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Kolbeck
Andreas Kolbeck, Herzogenrath DE
| Patent application number | Description | Published |
|---|---|---|
| 20110120416 | MULTI-FUEL DIESEL INTERNAL COMBUSTION ENGINE - A diesel internal combustion engine that is operated advantageously at least predominantly according to the diesel principle, with a multi-fuel adaptation unit that reacts to various fuels of different mixtures and adapts an operating mode of the internal combustion engine to these fuels, wherein the multi-fuel adaptation unit comprises at least the following elements: | 05-26-2011 |
Anton Kolbeck, Röhrmoos DE
| Patent application number | Description | Published |
|---|---|---|
| 20090218663 | LEAD FRAME BASED SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterised in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface. | 09-03-2009 |
| 20110227229 | SEMICONDUCTOR WAFER PROCESSING - A method of processing a semiconductor wafer is provided which comprises treating a metallisation layer provided on a backside of the wafer to form a plurality of channels therein, such that at least some of the channels along substantially the length thereof extend through the thickness of the metallisation layer to the backside of the wafer, thereby exposing the material of the backside of the wafer. When the semiconductor wafer is separated into dies, each die is provided with a plurality of channels, which extend to an edge of the die. On attaching the die to a die attach flag by solder, the solder does not stick to the exposed material of the backside of the die, and channels are thereby formed in the solder. This allows venting of gases formed in the solder, and decreases void formation in the solder. | 09-22-2011 |
| 20110266663 | LEAD FRAME BASED SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterized in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface. | 11-03-2011 |
Anton Kolbeck, Bayern DE
| Patent application number | Description | Published |
|---|---|---|
| 20100237479 | Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(s) and Associated Method of Manufacturing - A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package ( | 09-23-2010 |
Anton Kolbeck, Röhrmoos DE
| Patent application number | Description | Published |
|---|---|---|
| 20090218663 | LEAD FRAME BASED SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterised in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface. | 09-03-2009 |
Christian Kolbeck, Kapfenberg AT
| Patent application number | Description | Published |
|---|---|---|
| 20100258612 | FRICTION STIR WELDING TOOL - The invention relates to a friction stir welding tool ( | 10-14-2010 |
Florian Kolbeck, Gundelsheim DE
| Patent application number | Description | Published |
|---|---|---|
| 20100180397 | Dirt-collecting device for a floor-cleaning machine, and floor-cleaning machine having such a dirt-collecting device - The invention relates to a dirt-collecting device for a floor-cleaning machine, for picking up a liquid from a floor surface which is to be cleaned, having a carrier and at least one wiping member for wiping the floor surface, the carrier and the at least one wiping member bounding a suction channel which opens out into a suction mouth and of which the free cross-sectional area, through which a suction stream can pass, decreases, at least in one channel portion, in a direction away from the suction mouth. In order to produce such a dirt-collecting device in a more cost-effective manner, it is proposed according to the invention that the suction channel has disposed in it at least one channel-narrowing member, which is produced separately from the carrier. The invention also relates to a floor-cleaning machine having such a dirt-collecting device. | 07-22-2010 |
Jeff Kolbeck, Wausau, WI US
| Patent application number | Description | Published |
|---|---|---|
| 20120241104 | INSULATING GLASS UNIT AND METHOD OF MAKING SAME - An insulating glass unit. The insulating glass unit includes at least two substantially parallel, spaced sheets of glass. The at least two sheets of glass are sealed together at their peripheral edges to define an insulating chamber. A light redirecting device is positioned within the insulating chamber. The light redirecting device includes a base member including a front face and a back face, a plurality of slats extending from the front face, and a plurality of openings formed in and extending through the base member. The openings are positioned relative to the slats such that light received by the slats is reflected therefrom and through the openings. | 09-27-2012 |
Thomas Kolbeck, Kalchreuth DE
| Patent application number | Description | Published |
|---|---|---|
| 20090066463 | METHOD TO PRODUCE A CURVED COIL, IN PARTICULAR A SUB-COIL OF A GRADIENT COIL FOR A MAGNETIC RESONANCE APPARATUS - In a method to produce a curved coil, in particular a sub-coil of a gradient coil for a magnetic resonance apparatus, at least one conductor is wound corresponding to a predetermined pattern on a winding plate, and a winding plate composed of multiple plate elements that are moveable relative to one another is used that is formed into a curved shape after the winding of the conductor, in which curved shape the conductor is fixed while maintaining the curved shape. | 03-12-2009 |
| 20100164675 | METHOD FOR PRODUCING A CYLINDRICAL RADIO-FREQUENCY SHIELD OF A CYLINDRICAL GRADIENT COIL FOR A MAGNETIC RESONANCE SYSTEM - In a method for manufacturing a cylindrical high-frequency shield of a cylindrical gradient coil for a magnetic resonance system, a number of planar shield elements are placed adjacent to one another on a cylindrical support, together with a solder band or solder strip on the support. The segments or elements are inductively soldered together by an inductive soldering device that moves along a longitudinal axis of the cylindrical support. | 07-01-2010 |
Thomas Kolbeck, Burgkirchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20110184214 | PROCESS OF MAKING FLUOROOLEFINS BY THERMAL DECOMPOSITION OF FLUORINATED MATERIALS - Process for producing fluorinated olefins from fluorinated materials, the process comprising thermally decomposing the fluoropolymers into fluoroolefins in a reactor having a feeding zone where the fluorinated materials are fed into the reactor and a decomposition zone where the fluorinated materials are thermally decomposed and wherein the thermal decomposition is carried out in the presence of microwave irradiation. | 07-28-2011 |