Patent application number | Description | Published |
20120056337 | RFIC CHIP MOUNTING STRUCTURE - An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above. | 03-08-2012 |
20120187198 | WIRELESS COMMUNICATION DEVICE AND METAL ARTICLE - A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal. | 07-26-2012 |
20120190310 | TRANSCEIVER AND RADIO FREQUENCY IDENTIFICATION TAG READER - In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received. | 07-26-2012 |
20120306719 | COMPOSITE PRINTED WIRING BOARD AND WIRELESS COMMUNICATION SYSTEM - A composite printed wiring board includes a parent board and a child board that is mounted on the parent board. A wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board. A second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board. | 12-06-2012 |
20130002404 | PRINTED WIRING BOARD AND WIRELESS COMMUNICATION SYSTEM - A printed wiring board includes a circuit substrate on which sheets are laminated, a wireless IC element provided on the sheet, a radiator provided on the sheet, and a loop-shaped electrode defined by first planar conductors, via hole conductors, and one side of the radiator, coupled to the wireless IC element. The first planar conductors are coupled to the radiator and the second planar conductors by auxiliary electrodes. | 01-03-2013 |
20130087626 | WIRELESS COMMUNICATION DEVICE AND METAL ARTICLE - A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal. | 04-11-2013 |
20130200162 | RFID CHIP PACKAGE AND RFID TAG - An RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element. A reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω. | 08-08-2013 |
20140003007 | FLAT CABLE AND ELECTRONIC APPARATUS | 01-02-2014 |
20140062817 | IMPEDANCE-MATCHING SWITCHING CIRCUIT, ANTENNA DEVICE, HIGH-FREQUENCY POWER AMPLIFYING DEVICE, AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes an impedance-matching switching circuit connected to a feeding circuit, and a radiating element. The impedance-matching switching circuit matches the impedance of the radiating element as a second high frequency circuit element and the impedance of the feeding circuit as a first high frequency circuit element. The impedance-matching switching circuit includes a transformer matching circuit and a series active circuit. The transformer matching circuit matches the real parts of the impedance and matches the imaginary parts of the impedance in the series active circuit. Thus, impedance matching is performed over a wide frequency band at a point at which high frequency circuits or elements having different impedances are connected to each other. | 03-06-2014 |
20140091971 | COMMUNICATION TERMINAL DEVICE AND MANUFACTURING METHOD THEREOF - A communication terminal device includes a printed wiring board disposed in a casing, a feed pattern provided on a main surface of the printed wiring board, a radiation plate including a substantially planar radiation portion substantially perpendicular to the main surface of the printed wiring board and a lead portion connecting the radiation portion to the feed pattern, and a component mounted on the main surface of the printed wiring board to overlap the lead portion when the main surface of the printed wiring board is viewed from above, the component including a conductive material, a magnetic material and/or a dielectric material. The radiation portion is connected to the lead portion at a side spaced away from the main surface of the printed wiring board, and an area of the lead portion is located at a predetermined distance from the main surface of the printed wiring board. | 04-03-2014 |