| Patent application number | Description | Published |
|---|
| 20080237680 | Enabling flash cell scaling by shaping of the floating gate using spacers - According to embodiments of the invention, an inverted âTâ shaped gate can be formed for transistor flash memory cells to reduce feature sizes, to reduce pitch size, to increase gate coupling ratio and/or to reduce parasitic capacitive effects between adjacent flash cells or cell floating gates, such as with optimization of control gate distance between field gates. Such feature sizes include channel width; isolation region width; width of a portion of a gate electrode and/or half-pitch distance between adjacent cells or rows of transistors (e.g., cells). | 10-02-2008 |
| 20090001443 | NON-VOLATILE MEMORY CELL WITH MULTI-LAYER BLOCKING DIELECTRIC - Disclosed is a non-volatile memory cell. The non-volatile memory cell includes a substrate having an active area. A bottom dielectric layer is disposed over the active area of the substrate which provides tunneling migration to the charge carriers towards the active area. A charge storage node is disposed above the bottom dielectric layer. Further, the non-volatile memory cell includes a plurality of top dielectric layers disposed above the charge storage node. Each of the plurality of top dielectric layers can be tuned with a set of attributes for reducing a leakage current through the plurality of top dielectric layers. Over the plurality of top dielectric layers, a control gate is disposed. | 01-01-2009 |
| 20090283817 | FLOATING GATE STRUCTURES - Floating gate structures are generally described. In one example, an electronic device includes a semiconductor substrate, a tunnel dielectric coupled with the semiconductor substrate, and a floating gate structure comprising at least a first region having a first electron energy level or electron workfunction or carrier capture efficiency coupled with the tunnel dielectric and a second region having a second electron energy level or electron workfunction or carrier capture efficiency coupled with the first region wherein the first electron energy level or electron workfunction or carrier capture efficiency is less than the second electron energy level or electron workfunction or carrier capture efficiency. Such electronic device may reduce the thickness of the floating gate structure or reduce leakage current through an inter-gate dielectric, or combinations thereof, compared with a floating gate structure that comprises only polysilicon. | 11-19-2009 |
| 20100110795 | BOOSTING SEED VOLTAGE FOR A MEMORY DEVICE - A method and device using bitline-bitline capacitance between adjacent bitlines to boost seed voltage in a memory device are provided. The method may include a precharge phase, a boost phase, an equalize phase, and a lock in phase. In one embodiment, the method may include boosting the seed voltage twice. The bitlines may be divided into one or more segments. | 05-06-2010 |
| 20100155807 | Apparatus and methods for improved flash cell characteristics - Embodiments of an apparatus and methods for providing improved flash memory cell characteristics are generally described herein. Other embodiments may be described and claimed. | 06-24-2010 |
| 20100195383 | Isolated P-well Architecture for a Memory Device - A memory device and a method to prevent or reduce program disturb by isolating P-wells of strings in a non-volatile memory array. During a program operation, the isolated P-wells may be coupled to corresponding bitlines, which may be selected or inhibited, and may be at different voltages. During erase, read, and verify operations, the isolated P-wells may be coupled to source. | 08-05-2010 |
| 20100232234 | MEMORY DEVICE HAVING IMPROVED PROGRAMMING OPERATION - Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation. | 09-16-2010 |
| 20110090739 | INDEPENDENT WELL BIAS MANAGEMENT IN A MEMORY DEVICE - Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods. | 04-21-2011 |
