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Koki Hirano, Hitachinaka JP

Koki Hirano, Hitachinaka JP

Patent application numberDescriptionPublished
20080310848Combined optical and electrical transmission assembly and module - A combined optical and electrical transmission assembly includes a combined optical, electrical and power cable having an optical fiber, electrical wiring and a power line combined therein or a combined optical and electrical cable having an optical fiber and electrical wiring combined therein, and a combined optical and electrical transmission module that includes an electrical-to-optical conversion unit having a laser for converting electrical signals to optical signals and a driving IC for driving the laser, and/or an optical-to-electrical conversion unit having a photodiode for converting optical signals to electrical signals and an amplification IC for amplifying electrical signals from the photodiode. The combined optical and electrical transmission module is connected to both ends of the combined optical, electrical and power cable or the combined optical and electrical cable. The combined optical and electrical transmission modules are each connected with an electrical cable for transmitting electrical signals with an external device and a power cable for transmitting power. The length of the power cable is shorter than that of the electrical cable.12-18-2008
20080310854CONNECTED BODY AND OPTICAL TRANSCEIVER MODULE - An optical element amounted structure includes an optical element having an electrode such as a bump formed on a surface thereof, and a substrate having an electrode that is joined to the optical element formed on the surface. The structure of the electrode of the substrate has a substantially ring configuration or a substantially ring configuration a part of which is notched, and the optical element and the substrate are joined to each other in a configuration where a joining material such as a bump is inserted into an opening portion.12-18-2008
20090046978Mirror-Embedded Optical Waveguide and Fabrication Method of Same - A mirror embedded optical waveguide according to the present invention comprises: a core; an angled cut face in the core; an adhesive layer on the angled cut face, the adhesive layer having approximately the same refractive index as that of the core; and a metal film on the adhesive layer, the metal film being formed by transfer.02-19-2009
20090092356FABRICATION METHOD OF OPTICAL INTERCONNECTION COMPONENT AND OPTICAL INTERCONNECTION COMPONENT ITSELF - An optical fiber holder 04-09-2009
20090263077Flexible optical interconnection structure and method for fabricating same - A flexible optical interconnection structure has a plurality of layers including an optical waveguide made of a core and a clad. The core is disposed to include a neutral surface that is not affected by expansion or contraction by bending. Alternatively, when the neutral surface is position outside the core, the core is disposed to satisfy Δy≦0.03×R, in which Δy is a distance between the neutral surface and a surface of the core at a side near the neutral surface, and R is a curvature radius of an innermost surface of the flexible optical interconnection structure in the bent state.10-22-2009
20090285580Optical-Electrical Transceiver Module - An optical-electrical transceiver module is to connect an optical-electrical composite cable incorporating an optical fiber and an electric wire to a receptacle of external electrical equipment. The module comprises a base; an optical path conversion element provided on the base; a flexible printed circuit sheet provided on the optical path conversion element and having electrical wiring; a support plate provided on the base to support the flexible printed circuit sheet; an optical element provided on the flexible printed circuit sheet; and an electric connector. The flexible printed circuit sheet is extended over the support plate and the base. The base, support plate, and flexible printed circuit sheet are connected to the electric connector by insertion into the electric connecter.11-19-2009
20090324171Electronic Apparatus and Photoelectric Conversion Module - There is provided an electronic apparatus connectable to a receptacle of an external electric device. The electronic apparatus includes: a substrate; an electronic component mounted on the substrate; an electric connector which is provided on one longitudinal end of the substrate, electrically connected with the electronic component, and is insertable into the receptacle of the external electric device; first and second spacers respectively provided on the opposite surfaces of the substrate; a metal case for covering the substrate, the electronic component, the electric connector, and the first and second spacers; and a resin protective cover for covering the metal case. The metal case is provided in such a manner that an electrical connection portion thereof required for electrical connection with the receptacle is left exposed. The metal case is in contact with and supported by the first and second spacers.12-31-2009
20100067915PHOTOELECTRIC COMPOSITE WIRING COMPONENT AND ELECTRONIC APPARATUS EMPLOYING IT - To provide a photoelectric composite wiring component combining both characteristics of low power consumption of transmission over electrical wiring and large transmission capacity of optical transmission over optical wiring, and exhibiting a high power efficiency for the transmission capacity. A mechanism for switching between transmission of a transmission signal over an electrical transmission path and that over an optical transmission path depending on the modulation rate or the transmission rate of the transmission signal is provided. When the modulation rate or the transmission rate of the transmission signal is low, power supply to an optical transmitting/receiving section is stopped and the signal is transmitted over the electrical transmission path, thus achieving low power consumption. When the modulation rate or the transmission rate of the transmission signal is high, the signal is transmitted over the optical transmission path, thus achieving a large transmission capacity.03-18-2010

Patent applications by Koki Hirano, Hitachinaka JP