Krishna R.
Krishna R. Chellemella, Troy, MI US
Patent application number | Description | Published |
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20120183346 | JOINING ARRANGEMENT WITH ADJUSTMENT OPTION - The present invention relates to a joining arrangement for joining joining partners of a vehicle, including a first joining partner and at least one second joining partner wherein a holding device is provided that serves for connecting the joining partners in order to form the joining arrangement, where the holding device has a receiving structure at which at least one adhesive element is arranged that can be brought into at least two states, where in a first state the adhesive element allows for adjusting the second joining partner to the first joining partner and where a transition from the first state to a second state can be effected by a transformation means, where in the second state the adhesive element is cured, whereby the joining partners can be fixed to each other. | 07-19-2012 |
Krishna R. Tunga, Wappingers Falls, NY US
Patent application number | Description | Published |
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20120326294 | MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE - A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant. | 12-27-2012 |
20140015387 | NON-HERMETIC SEALED MULTI-CHIP MODULE PACKAGE - A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface. | 01-16-2014 |
20140027898 | MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE - A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant. | 01-30-2014 |
Krishna R. Yejju, Dunlap, IL US
Patent application number | Description | Published |
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20150330319 | SYSTEM AND METHOD OF OPERATING ENGINE - A method of operating an engine includes determining an intake air temperature and an engine speed. The method includes selectively initiating one of a first operating mode, a second operating mode and a third operating mode based on at least the intake air temperature and the engine speed. The first operating mode includes increasing the engine speed progressively by an incremental speed value. The second operating mode includes deactivating at least one Exhaust Gas Recirculation (EGR) cylinder of the engine. The third operating mode includes shutting down the engine. | 11-19-2015 |