Krommenhoek
Daniel Krommenhoek, Carls Bad, CA US
Patent application number | Description | Published |
---|---|---|
20100269879 | Low-cost quantum well thermoelectric egg-crate module - Quantum well thermoelectric modules and a low-cost method of mass producing the modules. The devices are comprised of n-legs and p-legs, each leg being comprised of layers of quantum well material in the form of very thin alternating layers. In the n-legs the alternating layers are layers of n-type semiconductor material and electrical insulating material. In the p-legs the alternating layers are layers of p-type semiconductor material and electrical insulating material. In preferred embodiments the layers, referred to as superlattice layers are about 4 nm to 20 nm thick. The layers of quantum well material is separated by much larger layers of thermal and electrical insulating material such that the volume of insulating material in each leg is at least 20 times larger than the volume of quantum well material. | 10-28-2010 |
Daniel Krommenhoek, Carlsbad, CA US
Patent application number | Description | Published |
---|---|---|
20080257395 | Miniature quantum well thermoelectric device - A miniature quantum well thermoelectric device. The device includes a number of quantum well n-legs and a number of quantum well p-legs. Each of the p-legs are alternately electrically connected in series with each of the n-legs at locations that are thermal communication with a cold side and a hot side. The device can be adapted to function as a cooler and it can be adapted to function as an electric power generator. In a preferred embodiment the p-legs and said n-legs are configured generally radially between the hot side and the cold side. In this preferred embodiments each of the n-legs has at least 600 n-type layers with each n-type layer separated from other n-type layers by an insulating layer and each of the p-legs has at least 600 p-type layers with each p-type layer separated from other p-type layers by an insulating layer. | 10-23-2008 |
20110100408 | Quantum well module with low K crystalline covered substrates - A thermoelectric module comprised of a quantum well thermoelectric material with low thermal conductivity and low electrical resitivity (high conductivity) for producing n-legs and p-legs for thermoelectric modules. These qualities are achieved by fabricating crystalline quantum well super-lattice layers on a substrate material having very low thermal conductivity. Prior to depositing the super-lattice thermoelectric layers the low thermal conductivity substrate is coated with a thin layer of crystalline semi-conductor material, preferably silicon. This greatly improves the thermoelectric quality of the super-lattice quantum well layers. In preferred embodiments the super-lattice layers are about 4 nm to 20 nm thick. In preferred embodiments about 100 to 1000 of these super-lattice layers are deposited on each substrate layer, to provide films of super-lattice layers with thicknesses of in the range of about 0.4 microns to about 20 microns on much thicker substrates. The substrates may be a few microns to a few millimeters thick. The thermoelectric films are then stacked and fabricated into thermoelectric p-legs and n-legs which in turn are fabricated into thermoelectric modules. These layers of quantum well material may in preferred embodiments be separated by much thicker layers of thermal and electrical insulating material such that the volume of insulating material in each leg is at least 20 times larger than the volume of quantum well material. | 05-05-2011 |
Daniel Krommenhoek, San Diego, CA US
Patent application number | Description | Published |
---|---|---|
20110284048 | MULTI-LAYER SUPERLATTICE QUANTUM WELL THERMOELECTRIC MATERIAL AND MODULE - A multi-layer superlattice quantum well thermoelectric material comprising at least 10 alternating layers has a layer thickness of each less than 50 nm, the alternating layers being electrically conducting and barrier layers, wherein the layer structure shows no discernible interdiffusion leading to a break-up or dissolution of the layer boundaries upon heat treatment at a temperature in the range from 50 to 150° C. for a time of at least 100 hours and the concentration of doping materials in the conducting layers is 10 | 11-24-2011 |
Daniel J. Krommenhoek, Wake Forest, NC US
Patent application number | Description | Published |
---|---|---|
20110062420 | Quantum well thermoelectric module - Quantum well thermoelectric modules and a low-cost method of mass producing the modules. The devices are comprised of n-legs and p-legs, each leg being comprised of layers of quantum well material in the form of very thin alternating layers. In the n-legs the alternating layers are layers of n-type semiconductor material and electrical insulating material. In the p-legs the alternating layers are layers of p-type semiconductor material and electrical insulating material. Both n-legs and p-legs are comprised of materials providing similar thermal expansion. In preferred embodiments the layers, referred to as super-lattice layers are about 4 nm to 20 nm thick. The layers of quantum well material is separated by much larger layers of thermal and electrical insulating material such that the volume of insulating material in each leg is at least 20 times larger than the volume of quantum well material. | 03-17-2011 |
Erik Eduard Krommenhoek, Enschede NL
Patent application number | Description | Published |
---|---|---|
20120304752 | SENSOR SYSTEM FOR DIFFERENTIAL PRESSURE MEASUREMENT - Techniques disclosed herein include systems and methods for sensor systems for measuring pressure in an exhaust conduit of a combustion engine. The sensor system includes an electronics module assembly and a housing assembly for housing the electronics module assembly. The electronics module assembly can include several components such as sensing element carrier element with a sensing element, an electronics module carrier element carrying electronic components. Electrical connections can be provided between the electronic module carrier element and the sensing element carrier element. Another component includes a main carrier element for supporting the sensing element carrier element and the electronic module carrier element. | 12-06-2012 |
Johan Daniel Krommenhoek, Scarborough CA
Patent application number | Description | Published |
---|---|---|
20110221907 | Modular imaging system with wireless transmission and locking connector - A modular imaging system includes a camera module having a camera and an electrical interface for providing a video signal representing an image picked up by the camera, a wireless transmitter module having an electrical interface for receiving the video signal from the camera module and generating a high frequency signal, a wireless receiver module for receiving the high frequency signal from the wireless transmitter module and producing a baseband signal, and a display module for receiving the baseband signal and displaying the baseband signal on a display. A secondary interlock mechanism includes a U-shaped collar having eccentrically shaped holes and a depression for receiving a spring, and a module having alignment pin receptacles for receiving alignment pins having radial channels, and having the U-shaped collar inserted into the module and the spring so that the eccentrically shaped holes engage with the radial channels on the alignment pins to restrain the alignment pins from moving due to the force exerted on the U-shaped collar from the spring. | 09-15-2011 |
Steven Krommenhoek, Annandale, NJ US
Patent application number | Description | Published |
---|---|---|
20130252404 | KEYED WAFER CARRIER - A structure for a chemical vapor deposition reactor desirably includes a reaction chamber having an interior, a spindle mounted in the reaction chamber, and a wafer carrier releasably mounted onto the spindle for rotation therewith. The spindle desirably has a shaft extending along a vertical rotational axis and a key projecting outwardly from the shaft. The wafer carrier preferably has a body defining oppositely-facing top and bottom surfaces and at least one wafer-holding feature configured so that a wafer can be held therein with a surface of the wafer exposed at the top surface of the body. The wafer carrier desirably further has a recess extending into the body from the bottom surface of the body and a keyway projecting outwardly from a periphery of the recess along a first transverse axis. The shaft preferably is engaged in the recess and the key preferably is engaged into the keyway. | 09-26-2013 |