Patent application number | Description | Published |
20110163876 | Millimeter Wave Imaging Apparatus - A millimeter wave imaging apparatus includes: an imaging device having a plurality of millimeter wave sensors that are arranged in a planar manner and receive millimeter waves radiated from a subject to detect signal levels thereof; an image data generation device that generates image data of the subject based on an output from each of the millimeter wave sensors constituting the imaging device; and a case that has a placement surface on which the subject can be placed and which permits transmission of the millimeter waves. The imaging device is arranged below the placement surface of the case, so that the millimeter waves, which are radiated from a bottom part of the subject placed on the placement surface of the case, are received by the plurality of millimeter wave sensors. | 07-07-2011 |
20110234783 | MILLIMETER WAVE IMAGING APPARATUS - A millimeter wave imaging apparatus includes: an imaging device provided with a millimeter wave sensor that receives millimeter waves radiated from a subject; an image data generation device that generates image data of the subject based on an output from the millimeter wave sensor constituting the imaging device; a storage device that stores inspection target object data indicating, with respect to each object to be an inspection target object, a shape of the object and a size of the object relative to the subject; a detection device that compares the inspection target object data stored by the storage device and the image data generated by the image data generation device, thereby to detect an inspection target object hidden in the subject; and an output device that outputs results of detection by the detection device. | 09-29-2011 |
20110260905 | Millimeter Wave Imaging Apparatus - A millimeter wave imaging apparatus includes: an imaging device including a plurality of millimeter wave sensors that are arranged in a planar manner and receive millimeter waves radiated from a subject to detect signal levels thereof; a temperature sensor that detects a temperature of the imaging device; a storage device that stores, with respect to the each of the millimeter wave sensors, temperature characteristics data indicating a relationship between the temperature detected by the temperature sensor and the output from the millimeter wave sensor; and an image data generation device that obtains a deviation of an output from the each of the millimeter wave sensors from reference temperature characteristics based on the temperature detected by the temperature sensor and the temperature characteristics data stored by the storage device, corrects the output from the each of the millimeter wave sensors based on the deviation, and thereby generates the image data. | 10-27-2011 |
20120075479 | Millimeter Wave Imaging Apparatus and Program - There is provided a millimeter wave imaging apparatus including: a lens antenna forming a subject image based on the millimeter waves from a subject; a line sensor including a plurality of millimeter wave sensors and capturing an image for one line of a predetermined width of the whole subject; a reflector having a reflecting surface reflecting millimeter waves; a reflection angle change device changing an angle of the reflecting surface; an image generation device generating an image of the whole subject from the respective subject images for one line; a millimeter wave radiation unit radiating a reference millimeter wave; a correction value setting device setting correction values with respect to the detected values by the millimeter wave sensors based on the millimeter wave from the millimeter wave radiation unit; and a detected value correction device correcting the detected values by the millimeter wave sensors with the correction values. | 03-29-2012 |
Patent application number | Description | Published |
20130122688 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING - An object of the present invention is to provide a pressure-sensitive adhesive sheet for dicing that is capable of preventing scratching of an adsorption stage when laser-scribing a semiconductor wafer. Provided is a pressure-sensitive adhesive sheet for dicing having a base and a pressure-sensitive adhesive layer provided on the base, in which 0.02 to 5 parts by weight of an ultraviolet absorber is contained in the pressure-sensitive adhesive layer with respect to 100 parts by weight of resin solid content, and in which the light transmittance at a wavelength of 355 nm of the pressure-sensitive adhesive sheet for dicing is 30% to 80%. | 05-16-2013 |
20130149842 | LAMINATED SHEET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE LAMINATED SHEET - The present invention provides a laminated sheet that can prevent the decrease in adhering strength of a resin composition layer and the deterioration in electrical reliability and in which a back grinding tape can be peeled from a plurality of semiconductor elements collectively after dicing. The laminated sheet has a back grinding tape in which a pressure-sensitive adhesive layer is formed on a base, and a resin composition layer that is provided on the pressure-sensitive adhesive layer of the back grinding tape, wherein the tensile modulus of the pressure-sensitive adhesive layer at 23° C. is 0.1 to 5.0 MPa, and the T-peeling strength between the pressure-sensitive adhesive layer and the resin composition layer is 0.1 to 5 N/20 mm at 23° C. and 300 mm/min. | 06-13-2013 |
20140162434 | DICING TAPE INTEGRATED ADHESIVE SHEET, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING DICING TAPE INTEGRATED ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE - A dicing tape integrated adhesive sheet including a substrate, a dicing tape in which a pressure-sensitive adhesive layer is laminated on the substrate, and an adhesive sheet formed on the pressure-sensitive adhesive layer, wherein a peeling force between the pressure-sensitive adhesive layer and the adhesive sheet is 0.02 to 0.5 N/20 mm obtained with a peeling test at a peeling rate of 10 m/minute and a peeling angle of 150°, and an absolute value of a peeling electrification voltage is 0.5 kV or less when the pressure-sensitive adhesive layer and the adhesive sheet are peeled off under conditions of the peeling test. | 06-12-2014 |