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Koichiro Adachi, Musashino JP

Koichiro Adachi, Musashino JP

Patent application numberDescriptionPublished
20080266638SEMICONDUCTOR LASER AND OPTICAL MODULE - In a horizontal cavity surface emitted laser, there is provided a device structure that is capable of obtaining a circular narrow-divergence emitted beam that is high in the optical coupling efficiency with a fiber. As a first means, there is provided a horizontal cavity surface emitting laser having a structure in which the plane mirror that is inclined by 45° and the bottom lens of the oval configuration are integrally structured. As a second means, there is provided a horizontal cavity surface emitting laser in which the mirror having the columnar front surface configuration inclined by 45° and the bottom lens of the columnar front surface configuration are integrally structured. Since the horizontal component and the vertical component of the laser beam can be shaped, independently, through the above means. As a result, it is possible to obtain the circular narrow-divergence emitted beam.10-30-2008
20090129421SEMICONDUCTOR LASER DIODE - In an edge emitting laser having a window region with a ridge-waveguide structure, particularly, in a short cavity type of a laser operated with a low current, there has been a problem of its operating current being increased due to current leakage of the window portion. To solve this problem, in the window region, between an n-type substrate and a p-type cladding layer, a semi-insulating semiconductor layer into which Ru is doped is inserted. Alternatively, a stacked structure of a Ru-doped layer and a Fe-doped layer is introduced.05-21-2009
20100142885OPTICAL MODULE - The first and second optical waveguide device portions are optically coupled by 45-degree total reflection mirrors integrally formed in the respective device portions. The light generated by the first optical waveguide device portion is bent upward by the total reflection mirror of the first optical waveguide device portion. The light is totally reflected by the 45-degree total reflection mirror of the second optical waveguide device portion, and coupled to the second optical waveguide device portion. The first optical waveguide device portion has a lens device for focusing the emitted light onto a light emitting portion. The second optical waveguide device portion has a lens device for focusing the incident light onto a light receiving portion.06-10-2010
20100215313OPTICAL INTERCONNECTION ASSEMBLED CIRCUIT - An optical interconnection assembled circuit capable of reducing the number of parts and components, as well as the number of manufacturing processes and capable of mounting those parts and components at a high density in an optical module, thereby realizing a low price. The optical interconnection assembled circuit includes a substrate including plural optical waveguides having partial tapered surfaces respectively, as well as an optical element array facing each of the tapered surfaces. In the optical interconnection assembled circuit, the tapered surfaces and the optical element array are fastened so that they face each other and the optical elements of the optical element array are staggered in disposition.08-26-2010
20100247043OPTICAL MODULE AND WAVELENGTH DIVISION MULTIPLEXING OPTICAL MODULE - An optical module is formed by sticking the optical element mounting substrate and the sealing substrate together, then by sealing the stuck body. The optical mounting substrate includes an optical element on its top surface and it is used to guide electrical signals to its back side through a through-via hole provided in itself. The sealing substrate includes a lens at its back side and a recessed part used to hold an optical fiber at its front side.09-30-2010
20100265983SURFACE EMITTING LASER MODULE AND VERTICAL ILLUMINATED PHOTODIODE MODULE - In order to provide a compact optical module permitting highly efficient optical coupling and having components thereof highly densely packaged, a light emitting diode that is included in the optical module and emits light in a vertical direction with respect to a principal surface of a semiconductor substrate is provided with a lens integrated into a light emitting region, and a retaining section integrated to surround the light emitting region. Accordingly, readiness in alignment of the light emitting diode and an optical fiber, which guides light emitted from the light emitting diode, with each other is upgraded. Eventually, the compact optical module permitting highly efficient optical coupling and having components thereof highly densely packaged can be provided.10-21-2010
20100278482Optical Transceiver Module - The optical module includes an optical device mounting substrate 11-04-2010
20110026878Optical I/O Array Module and Its Fabrication Method - In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.02-03-2011

Patent applications by Koichiro Adachi, Musashino JP