Patent application number | Description | Published |
20130196506 | Apparatuses and Methods for Gas Mixed Liquid Polishing, Etching, and Cleaning - In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid. | 08-01-2013 |
20140210054 | Semiconductor Devices and Methods of Producing These - A method includes applying a reinforcing wafer to a semiconductor wafer, thereby forming a composite wafer. Further the method includes dividing the composite wafer, thereby generating a plurality of composite chips each including a semiconductor chip and a reinforcing chip. | 07-31-2014 |
20140374023 | Apparatuses and Methods for Gas Mixed Liquid Polishing, Etching, and Cleaning - In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid. | 12-25-2014 |