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Kojima, Ibaraki
Atsuhiko Kojima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090008629 | N-TYPE TRANSISTOR, PRODUCTION METHODS FOR N-TYPE TRANSISTOR AND N-TYPE TRANSISTOR-USE CHANNEL, AND PRODUCTION METHOD OF NANOTUBE STRUCTURE EXHIBITING N-TYPE SEMICONDUCTOR-LIKE CHARACTERISTICS - An object of the present invention is to provide a new n-type transistor, different from the prior art, using a channel having a nanotube-shaped structure, and having n-type semiconductive properties. To realize this, a film of a nitrogenous compound | 01-08-2009 |
Gen Kojima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090205373 | Roll forming manufacturing method and apparatus of plate glass and product thereof - High quality plate glass free from surface defects, and excellent in macro thickness uniformity, flatness, and the like is manufactured by minimizing the part to be wasted. To that end, glass melt | 08-20-2009 |
| 20090235693 | Manufacturing Method of Plate Glass - Proposed is a manufacturing method to continuously fabricate plate glass which comprises supporting at least bottom surface of the traveling glass before stiffening by means of a gas generated from support members and controlling the gravitational effect on the glass to provide the partial displacement and deformation repeatedly while changing the position thereof so as to achieve propagation of overall glass extension. | 09-24-2009 |
Isao Kojima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20100169454 | STORAGE MANAGEMENT SYSTEM, STORAGE MANAGEMENT METHOD, AND STORAGE MEDIUM - A storage management system ( | 07-01-2010 |
Shuuji Kojima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090186073 | Design of Delivery Vehicle Based On Rolling Model - Objects of the present invention are to provide a method for designing an optimum delivery preparation with the use of a convenient experiment and/or assay and to search for the thus produced delivery vehicle. The present invention provides a method for producing a delivery vehicle for achieving the delivery of a desired substance to a desired site, which comprises the steps of: | 07-23-2009 |
Soichi Kojima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20110071278 | ANTIBODIES THAT RECOGNIZE CUTTING EDGE WITHIN THE TGF- BETA ACTIVATION CONTROLLING REGION - It is an object of the present invention to provide antibodies capable of detecting an active TGF-β generation reaction that is specific to pathogenesis, tissues, or isoforms. The present invention provides antibodies against an LAP fragment (or latent TGF-β) generated as a result of generation of active form of human TGF-β1, human TGF-β2 and human TGF-β3. The antibodies are able to specifically recognize respective cutting edges within protease cleavage sites existing in the region from the amino acid residue glycine at position 51 to the amino acid residue arginine at position 110 of human TGF-β1, and corresponding regions of human TGF-β2 and human TGF-β3. | 03-24-2011 |
Souichi Kojima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20080280827 | INHIBITOR OF TGF-BETA ACTIVATION REACTION - The present invention aims to provide a substance(s), especially a peptide(s) capable of inhibiting the TGF-β activation reaction. The present invention provides a peptide consisting of 11 to 50 amino acid residues, which comprises an amino acid sequence Gln-Ile-Leu-Ser-X1-X2-X3-X4-Ala-Ser-Pro (SEQ ID NO: 1) wherein each of X1 to X4 independently represents any given amino acid residue, and X1-X2-X3-X4 is a sequence that is not Lys-Leu-Arg-Leu (SEQ ID NO: 12) and is not cleavable by proteases. | 11-13-2008 |
Yasunori Kojima, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090137129 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method is provided for manufacturing a semiconductor device having a heat-resistant resin film with flip-chip connection structure using a solder bump or a gold bump and an epoxy resin compound laminated thereon, in which adhesiveness is improved particularly after exposure to high temperature and high humidity environments for a long period of time, thereby enhancing the reliability of the semiconductor device. The method, in accordance with the present invention, for manufacturing a semiconductor device having a heat-resistant resin film formed on a semiconductor element and an epoxy resin compound layer laminated thereon, comprises the steps of carrying out a plasma treatment on a surface of the heat-resistant resin film on which the epoxy resin compound layer is laminated using a nitrogen atom-containing gas containing at least one of nitrogen, ammonia, and hydrazine. | 05-28-2009 |