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Kriman
Boris Kriman, Freeport BS
| Patent application number | Description | Published |
|---|---|---|
| 20100224126 | Electrostatic flocking device - A portable electrostatic flocking device, has a housing configured as a wand, an electrostatic generator configured as a Van de Graaf generator located in said wand, and a container for accommodating flock and having a permeable wall. | 09-09-2010 |
Boris Kriman, Atlanta, GA US
| Patent application number | Description | Published |
|---|---|---|
| 20090209171 | Electrostatic toy - An electrostatic toy has a levitating object; and an electrostatic wand which causes levitation of the object and is provided with an electrostatic generator that charges the wand and is operatable by one hand of a user. | 08-20-2009 |
Moshe Kriman, Charlotte, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20100230795 | STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS - A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads. | 09-16-2010 |
Moshe Kriman, Tel Aviv IL
| Patent application number | Description | Published |
|---|---|---|
| 20090316378 | Wafer level edge stacking - A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface and at least one edge surface extending at angles other than a right angle away from the first and second surfaces. At least one electrically conductive element extends along the first surface onto at least one of the edge surfaces and onto the second surface. At least one conductive element of the first microelectronic device can be conductively bonded to the at least one conductive element of the second microelectronic device to provide an electrically conductive path therebetween. | 12-24-2009 |