Patent application number | Description | Published |
20080216741 | DYNAMIC FILM THICKNESS CONTROL SYSTEM/METHOD AND ITS UTILIZATION - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 09-11-2008 |
20100147214 | Dynamic Film Thickness Control System/Method and its Utilization - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 06-17-2010 |
20100147216 | Dynamic Film Thickness Control System/Method and its Utilization - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 06-17-2010 |
20100170437 | Dynamic Film Thickness Control System/Method and its Utilization - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 07-08-2010 |
20100180818 | Dynamic Film Thickness Control System/Method and its Utilization - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 07-22-2010 |
20100224127 | Dynamic Film Thickness Control System/Method and its Utilization - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 09-09-2010 |
20100224486 | Dynamic Film Thickness Control System/Method and its Utilization - A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed. | 09-09-2010 |
20100233946 | Polishing holder for workpiece end surface - A polishing holder for a workpiece end surface comprises a main body and a framework, in which the main body is coupled to a plurality of fixtures used for coupling to polished-to-be workpieces, a periphery of the main body is provided with a ring first supporting portion; a framework, provided with a second supporting portion surrounding an outside of the first supporting portion. Whereby, the second supporting portion limits a deviation region of the first supporting portion to enable the main body to be kept parallel to a polishing surface during a polished end surface of the workpiece is brought into contact with the polishing surface and polished thereby so that the production time and cost of the first supporting portion can be reduced broadly. | 09-16-2010 |