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Kokawa, JP
Daisuke Kokawa, Aichi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120112393 | NON-LINEAR SPRING STRUCTURE AND PRESSURE SPACER USING THE SAME - A pair of pressure plates and a spring unit situated between the pair of pressure plates. The spring unit includes plural springs. Each spring includes, in a longitudinally sectional shape, a curved central portion having substantially arc shape projecting in a direction perpendicular to an expansion/contraction direction, a pair of curved end portions each having substantially arc shape projecting at extensions of both ends of the curved central portion in a direction opposite to the projecting direction of the curved central portion, and base portions formed by extending edges of the curved end portions in substantially parallel with the direction perpendicular to the expansion/contraction direction. The base portions are respectively secured to the pair of pressure plates so the spring is located between the pair of pressure plates. The spring length in natural state has linear straight portions between the curved central portion and the curved end portions. | 05-10-2012 |
Hiroyuki Kokawa, Kashihara-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20110090469 | PROJECTION DISPLAY DEVICE AND ELECTRONIC DEVICE - A projection display device includes a light source; a light modulating section that modulates light from the light source; a main control section that drives and controls the light source and the light modulating section for operation; a standby control section that performs control in a standby state; a main power source unit that supplies power to the main control section; and a standby power source unit that, in the standby state, shuts off power supply from a commercial power source to the main power source unit and supplies power to the standby control section. In this arrangement, the standby power source unit is disposed on a substrate different from that the main power source unit is disposed on. | 04-21-2011 |
| 20110279790 | PROJECTION DISPLAY DEVICE - A projection display device includes: a projection portion which enlarges and projects the light modulated by a imager portion; a control circuit; and a main body cabinet. The projection portion is formed by a projection lens portion into which the light from the imager portion is entered and a mirror portion which reflects the light having passed through the projection lens portion and lets the light travel toward a projection plane. The mirror portion is disposed so as to be shifted from an optical axis of the projection lens portion in a direction opposite to a direction in which the incident light from the projection lens portion is turned back. The control circuit portion is disposed in a space which is produced between the projection lens portion and the main body cabinet by a position gap between the projection lens portion and the mirror portion. | 11-17-2011 |
Hiroyuki Kokawa, Sendai JP
| Patent application number | Description | Published |
|---|---|---|
| 20110062214 | FRICTION STIR TOOL - It is an object to provide a friction stir tool excellent in productivity, high temperature strength, and wear resistance at high temperatures. | 03-17-2011 |
Kiyozumi Kokawa, Anjo-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090250365 | Toolbox - A toolbox is configured to store at least one hand-held tool in a forward leaning position. A front end portion of a tool main body and a rear end potion of a handle are supported by a seat portion of the toolbox. | 10-08-2009 |
| 20100129701 | Battery packs - One aspect according to the present invention includes a battery pack having a battery pack body. The battery pack body includes a finger engaging portion engageable with a finger or fingers of an operator in a removing direction of the battery pack body from a power tool. | 05-27-2010 |
| 20110079409 | POWER TOOL - It is an object of the invention to provide an effective technique for reducing the load of user's fingers in a power tool. A representative power tool includes a body, a tool bit, a driving means and a handgrip that extends from a grip proximal end on the side of the body to a grip distal end in a direction that crosses the axial direction of the tool bit. The power tool includes a holding optimization region that is arranged on the handgrip and shaped to match with the holding form of the fingers of the user when the user holds the handgrip. Specifically, the holding optimization region at least includes the rear end surface of the grip distal end region such that a normal on the rear end surface crosses an axis of the tool bit forward of the handgrip. As a result, according to the invention, the force of the user's fingers and palm on the handgrip can be optimized. | 04-07-2011 |
Manabu Kokawa, Akashi-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110080043 | MOTORCYCLE - A motorcycle comprises an electricity accumulator configured to supply electric power to driving devices required for driving of the motorcycle and to non-driving devices; a voltage detector configured to detect a voltage of the electricity accumulator; and a power supply controller configured to control supply of the electric power; the non-driving devices including electric motor devices in an electric motor braking system configured to be electrically driven to assist braking and non-driving electric motor devices other than the electric motor devices in the electric motor braking system; and the power supply controller being configured to inhibit the electric power from being supplied to at least one specified non-driving electric motor device of the non-driving electric motor devices, when the voltage of the electricity accumulator which is detected by the voltage detector is not more than a first predetermined voltage. | 04-07-2011 |
| 20110156425 | PICK-UP STYLE UTILITY VEHICLE WITH EXPANDABLE CARGO BED - A pick-up style utility vehicle according to the present invention has a front seat and a rear seat surrounded by a cabin frame, and a cargo bed in this order from front, a screen shield partitioning the cargo bed and a riding space in front of the cargo bed, and the cargo bed being changeable between an expanded state in which the cargo bed is expanded to the riding space of the rear seat and a non-expanded state not occupying the riding space of the rear seat. The screen shield is supported by the upper portion of the cabin frame and is changeable between an expanded position in which the cargo bed in the expanded state and the riding space in front of the cargo bed are partitioned and a non-expanded position in which the cargo bed in the non-expanded state and the riding space in front of the cargo bed are partitioned without being detached from the cabin frame. | 06-30-2011 |
Takuya Kokawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090200645 | SEMICONDUCTOR ELECTRONIC DEVICE - A semiconductor electronic device comprises a substrate; a buffer layer formed on the substrate, the buffer layer including not less than two layers of composite layer in which a first semiconductor layer formed of a nitride-based compound semiconductor layer having a lattice constant smaller than a lattice constant of the substrate and a thermal expansion coefficient larger than a thermal expansion coefficient of the substrate and a second semiconductor layer formed of a nitride-based compound semiconductor having a lattice constant smaller than a lattice constant of the first semiconductor layer and a thermal expansion coefficient larger than a thermal expansion coefficient of the substrate are alternately laminated; an intermediate layer provided between the substrate and the buffer layer, the intermediate layer being formed of a nitride-based compound semiconductor having a lattice constant smaller than a lattice constant of the first semiconductor layer and a thermal expansion coefficient larger than a thermal expansion coefficient of the substrate; and a semiconductor active layer formed on the buffer layer, the semiconductor active layer being formed of a nitride-based compound semiconductor, wherein: thicknesses of the first semiconductor layers in the buffer layer are non-uniform thereamong, and at least one of the first semiconductor layer has a thickness greater than a critical thickness, the critical thickness being a thickness above which a direction of warp caused by the first semiconductor layer to the substrate is inverted. | 08-13-2009 |
| 20100078678 | SEMICONDUCTOR ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor electronic device comprises a substrate; a buffer layer formed on said substrate, having two or more layers of composite layers in which a first semiconductor layer comprising nitride based compound semiconductor having smaller lattice constant and greater coefficient of thermal expansion than the substrate and a second semiconductor layer comprising nitride based compound semiconductor having smaller lattice constant and greater coefficient of thermal expansion than the first semiconductor layer are alternately laminated; a semiconductor operating layer comprising nitride based compound semiconductor formed on said buffer layer; a dislocation reducing layer comprising nitride based compound semiconductor, formed in a location between a location directly under said buffer layer and inner area of said semiconductor operating layer, and comprising a lower layer area and an upper layer area each having an uneven boundary surface, wherein threading dislocation extending from the lower layer area to the upper layer area is bent at said boundary surface. | 04-01-2010 |
| 20100213577 | SEMICONDUCTOR ELECTRONIC DEVICE AND PROCESS OF MANUFACTURING THE SAME - A semiconductor electronic device comprises a substrate; a buffer layer that comprises composite laminations of which a first semiconductor layer, that is formed of a compound semiconductor of a nitride system, that has a lattice constant to be as smaller than that of such the substrate, and that has a coefficient of thermal expansion to be as larger than that of such the substrate, and a second semiconductor layer that is formed of a compound semiconductor of a nitride system are formed as alternately on to such the substrate; a semiconductor operation layer that is formed of a compound semiconductor of a nitride system and that is formed on to such the buffer layer; and a dislocation reduction layer, which comprises a lower layer region and an upper layer region that are formed at any location at an inner side of such the buffer layer and that comprise an interface of a concave and convex shape therebetween, at which a threading dislocation that draws from such the lower layer region toward such the upper layer region is bending at such the interface, wherein such the second semiconductor layer is comprised of a laminated layers as alternately of a third semiconductor layer that has a lattice constant to be as smaller than that of such the substrate and that has a coefficient of thermal expansion to be as larger than that of such the substrate, and of a fourth semiconductor layer that has a lattice constant to be as smaller than that of such the third semiconductor layer and that has a coefficient of thermal expansion to be as larger than that of such the substrate, and an average of such the lattice constants in the second semiconductor layer is to be smaller than that of such the first semiconductor layer, and an average of such the coefficients of thermal expansion in the second semiconductor layer is to be as larger than that of such the substrate. | 08-26-2010 |
| 20100244101 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - There is provided a method for fabricating a semiconductor device capable of setting carbon concentration within crystal to a desirable value while improving electron mobility. The carbon concentration within a buffer layer is controlled by introducing material gas of hydrocarbon or organic compounds containing carbon such as propane as a dopant in forming the buffer layer by introducing trimethylgallium (TMGa) and ammonium (NH | 09-30-2010 |
| 20110241017 | FIELD EFFECT TRANSISTOR - A field effect transistor includes: a buffer layer that is formed on a substrate; a high resistance layer or a foundation layer that is formed on the buffer layer; a carbon-containing carrier concentration controlling layer that is formed on the high resistance layer or the foundation layer; a carrier traveling layer that is formed on the carrier concentration controlling layer; a carrier supplying layer that is formed on the carrier traveling layer; a recess that is formed from the carrier supplying layer up to a predetermined depth; source/drain electrodes that are formed on the carrier supplying layer with the recess intervening therebetween; a gate insulating film that is formed on the carrier supplying layer so as to cover the recess; and a gate electrode that is formed on the gate insulating film in the recess | 10-06-2011 |
| 20110241088 | FIELD EFFECT TRANSISTOR, METHOD OF MANUFACTURING FIELD EFFECT TRANSISTOR, AND METHOD OF FORMING GROOVE - A field effect transistor includes a high resistance layer on a substrate, a semiconductor operation layer that is formed on the high resistance layer and includes a channel layer that has the carbon concentration of not more than 1×10 | 10-06-2011 |