Patent application number | Description | Published |
20090173426 | Multilayered circuitized substrate with p-aramid dielectric layers and method of making same - A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided. | 07-09-2009 |
20090241332 | Circuitized substrate and method of making same - A circuitized substrate and method of making same in which a first plurality of holes are formed within two bonded dielectric layers and then made conductive, e.g., plated. The substrate also includes third and fourth dielectric layers bonded to the first and second with a plurality of continuous electrically conductive thru holes extending through all four dielectric layers. Conductive paste is positioned within the thru holes for providing electrical connections between desired conductive layers of the substrate and outer layers as well. A circuitized substrate assembly and method of making same are also provided. | 10-01-2009 |
20090258161 | Circuitized substrate with P-aramid dielectric layers and method of making same - A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided. | 10-15-2009 |
20110017498 | Photosensitive dielectric film - A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided. | 01-27-2011 |
20110207866 | Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized Substrates - A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. The composition includes at least three resins: a halogen-free flame retardant, methyl ethyl ketone (prior to final layer formation), manganese octoate, and a coupling agent. The composition does not include a halogen or a fluoropolymer as part thereof. Dielectric layers formed from the composition are capable of withstanding the relatively high temperatures associated with lead-free solder applications. The composition may or may not include inorganic filler as part thereof. | 08-25-2011 |
20120012553 | METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES - A method for making a leadless chip carrier (LCC) for use in electronic packages having a core layer stripped of copper cladding, containing drilled clearance holes within, a layer of resin coated copper (RCC) placed on the upper surface of the core layer and a second layer of RCC placed on the lower surface of the core layer. The layers are laminated together with the RCC filling the clearance holes during lamination. A pattern is etched on the RCC and vias are drilled through the filled clearance holes and pre-plated with seed copper layers. The seed copper layers in the vias are then covered by a layer of copper plating to meet the requirements of the core buildup layer, and resin inhibiting conductive anodic filament (CAF) growth within the structure. | 01-19-2012 |
20120017437 | CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE - A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto. | 01-26-2012 |
20120247822 | CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRUCTURE - A substrate for use in a laminated chip carrier (LCC) and a system in package (SiP) device having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can include thermoset and thermoplastic resin. | 10-04-2012 |