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Komachi
Hirokazu Komachi, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110103797 | PLUGGABLE OPTICAL TRANSCEIVER AND METHOD FOR MANUFACTURING THE SAME - A pluggable optical transceiver is disclosed. The transceiver comprises a plurality of OSAs, an optical member and a plurality of inner fibers to couple the optical member with OSAs. The inner fibers each provides an inner connector to couple with one of OSAs. The housing, which installs the OSAs, the optical member and the inner fiber, is made of metal and has a grooves into which the inner fibers is set so as to arrange them orderly. | 05-05-2011 |
Mitsuru Komachi, Ota-Ku JP
| Patent application number | Description | Published |
|---|---|---|
| 20110111995 | GREASE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF - In this grease composition, a grease produced by mixing at least one base oil selected from a mineral oil-type lubricant base oil, a synthetic lubricant base oil, and a biodegradable lubricant base oil with a thickener is compounded with a wax and water, and an additive such as a surfactant and a defoamer is optionally compounded therewith. A soap containing a calcium sulfonate complex is used as the thickener. A carnauba wax is preferably used as the wax. Since this grease composition is mainly composed of a grease and a wax, the grease composition extremely facilities its removal operation after application, is environmentally friendly, and has extremely excellent anti-corrosion performance. When the grease composition is used by being applied to a base material of an object to be welded, an effect of preventing the adhesion of welding spatters can be obtained. | 05-12-2011 |
Nobuyoshi Komachi, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090055009 | Method for Determining Machining Plane of Planar Material, Machining Method and Device for Determining Machining Plane and Flat Surface Machining Device - Provided is a surface machining method for performing machining such as cutting, grinding, electrical discharging or the like to obtain a planar material of a uniform thickness. This method includes the steps of mounting a planar material on a surface plate, setting the coordinate axis in the plane direction of the planar material to X, Y, and setting the coordinate axis in the height direction of the planar material to Z, virtualizing an XY plane including an origin of the Z direction measured as a distance (height) Z | 02-26-2009 |
Tomonori Komachi, Musashino-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090179273 | SEMICONDUCTOR DEVICE - A semiconductor device according to the present invention includes: a first region having a first conductive type; a plurality of second regions having a second conductive type that differs from the first conductive type, and formed to be arranged in the first region; a plurality of third regions having the first conductive type and formed in the second regions; an electrode forming a channel between the first region and the third region; and a plurality of extended second regions having the second conductive type, arranged in the first region such as to individually include one of the second regions and having an impurity density that is lower than an impunity density of the second regions. | 07-16-2009 |