODY AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAYERED BODY - Provided is a layered body including a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body including a substrate to be ground, a joining layer having a curable acrylate polymer and a curable acrylate adhesion modifying agent in contact with the substrate to be ground, a photothermal conversion layer having a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support. | 01-15-2009 |
| 20090017323 | LAYERED BODY AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAYERED BODY - Provided is a layered body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body comprising a substrate to be ground, a joining layer including a curable adhesive in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support. | 01-15-2009 |
| 20090155596 | NOZZLE SEALING COMPOSITION AND METHOD - A method of applying a curable composition. The method includes providing a curable composition comprising about 10 to about 60 weight percent of one or more epoxy resins; about 20 to about 80 weight percent of one or more resins selected from polyester resins, ethyl vinyl acetate resins, thermoplastic resins, and acrylate resins; up to about 30 weight percent of one or more hydroxyl-containing compounds; and an initiator selected from a photoinitiator, a thermal initiator, and combinations thereof. The method further includes initiating cure of the curable composition. | 06-18-2009 |
| 20090155597 | CONDUCTIVE ADHESIVE PRECURSOR, METHOD OF USING THE SAME, AND ARTICLE - A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together. | 06-18-2009 |
| 20100056725 | DICING AND DIE ATTACH ADHESIVE - Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt. | 03-04-2010 |
| 20110097212 | TOUGHENED CURABLE COMPOSITIONS - Toughened curable compositions are described. The curable compositions include a curable resin, surface-modified nanoparticles, and rubber nano-domains. Both core-shell rubber nano-domains, and nano-rubber domains arising from self-assembled block co-polymers are disclosed. Toughened, cured resin compositions, and articles comprising such cured compositions are also discussed. | 04-28-2011 |
