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Komatsu, Kanagawa-Ken

Akihiro Komatsu, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20110236262BIOLOGICAL SUBSTANCE DETECTING APPARATUS - A biological substance detecting apparatus that enables stable detection and quantitative analysis of biologically derived target substances is provided. The biological substance detecting apparatus employs a sensor chip provided with a fine flow channel through which a sample liquid is caused to flow, and a sensor surface that adsorbs a biologically derived target substance. Light is irradiated onto the sensor surface, and light emitted by the adsorbed target substance or a labeling substance bound thereto is detected. A flow speed controlling means, for controlling the flow speed of the sample liquid that flows through the fine flow channel to a value within a range such that the adsorption speed of the target substance is not controlled by dispersion.09-29-2011

Akira Komatsu, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20110220970SOLID STATE IMAGING DEVICE - In one embodiment, a semiconductor substrate has first and second principal surfaces opposite to each other, and has a penetration hole extending from the first principal surface to the second principal surface. An imaging element portion is formed on the first principal surface side. A first insulating film is formed on the first principal surface side. An interconnection electrode is formed in the first insulating film and connected to the imaging element portion. A second insulating film is provided to cover a surface of the penetration hole and the second principal surface except at least a portion facing the interconnection electrode. The second insulating film contains particles and is configured to intercept an infrared ray and to transmit a visible light. A conductor film contacts the interconnection electrode and is formed on the second insulating film.09-15-2011

Kanako Komatsu, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20120025307METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include simultaneously forming a first field insulating film and at least one second field insulating film on a front face side of a semiconductor layer. The at least one second field insulating film is separated from the first field insulating film and thinner than the first field insulating film. The method can include forming a drift region of a first conductivity type in a region of the semiconductor layer including the first field insulating film and the second field insulating film. The method can include forming a drain region of the first conductivity type in the front face of the semiconductor layer on a side of the first field insulating film. In addition, the method can include forming a source region of the first conductivity type in the front face of the semiconductor layer on a side of the second field insulating film.02-02-2012

Michiyasu Komatsu, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20090090452PROCESS FOR PRODUCING NONFLAT CERAMIC SUBSTRATE - In the production of a ceramic substrate (04-09-2009
20090283309CERAMIC-METAL BONDED BODY, METHOD FOR MANUFACTURING THE BONDED BODY AND SEMI-CONDUCTOR DEVICE USING THE BONDED BODY - Problem is to provide a ceramic-metal composite and a semiconductor device that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module.11-19-2009
20100054652SILICON NITRIDE SINTERED COMPACT AND SLIDING MEMBER USING THE SAME - A silicon nitride sintered compact contains silicon nitride grains, and a sintering aid component in a range of 2 to 15 mass %. The silicon nitride grains include needle crystal grains each having a long diameter L of 10 μm or less and a ratio (L/S) of the long diameter L to a short diameter S of 5 or more, by 50% or more in area ratio in a crystalline structure of the silicon nitride sintered compact. The silicon nitride sintered compact is used as a sliding member like a bearing ball (03-04-2010

Patent applications by Michiyasu Komatsu, Kanagawa-Ken JP

Takahiro Komatsu, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20110211430Disc discrimination apparatus and method - Detection is made as to at least one of a ratio between a tracking error and a focus error, and a duty cycle of an off-track signal with respect to an optical disc. A decision is made as to whether or not the optical disc is playable on the basis of the detected at least one of the ratio and the duty cycle. The ratio is a ratio of the focus error to the tracking error or a ratio of the tracking error to the focus error.09-01-2011

Tetsuro Komatsu, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20100112734APPARATUS AND METHOD FOR MANUFACTURING LED DEVICE - A method for manufacturing an LED device, includes: mounting an LED chip, which emits a first light, on a bottom surface of a recess formed in an upper surface of a package, pouring a resin liquid containing phosphor particles, which emits a second light upon incidence of the first light, into the recess, fixing the package to a package fixing plate of an apparatus of the LED device, precipitating the phosphor particles in the resin liquid with a centrifugal force applying to the package in a direction from the upper surface to the lower surface of the package by rotating a rotary member with a rotary driving unit, and curing the resin liquid.05-06-2010
20100133568LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A light emitting device includes: a substrate including through electrodes; a light emitting element bonded onto the substrate and connected to the through electrodes; and a dielectric film made of a translucent inorganic material and spaced from the light emitting element so that an internal space is formed between the dielectric film and the substrate, emission light from the light emitting element being allowed to be emitted through the dielectric film, and a manufacturing the same are provided.06-03-2010
20100148198LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side opposite to the first surface of the multilayer body, the dielectric film having a first and second openings on a p-side electrode and an n-side electrode provided on the second surface; forming a seed metal on the dielectric film and an exposed surface of the first and second openings; forming a p-side metal interconnect layer and an n-side metal interconnect layer on the seed metal; separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal, which is provided between the p-side metal interconnect layer and the n-side metal interconnect layer; and forming a resin in a space from which the seed metal is removed.06-17-2010
20110018026LIGHT EMITTING DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING SAME - A method for manufacturing a light emitting device includes: measuring at least one of each wavelength of the emitted light of the light emitting element, each optical output of the emitted light of the light emitting element, and each chromaticity of the mixed light emitted through the mixed resin in a manufacturing process of the light emitting device; and adjusting chromaticity for each light emitting device by performing a prescribed chromaticity adjustment with regard to the mixed resin, on basis of a result obtained in the measuring, so that the chromaticity of the mixed light falls within a preset prescribed range.01-27-2011

Patent applications by Tetsuro Komatsu, Kanagawa-Ken JP

Yukio Komatsu, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20110063909NONVOLATILE SEMICONDUCTOR MEMORY AND METHOD OF TESTING THE SAME - A memory cell array and a peripheral circuit are provided. The memory cell array has a plurality of blocks which are erasing units respectively. Each of the blocks includes a plurality of memory cells. A block control unit operates according to input signals from outside and controls operation of the blocks. A ready/busy control circuit outputs a busy signal during a period of operation implementation for a block selected from the blocks, in response to an output from the block control unit. The ready/busy control circuit outputs a ready signal out of the period of the operation implementation for the selected block. A registration control unit registers the selected block as a bad block, in the case that the ready/busy control circuit outputs a busy signal when the registration control unit receives a bad block identification command.03-17-2011